JP7827689B2 - 転写フィルム及び導体パターンの製造方法 - Google Patents

転写フィルム及び導体パターンの製造方法

Info

Publication number
JP7827689B2
JP7827689B2 JP2023502341A JP2023502341A JP7827689B2 JP 7827689 B2 JP7827689 B2 JP 7827689B2 JP 2023502341 A JP2023502341 A JP 2023502341A JP 2023502341 A JP2023502341 A JP 2023502341A JP 7827689 B2 JP7827689 B2 JP 7827689B2
Authority
JP
Japan
Prior art keywords
layer
transfer
mass
temporary support
photosensitive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023502341A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022181456A1 (https=
Inventor
洋行 海鉾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of JPWO2022181456A1 publication Critical patent/JPWO2022181456A1/ja
Application granted granted Critical
Publication of JP7827689B2 publication Critical patent/JP7827689B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2023502341A 2021-02-26 2022-02-17 転写フィルム及び導体パターンの製造方法 Active JP7827689B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021030224 2021-02-26
JP2021030224 2021-02-26
PCT/JP2022/006482 WO2022181456A1 (ja) 2021-02-26 2022-02-17 転写フィルム及び導体パターンの製造方法

Publications (2)

Publication Number Publication Date
JPWO2022181456A1 JPWO2022181456A1 (https=) 2022-09-01
JP7827689B2 true JP7827689B2 (ja) 2026-03-10

Family

ID=83048931

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023502341A Active JP7827689B2 (ja) 2021-02-26 2022-02-17 転写フィルム及び導体パターンの製造方法

Country Status (4)

Country Link
JP (1) JP7827689B2 (https=)
CN (1) CN116917122A (https=)
TW (1) TW202302348A (https=)
WO (1) WO2022181456A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202502548A (zh) * 2023-03-24 2025-01-16 日商富士軟片股份有限公司 轉印膜、積層體之製造方法、積層體

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003107719A (ja) 2001-09-28 2003-04-09 Fuji Photo Film Co Ltd 感光性転写材料、フォトマスク材料、並びにフォトマスク及びその製造方法
JP2007293006A (ja) 2006-04-25 2007-11-08 Fujifilm Corp 感光性樹脂転写材料、カラーフィルターおよびその製造方法、ならびに画像表示装置
WO2013002065A1 (ja) 2011-06-30 2013-01-03 東レ株式会社 積層フィルムおよびそれを用いた成型転写箔
JP2018161829A (ja) 2017-03-27 2018-10-18 東レフィルム加工株式会社 感光性導電層転写用離型フィルム
WO2020203502A1 (ja) 2019-04-05 2020-10-08 富士フイルム株式会社 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法、及び、タッチパネルの製造方法
WO2021125079A1 (ja) 2019-12-20 2021-06-24 富士フイルム株式会社 転写フィルム、積層体の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10123704A (ja) * 1996-10-21 1998-05-15 Konica Corp 画像形成材料
JP2007293231A (ja) * 2006-03-28 2007-11-08 Fujifilm Corp 感光性転写材料、隔壁及びその形成方法、光学素子及びその製造方法、並びに表示装置
AU2012301801B2 (en) * 2011-08-31 2016-02-04 Avery Dennison Corporation Self adhesive film and method to minimize or eliminate print defects in such film
WO2020079992A1 (ja) * 2018-10-18 2020-04-23 富士フイルム株式会社 転写フィルム、硬化膜の製造方法、積層体の製造方法、及び、タッチパネルの製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003107719A (ja) 2001-09-28 2003-04-09 Fuji Photo Film Co Ltd 感光性転写材料、フォトマスク材料、並びにフォトマスク及びその製造方法
JP2007293006A (ja) 2006-04-25 2007-11-08 Fujifilm Corp 感光性樹脂転写材料、カラーフィルターおよびその製造方法、ならびに画像表示装置
WO2013002065A1 (ja) 2011-06-30 2013-01-03 東レ株式会社 積層フィルムおよびそれを用いた成型転写箔
JP2018161829A (ja) 2017-03-27 2018-10-18 東レフィルム加工株式会社 感光性導電層転写用離型フィルム
WO2020203502A1 (ja) 2019-04-05 2020-10-08 富士フイルム株式会社 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法、及び、タッチパネルの製造方法
WO2021125079A1 (ja) 2019-12-20 2021-06-24 富士フイルム株式会社 転写フィルム、積層体の製造方法

Also Published As

Publication number Publication date
CN116917122A (zh) 2023-10-20
JPWO2022181456A1 (https=) 2022-09-01
WO2022181456A1 (ja) 2022-09-01
TW202302348A (zh) 2023-01-16

Similar Documents

Publication Publication Date Title
JP7555396B2 (ja) 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法、及び感光性転写材料用仮支持体
JP2026009352A (ja) 感光性転写材料
JP2025188224A (ja) 積層体の製造方法、回路配線基板の製造方法、転写フィルム
JP7827689B2 (ja) 転写フィルム及び導体パターンの製造方法
JP7836291B2 (ja) 積層体の製造方法、回路配線の製造方法
JP7479487B2 (ja) 感光性転写材料、樹脂パターンの製造方法、エッチング方法、及び、電子デバイスの製造方法
JP2023097347A (ja) 蒸着マスクの製造方法
WO2022181611A1 (ja) 導体パターンを有する積層体の製造方法
WO2022138468A1 (ja) 転写材料及び積層体の製造方法
JP2023097008A (ja) 蒸着マスク製造用感光性転写材料、及び、蒸着マスクの製造方法
JP2023035028A (ja) 蒸着マスク形成用転写フィルム及び蒸着マスクの製造方法
JP7740936B2 (ja) 蒸着マスク形成用転写フィルム、蒸着マスクの製造方法及び蒸着マスク
TWI921429B (zh) 轉印材料及積層體之製造方法
JP7759347B2 (ja) 積層体の製造方法、回路配線の製造方法、転写フィルム
JP7844123B2 (ja) 感光性組成物、転写フィルム及び導体パターンを有する積層体の製造方法
TWI904311B (zh) 轉印材料及積層體之製造方法
JP7715717B2 (ja) 感光性転写材料及び樹脂パターンの製造方法
WO2022181455A1 (ja) 転写フィルム及び導体パターンの製造方法
JP2023020993A (ja) 透明導電パターンを含む積層体の製造方法、および、タッチパネルの製造方法
TW202307026A (zh) 轉印膜及具有導體圖案之積層體之製造方法
JP2025044007A (ja) 感光性転写材料及びその製造方法
TW202311872A (zh) 具有導體圖案之積層體之製造方法、轉印膜
CN115685701A (zh) 转印膜、具有导体图案的层叠体的制造方法、感光性组合物
JP2023035807A (ja) 導体パターンを有する積層体の製造方法及び転写フィルム
TW202311049A (zh) 轉印膜、具有導體圖案之積層體之製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20241107

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20260203

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20260226

R150 Certificate of patent or registration of utility model

Ref document number: 7827689

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150