JP7824406B2 - 電子機器 - Google Patents

電子機器

Info

Publication number
JP7824406B2
JP7824406B2 JP2024514823A JP2024514823A JP7824406B2 JP 7824406 B2 JP7824406 B2 JP 7824406B2 JP 2024514823 A JP2024514823 A JP 2024514823A JP 2024514823 A JP2024514823 A JP 2024514823A JP 7824406 B2 JP7824406 B2 JP 7824406B2
Authority
JP
Japan
Prior art keywords
circuit board
connector
storage medium
shield
positioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024514823A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023199605A1 (https=
Inventor
真也 土田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Interactive Entertainment Inc
Original Assignee
Sony Interactive Entertainment Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Interactive Entertainment Inc filed Critical Sony Interactive Entertainment Inc
Publication of JPWO2023199605A1 publication Critical patent/JPWO2023199605A1/ja
Application granted granted Critical
Publication of JP7824406B2 publication Critical patent/JP7824406B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/181Enclosures
    • G06F1/182Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/183Internal mounting support structures, e.g. for supporting printed circuit boards
    • G06F1/187Mounting of fixed or removable disk drives
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/183Internal mounting support structures, e.g. for supporting printed circuit boards
    • G06F1/185Mounting of expansion boards
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/203Cooling means for portable computers, e.g. for laptops
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1422Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427Housings

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP2024514823A 2022-04-11 2023-02-21 電子機器 Active JP7824406B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022065376 2022-04-11
JP2022065376 2022-04-11
PCT/JP2023/006288 WO2023199605A1 (ja) 2022-04-11 2023-02-21 電子機器

Publications (2)

Publication Number Publication Date
JPWO2023199605A1 JPWO2023199605A1 (https=) 2023-10-19
JP7824406B2 true JP7824406B2 (ja) 2026-03-04

Family

ID=88329226

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2024514823A Active JP7824406B2 (ja) 2022-04-11 2023-02-21 電子機器
JP2024514883A Active JP7732086B2 (ja) 2022-04-11 2023-03-30 電子機器

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024514883A Active JP7732086B2 (ja) 2022-04-11 2023-03-30 電子機器

Country Status (5)

Country Link
US (1) US20250298446A1 (https=)
EP (2) EP4510796A4 (https=)
JP (2) JP7824406B2 (https=)
CN (2) CN118872397A (https=)
WO (2) WO2023199605A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230112396A (ko) * 2022-01-20 2023-07-27 에스케이하이닉스 주식회사 바텀 플래인의 길이를 변경하여 전자기 간섭을 회피하기 위한 솔리드 스테이트 드라이브
TWI901553B (zh) * 2025-04-18 2025-10-11 雙鴻科技股份有限公司 散熱模組

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109673124A (zh) 2017-10-17 2019-04-23 鸿富锦精密工业(武汉)有限公司 电路板及电子设备
JP2021158287A (ja) 2020-03-27 2021-10-07 株式会社ソニー・インタラクティブエンタテインメント 電子機器及びその外装パネル

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01273392A (ja) * 1988-04-26 1989-11-01 Canon Inc 電子機器
JP2553438Y2 (ja) * 1989-04-27 1997-11-05 日本エー・エム・ピー 株式会社 メモリカードコネクタ
US20040255313A1 (en) * 2003-06-10 2004-12-16 Kaczeus Steven L. Protecting a data storage device
TWM561980U (zh) * 2017-12-05 2018-06-11 技嘉科技股份有限公司 具有散熱孔的主電路板及其電子裝置
EP4121835A4 (en) * 2020-03-19 2024-03-27 Nexark, Inc. Enclosing a portable solid state device
WO2021193622A1 (ja) 2020-03-27 2021-09-30 株式会社ソニー・インタラクティブエンタテインメント 電子機器
US12028975B2 (en) * 2020-11-09 2024-07-02 Samsung Electronics Co., Ltd. Electronic device including shielding member
CN217306766U (zh) 2022-02-23 2022-08-26 鸿富锦精密工业(武汉)有限公司 Ssd卡转接支架及电路板组件

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109673124A (zh) 2017-10-17 2019-04-23 鸿富锦精密工业(武汉)有限公司 电路板及电子设备
JP2021158287A (ja) 2020-03-27 2021-10-07 株式会社ソニー・インタラクティブエンタテインメント 電子機器及びその外装パネル

Also Published As

Publication number Publication date
US20250298446A1 (en) 2025-09-25
CN118872397A (zh) 2024-10-29
EP4510796A4 (en) 2026-02-25
EP4510800A4 (en) 2026-04-08
WO2023199605A1 (ja) 2023-10-19
JP7732086B2 (ja) 2025-09-01
EP4510796A1 (en) 2025-02-19
EP4510800A1 (en) 2025-02-19
JPWO2023199605A1 (https=) 2023-10-19
CN118901289A (zh) 2024-11-05
WO2023199752A1 (ja) 2023-10-19
JPWO2023199752A1 (https=) 2023-10-19

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