JPWO2024247904A1 - - Google Patents

Info

Publication number
JPWO2024247904A1
JPWO2024247904A1 JP2025524056A JP2025524056A JPWO2024247904A1 JP WO2024247904 A1 JPWO2024247904 A1 JP WO2024247904A1 JP 2025524056 A JP2025524056 A JP 2025524056A JP 2025524056 A JP2025524056 A JP 2025524056A JP WO2024247904 A1 JPWO2024247904 A1 JP WO2024247904A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2025524056A
Other languages
Japanese (ja)
Other versions
JPWO2024247904A5 (https=
JP7835348B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024247904A1 publication Critical patent/JPWO2024247904A1/ja
Publication of JPWO2024247904A5 publication Critical patent/JPWO2024247904A5/ja
Application granted granted Critical
Publication of JP7835348B2 publication Critical patent/JP7835348B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
JP2025524056A 2023-05-31 2024-05-24 伸縮性デバイス Active JP7835348B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023090216 2023-05-31
JP2023090216 2023-05-31
PCT/JP2024/019140 WO2024247904A1 (ja) 2023-05-31 2024-05-24 伸縮性デバイス

Publications (3)

Publication Number Publication Date
JPWO2024247904A1 true JPWO2024247904A1 (https=) 2024-12-05
JPWO2024247904A5 JPWO2024247904A5 (https=) 2025-10-23
JP7835348B2 JP7835348B2 (ja) 2026-03-25

Family

ID=93657546

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025524056A Active JP7835348B2 (ja) 2023-05-31 2024-05-24 伸縮性デバイス

Country Status (4)

Country Link
US (1) US20260052628A1 (https=)
JP (1) JP7835348B2 (https=)
DE (1) DE112024001499T5 (https=)
WO (1) WO2024247904A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017113088A (ja) * 2015-12-21 2017-06-29 パナソニックＩｐマネジメント株式会社 生体センサー・デバイス
WO2018199084A1 (ja) * 2017-04-28 2018-11-01 株式会社村田製作所 配線基板およびその製造方法
WO2023042491A1 (ja) * 2021-09-16 2023-03-23 パナソニックＩｐマネジメント株式会社 伸縮性回路基板の製造方法、金属張積層板、樹脂付き金属箔、伸縮性回路基板及び伸縮性回路実装品

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0810792B2 (ja) * 1991-05-10 1996-01-31 株式会社日立製作所 多層配線基板の製造方法
JP2927048B2 (ja) * 1991-05-13 1999-07-28 日本電気株式会社 多層配線セラミック基板
JPH1154916A (ja) * 1997-08-06 1999-02-26 Noritake Co Ltd 厚膜多層回路基板
JP2002246752A (ja) * 2001-02-19 2002-08-30 Murata Mfg Co Ltd セラミック多層基板のビアホール構造
JP7360089B2 (ja) 2019-11-13 2023-10-12 株式会社オートネットワーク技術研究所 電池配線モジュール
JP7422360B2 (ja) * 2020-03-02 2024-01-26 株式会社デンソー 半導体パッケージ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017113088A (ja) * 2015-12-21 2017-06-29 パナソニックＩｐマネジメント株式会社 生体センサー・デバイス
WO2018199084A1 (ja) * 2017-04-28 2018-11-01 株式会社村田製作所 配線基板およびその製造方法
WO2023042491A1 (ja) * 2021-09-16 2023-03-23 パナソニックＩｐマネジメント株式会社 伸縮性回路基板の製造方法、金属張積層板、樹脂付き金属箔、伸縮性回路基板及び伸縮性回路実装品

Also Published As

Publication number Publication date
DE112024001499T5 (de) 2026-02-26
US20260052628A1 (en) 2026-02-19
WO2024247904A1 (ja) 2024-12-05
JP7835348B2 (ja) 2026-03-25

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