CN116917122A - 转印膜及导体图案的制造方法 - Google Patents

转印膜及导体图案的制造方法 Download PDF

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Publication number
CN116917122A
CN116917122A CN202280014227.4A CN202280014227A CN116917122A CN 116917122 A CN116917122 A CN 116917122A CN 202280014227 A CN202280014227 A CN 202280014227A CN 116917122 A CN116917122 A CN 116917122A
Authority
CN
China
Prior art keywords
layer
mass
transfer
temporary support
photosensitive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280014227.4A
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English (en)
Chinese (zh)
Inventor
海鉾洋行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of CN116917122A publication Critical patent/CN116917122A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN202280014227.4A 2021-02-26 2022-02-17 转印膜及导体图案的制造方法 Pending CN116917122A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021030224 2021-02-26
JP2021-030224 2021-02-26
PCT/JP2022/006482 WO2022181456A1 (ja) 2021-02-26 2022-02-17 転写フィルム及び導体パターンの製造方法

Publications (1)

Publication Number Publication Date
CN116917122A true CN116917122A (zh) 2023-10-20

Family

ID=83048931

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280014227.4A Pending CN116917122A (zh) 2021-02-26 2022-02-17 转印膜及导体图案的制造方法

Country Status (4)

Country Link
JP (1) JP7827689B2 (https=)
CN (1) CN116917122A (https=)
TW (1) TW202302348A (https=)
WO (1) WO2022181456A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202502548A (zh) * 2023-03-24 2025-01-16 日商富士軟片股份有限公司 轉印膜、積層體之製造方法、積層體

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10123704A (ja) * 1996-10-21 1998-05-15 Konica Corp 画像形成材料
JP2007293231A (ja) * 2006-03-28 2007-11-08 Fujifilm Corp 感光性転写材料、隔壁及びその形成方法、光学素子及びその製造方法、並びに表示装置
CN103608176A (zh) * 2011-06-30 2014-02-26 东丽株式会社 叠层膜及使用了该叠层膜的成型转印箔
CN103906820A (zh) * 2011-08-31 2014-07-02 艾利丹尼森公司 自粘型膜及最小化或消除此种膜中的印刷缺陷的方法
JP2018161829A (ja) * 2017-03-27 2018-10-18 東レフィルム加工株式会社 感光性導電層転写用離型フィルム
WO2020079992A1 (ja) * 2018-10-18 2020-04-23 富士フイルム株式会社 転写フィルム、硬化膜の製造方法、積層体の製造方法、及び、タッチパネルの製造方法
WO2020203502A1 (ja) * 2019-04-05 2020-10-08 富士フイルム株式会社 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法、及び、タッチパネルの製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003107719A (ja) 2001-09-28 2003-04-09 Fuji Photo Film Co Ltd 感光性転写材料、フォトマスク材料、並びにフォトマスク及びその製造方法
JP2007293006A (ja) 2006-04-25 2007-11-08 Fujifilm Corp 感光性樹脂転写材料、カラーフィルターおよびその製造方法、ならびに画像表示装置
JPWO2021125079A1 (https=) 2019-12-20 2021-06-24

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10123704A (ja) * 1996-10-21 1998-05-15 Konica Corp 画像形成材料
JP2007293231A (ja) * 2006-03-28 2007-11-08 Fujifilm Corp 感光性転写材料、隔壁及びその形成方法、光学素子及びその製造方法、並びに表示装置
CN103608176A (zh) * 2011-06-30 2014-02-26 东丽株式会社 叠层膜及使用了该叠层膜的成型转印箔
CN103906820A (zh) * 2011-08-31 2014-07-02 艾利丹尼森公司 自粘型膜及最小化或消除此种膜中的印刷缺陷的方法
JP2018161829A (ja) * 2017-03-27 2018-10-18 東レフィルム加工株式会社 感光性導電層転写用離型フィルム
WO2020079992A1 (ja) * 2018-10-18 2020-04-23 富士フイルム株式会社 転写フィルム、硬化膜の製造方法、積層体の製造方法、及び、タッチパネルの製造方法
WO2020203502A1 (ja) * 2019-04-05 2020-10-08 富士フイルム株式会社 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法、及び、タッチパネルの製造方法

Also Published As

Publication number Publication date
JP7827689B2 (ja) 2026-03-10
JPWO2022181456A1 (https=) 2022-09-01
WO2022181456A1 (ja) 2022-09-01
TW202302348A (zh) 2023-01-16

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