JPWO2023199752A1 - - Google Patents

Info

Publication number
JPWO2023199752A1
JPWO2023199752A1 JP2024514883A JP2024514883A JPWO2023199752A1 JP WO2023199752 A1 JPWO2023199752 A1 JP WO2023199752A1 JP 2024514883 A JP2024514883 A JP 2024514883A JP 2024514883 A JP2024514883 A JP 2024514883A JP WO2023199752 A1 JPWO2023199752 A1 JP WO2023199752A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024514883A
Other languages
Japanese (ja)
Other versions
JP7732086B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023199752A1 publication Critical patent/JPWO2023199752A1/ja
Application granted granted Critical
Publication of JP7732086B2 publication Critical patent/JP7732086B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for supporting printed circuit boards
    • G06F1/187—Mounting of fixed or removable disk drives
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for supporting printed circuit boards
    • G06F1/185—Mounting of expansion boards
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP2024514883A 2022-04-11 2023-03-30 電子機器 Active JP7732086B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022065376 2022-04-11
JP2022065376 2022-04-11
PCT/JP2023/013180 WO2023199752A1 (ja) 2022-04-11 2023-03-30 電子機器

Publications (2)

Publication Number Publication Date
JPWO2023199752A1 true JPWO2023199752A1 (https=) 2023-10-19
JP7732086B2 JP7732086B2 (ja) 2025-09-01

Family

ID=88329226

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2024514823A Active JP7824406B2 (ja) 2022-04-11 2023-02-21 電子機器
JP2024514883A Active JP7732086B2 (ja) 2022-04-11 2023-03-30 電子機器

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2024514823A Active JP7824406B2 (ja) 2022-04-11 2023-02-21 電子機器

Country Status (5)

Country Link
US (1) US20250298446A1 (https=)
EP (2) EP4510796A4 (https=)
JP (2) JP7824406B2 (https=)
CN (2) CN118872397A (https=)
WO (2) WO2023199605A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230112396A (ko) * 2022-01-20 2023-07-27 에스케이하이닉스 주식회사 바텀 플래인의 길이를 변경하여 전자기 간섭을 회피하기 위한 솔리드 스테이트 드라이브
TWI901553B (zh) * 2025-04-18 2025-10-11 雙鴻科技股份有限公司 散熱模組

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01273392A (ja) * 1988-04-26 1989-11-01 Canon Inc 電子機器
JPH02140779U (https=) * 1989-04-27 1990-11-26
CN109673124A (zh) * 2017-10-17 2019-04-23 鸿富锦精密工业(武汉)有限公司 电路板及电子设备
JP2021158287A (ja) * 2020-03-27 2021-10-07 株式会社ソニー・インタラクティブエンタテインメント 電子機器及びその外装パネル
US20230269897A1 (en) * 2022-02-23 2023-08-24 Hong Fu Jin Precision Industry (Wuhan) Co., Ltd. Ssd card adapter bracket and circuit board assembly

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040255313A1 (en) * 2003-06-10 2004-12-16 Kaczeus Steven L. Protecting a data storage device
TWM561980U (zh) * 2017-12-05 2018-06-11 技嘉科技股份有限公司 具有散熱孔的主電路板及其電子裝置
EP4121835A4 (en) * 2020-03-19 2024-03-27 Nexark, Inc. Enclosing a portable solid state device
WO2021193622A1 (ja) 2020-03-27 2021-09-30 株式会社ソニー・インタラクティブエンタテインメント 電子機器
US12028975B2 (en) * 2020-11-09 2024-07-02 Samsung Electronics Co., Ltd. Electronic device including shielding member

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01273392A (ja) * 1988-04-26 1989-11-01 Canon Inc 電子機器
JPH02140779U (https=) * 1989-04-27 1990-11-26
CN109673124A (zh) * 2017-10-17 2019-04-23 鸿富锦精密工业(武汉)有限公司 电路板及电子设备
JP2021158287A (ja) * 2020-03-27 2021-10-07 株式会社ソニー・インタラクティブエンタテインメント 電子機器及びその外装パネル
US20230269897A1 (en) * 2022-02-23 2023-08-24 Hong Fu Jin Precision Industry (Wuhan) Co., Ltd. Ssd card adapter bracket and circuit board assembly

Also Published As

Publication number Publication date
US20250298446A1 (en) 2025-09-25
CN118872397A (zh) 2024-10-29
EP4510796A4 (en) 2026-02-25
EP4510800A4 (en) 2026-04-08
WO2023199605A1 (ja) 2023-10-19
JP7732086B2 (ja) 2025-09-01
EP4510796A1 (en) 2025-02-19
JP7824406B2 (ja) 2026-03-04
EP4510800A1 (en) 2025-02-19
JPWO2023199605A1 (https=) 2023-10-19
CN118901289A (zh) 2024-11-05
WO2023199752A1 (ja) 2023-10-19

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