JP7835348B2 - 伸縮性デバイス - Google Patents

伸縮性デバイス

Info

Publication number
JP7835348B2
JP7835348B2 JP2025524056A JP2025524056A JP7835348B2 JP 7835348 B2 JP7835348 B2 JP 7835348B2 JP 2025524056 A JP2025524056 A JP 2025524056A JP 2025524056 A JP2025524056 A JP 2025524056A JP 7835348 B2 JP7835348 B2 JP 7835348B2
Authority
JP
Japan
Prior art keywords
stretchable
electrode portion
view
wiring
plan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2025524056A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024247904A5 (https=
JPWO2024247904A1 (https=
Inventor
幸治 吉田
遼 浅井
勇人 勝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2024247904A1 publication Critical patent/JPWO2024247904A1/ja
Publication of JPWO2024247904A5 publication Critical patent/JPWO2024247904A5/ja
Application granted granted Critical
Publication of JP7835348B2 publication Critical patent/JP7835348B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
JP2025524056A 2023-05-31 2024-05-24 伸縮性デバイス Active JP7835348B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023090216 2023-05-31
JP2023090216 2023-05-31
PCT/JP2024/019140 WO2024247904A1 (ja) 2023-05-31 2024-05-24 伸縮性デバイス

Publications (3)

Publication Number Publication Date
JPWO2024247904A1 JPWO2024247904A1 (https=) 2024-12-05
JPWO2024247904A5 JPWO2024247904A5 (https=) 2025-10-23
JP7835348B2 true JP7835348B2 (ja) 2026-03-25

Family

ID=93657546

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025524056A Active JP7835348B2 (ja) 2023-05-31 2024-05-24 伸縮性デバイス

Country Status (4)

Country Link
US (1) US20260052628A1 (https=)
JP (1) JP7835348B2 (https=)
DE (1) DE112024001499T5 (https=)
WO (1) WO2024247904A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017113088A (ja) 2015-12-21 2017-06-29 パナソニックＩｐマネジメント株式会社 生体センサー・デバイス
WO2018199084A1 (ja) 2017-04-28 2018-11-01 株式会社村田製作所 配線基板およびその製造方法
WO2023042491A1 (ja) 2021-09-16 2023-03-23 パナソニックＩｐマネジメント株式会社 伸縮性回路基板の製造方法、金属張積層板、樹脂付き金属箔、伸縮性回路基板及び伸縮性回路実装品

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0810792B2 (ja) * 1991-05-10 1996-01-31 株式会社日立製作所 多層配線基板の製造方法
JP2927048B2 (ja) * 1991-05-13 1999-07-28 日本電気株式会社 多層配線セラミック基板
JPH1154916A (ja) * 1997-08-06 1999-02-26 Noritake Co Ltd 厚膜多層回路基板
JP2002246752A (ja) * 2001-02-19 2002-08-30 Murata Mfg Co Ltd セラミック多層基板のビアホール構造
JP7360089B2 (ja) 2019-11-13 2023-10-12 株式会社オートネットワーク技術研究所 電池配線モジュール
JP7422360B2 (ja) * 2020-03-02 2024-01-26 株式会社デンソー 半導体パッケージ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017113088A (ja) 2015-12-21 2017-06-29 パナソニックＩｐマネジメント株式会社 生体センサー・デバイス
WO2018199084A1 (ja) 2017-04-28 2018-11-01 株式会社村田製作所 配線基板およびその製造方法
WO2023042491A1 (ja) 2021-09-16 2023-03-23 パナソニックＩｐマネジメント株式会社 伸縮性回路基板の製造方法、金属張積層板、樹脂付き金属箔、伸縮性回路基板及び伸縮性回路実装品

Also Published As

Publication number Publication date
DE112024001499T5 (de) 2026-02-26
JPWO2024247904A1 (https=) 2024-12-05
US20260052628A1 (en) 2026-02-19
WO2024247904A1 (ja) 2024-12-05

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