CN118872397A - 电子设备 - Google Patents

电子设备 Download PDF

Info

Publication number
CN118872397A
CN118872397A CN202380026658.7A CN202380026658A CN118872397A CN 118872397 A CN118872397 A CN 118872397A CN 202380026658 A CN202380026658 A CN 202380026658A CN 118872397 A CN118872397 A CN 118872397A
Authority
CN
China
Prior art keywords
circuit board
connector
storage medium
shield
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380026658.7A
Other languages
English (en)
Chinese (zh)
Inventor
土田真也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Interactive Entertainment Inc
Original Assignee
Sony Interactive Entertainment Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Interactive Entertainment Inc filed Critical Sony Interactive Entertainment Inc
Publication of CN118872397A publication Critical patent/CN118872397A/zh
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for supporting printed circuit boards
    • G06F1/187—Mounting of fixed or removable disk drives
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for supporting printed circuit boards
    • G06F1/185—Mounting of expansion boards
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
CN202380026658.7A 2022-04-11 2023-02-21 电子设备 Pending CN118872397A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-065376 2022-04-11
JP2022065376 2022-04-11
PCT/JP2023/006288 WO2023199605A1 (ja) 2022-04-11 2023-02-21 電子機器

Publications (1)

Publication Number Publication Date
CN118872397A true CN118872397A (zh) 2024-10-29

Family

ID=88329226

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202380026658.7A Pending CN118872397A (zh) 2022-04-11 2023-02-21 电子设备
CN202380028759.8A Pending CN118901289A (zh) 2022-04-11 2023-03-30 电子设备

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202380028759.8A Pending CN118901289A (zh) 2022-04-11 2023-03-30 电子设备

Country Status (5)

Country Link
US (1) US20250298446A1 (https=)
EP (2) EP4510796A4 (https=)
JP (2) JP7824406B2 (https=)
CN (2) CN118872397A (https=)
WO (2) WO2023199605A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI901553B (zh) * 2025-04-18 2025-10-11 雙鴻科技股份有限公司 散熱模組

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230112396A (ko) * 2022-01-20 2023-07-27 에스케이하이닉스 주식회사 바텀 플래인의 길이를 변경하여 전자기 간섭을 회피하기 위한 솔리드 스테이트 드라이브

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01273392A (ja) * 1988-04-26 1989-11-01 Canon Inc 電子機器
JP2553438Y2 (ja) * 1989-04-27 1997-11-05 日本エー・エム・ピー 株式会社 メモリカードコネクタ
US20040255313A1 (en) * 2003-06-10 2004-12-16 Kaczeus Steven L. Protecting a data storage device
CN109673124A (zh) 2017-10-17 2019-04-23 鸿富锦精密工业(武汉)有限公司 电路板及电子设备
TWM561980U (zh) * 2017-12-05 2018-06-11 技嘉科技股份有限公司 具有散熱孔的主電路板及其電子裝置
EP4121835A4 (en) * 2020-03-19 2024-03-27 Nexark, Inc. Enclosing a portable solid state device
JP7203784B2 (ja) * 2020-03-27 2023-01-13 株式会社ソニー・インタラクティブエンタテインメント 電子機器及びその外装パネル
WO2021193622A1 (ja) 2020-03-27 2021-09-30 株式会社ソニー・インタラクティブエンタテインメント 電子機器
US12028975B2 (en) * 2020-11-09 2024-07-02 Samsung Electronics Co., Ltd. Electronic device including shielding member
CN217306766U (zh) 2022-02-23 2022-08-26 鸿富锦精密工业(武汉)有限公司 Ssd卡转接支架及电路板组件

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI901553B (zh) * 2025-04-18 2025-10-11 雙鴻科技股份有限公司 散熱模組

Also Published As

Publication number Publication date
US20250298446A1 (en) 2025-09-25
EP4510796A4 (en) 2026-02-25
EP4510800A4 (en) 2026-04-08
WO2023199605A1 (ja) 2023-10-19
JP7732086B2 (ja) 2025-09-01
EP4510796A1 (en) 2025-02-19
JP7824406B2 (ja) 2026-03-04
EP4510800A1 (en) 2025-02-19
JPWO2023199605A1 (https=) 2023-10-19
CN118901289A (zh) 2024-11-05
WO2023199752A1 (ja) 2023-10-19
JPWO2023199752A1 (https=) 2023-10-19

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