TWM561980U - 具有散熱孔的主電路板及其電子裝置 - Google Patents

具有散熱孔的主電路板及其電子裝置 Download PDF

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TWM561980U
TWM561980U TW106218043U TW106218043U TWM561980U TW M561980 U TWM561980 U TW M561980U TW 106218043 U TW106218043 U TW 106218043U TW 106218043 U TW106218043 U TW 106218043U TW M561980 U TWM561980 U TW M561980U
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Taiwan
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circuit board
expansion
heat dissipation
electronic device
connector
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TW106218043U
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English (en)
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諶宏政
廖哲賢
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技嘉科技股份有限公司
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Priority to TW106218043U priority Critical patent/TWM561980U/zh
Publication of TWM561980U publication Critical patent/TWM561980U/zh
Priority to US16/110,635 priority patent/US20190174618A1/en
Priority to EP18192437.4A priority patent/EP3495917A1/en
Priority to KR2020180004265U priority patent/KR20200001237U/ko
Priority to JP2018004152U priority patent/JP3219620U/ja

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/185—Mounting of expansion boards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/735—Printed circuits including an angle between each other
    • H01R12/737—Printed circuits being substantially perpendicular to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H01R13/621—Bolt, set screw or screw clamp
    • H01R13/6215—Bolt, set screw or screw clamp using one or more bolts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1435—Expandable constructions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10159—Memory
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

本新型主要揭露一種具有散熱孔的主電路板，該主電路板包括一電路基板及一擴充連接器。該擴充連接器係用以裝設一擴充電路板，該電路基板面對該擴充電路板的一設置區內設有一或多個貫穿的散熱孔，用以協助該擴充電路板散熱。

Description

具有散熱孔的主電路板及其電子裝置
本新型與電路板的散熱有關，尤指一種具有散熱孔的主電路板及電子裝置。
在一電路板上，例如一電腦主機板或一PCI-E擴充板上配置一或多個M.2連接器，已日漸普遍。在大多數的應用中，該M.2連接器是用以供具有M.2介面的擴充卡，例如是具有M.2介面的固態硬碟(Solid State Drive，SSD)電路板來插設，其典型如圖1所示，一電腦主機板1上設有相隔一段距離的一M.2連接器10及一固定銅柱11，一固態硬碟電路板2的一側邊插設於M.2連接器10，另一側邊則藉由一螺絲3鎖固於固定銅柱11。固態硬碟電路板2的頂面21及底面22分別設有多個晶片23，例如快閃記憶體晶片(NAND Flash Memory)及其控制晶片。這些晶片在運作時將產生高溫，故目前亦有附加一散熱片4來協助散熱者。
然而，固態硬碟電路板2的底面22與電腦主機板1之間的間隙G很狹窄，因此，散熱片4目前只能設置於位於頂面21的晶片23上。問題在於，那些位於底面22的晶片23所產生的熱不但沒有任何散熱片來協助散熱，且幾乎都積蓄於狹窄的該間隙G內而難以散逸，這對固態硬碟電路板2的工作效能將有不良影響而亟需改善。
鑒於習知擴充電路板(例如固態硬碟電路板)之散 熱不良問題，本新型提供一種具有散熱孔的主電路板，該主電路板包括一電路基板及一擴充連接器。電路基板具有一頂面、一底面及貫穿頂、底面的至少一散熱孔，頂面具有用以設置該擴充電路板的一設置區，貫穿的散熱孔係位於該設置區內。該擴充連接器設於該電路基板上且位於該設置區內，用以連接該擴充電路板的一側邊。
在一實施例中，本新型上述各散熱孔的輪廓形狀可形成文字、數字、符號及圖形的其中一者或多者。
在一實施例中，本新型之主電路板更包括一固定件，固定件設於電路基板上且位於設置區內，用以固定擴充電路板的另一側邊。更進一步地，擴充連接器係為M.2連接器。另固定件可包括一支持座及一螺絲。支持座螺合於電路基板的一螺孔，用以支持擴充電路板的另一側邊。螺絲螺合於支持座的一螺孔，用以將擴充電路板的另一側邊固定於支持座上。
本新型還提供一種電子裝置，其包括上述的電路基板、上述的擴充連接器、及一金屬板，較佳可再包括上述的固定件。電路基板係固定於該金屬板上。更進一步地，該金屬板係具有一或多個貫穿的通風孔，通風孔對應上述散熱孔。
相對於先前技術，本新型的電路基板與擴充電路板之間的間隙雖然很狹窄，然而，由於本新型的電路基板上有貫穿的散熱孔通往間隙，故可藉由散熱孔起到通風作用，讓擴充電路板底面的晶片所產生的熱可經由散熱孔進行良好的散熱，避免擴充電路板(例如固態硬碟電路板)的工作效能受到高熱影響，故可解決習知擴充電路板之散熱不良問題。
1‧‧‧電腦主機板
10‧‧‧M.2連接器
11‧‧‧固定銅柱
2‧‧‧固態硬碟電路板
21‧‧‧固態硬碟電路板的頂面
22‧‧‧固態硬碟電路板的底面
23‧‧‧晶片
3‧‧‧螺絲
4‧‧‧散熱片
5‧‧‧主電路板
50‧‧‧電路基板
501‧‧‧電路基板的頂面
502‧‧‧電路基板的底面
503‧‧‧散熱孔
504‧‧‧設置區
505a‧‧‧螺孔
51‧‧‧擴充連接器
6‧‧‧擴充電路板
60‧‧‧擴充電路板的一側邊
61‧‧‧擴充電路板的另一側邊
62‧‧‧擴充電路板的頂面
63‧‧‧擴充電路板的底面
64‧‧‧晶片
65‧‧‧散熱片
7、7a‧‧‧金屬板
70、70a‧‧‧通風孔
700‧‧‧金屬機殻
8‧‧‧機殻
81‧‧‧底板
82‧‧‧通風孔
圖1顯示習知固態硬碟電路板的側視示意圖。
圖2顯示本新型主電路板的一實施例的立體分解圖。
圖3顯示本新型主電路板該實施例的俯視示意圖。
圖4顯示本新型主電路板該實施例的側視示意圖。
圖5顯示本新型本發明主電路板的另一實施例的立體分解圖。
圖6顯示本新型本發明主之散熱孔的各種態樣的俯視示意圖。
圖7顯示本新型電子裝置的一實施例的側視示意圖。
圖8顯示本新型電子裝置的另一實施例的側視示意圖。
請參見圖2及3，其中顯示本新型之具有散熱孔的主電路板5的一個實施例，主電路板5可為圖中所示的電腦主機板，亦可為圖5所示的PCI-E擴充板，或其它電路板。其中，主電路板5包括一電路基板50及一擴充連接器51。其中，電路基板50具有一頂面501、一底面502及貫穿頂、底面501、502的至少一散熱孔503。頂面501具有一設置區504，散熱孔503係位於設置區504內。擴充連接器51設於電路基板50上且位於設置區504內，用以連接一擴充電路板6的一側邊60，如圖4所示。
在此實施例中，擴充連接器51可為一M.2連接器，擴充電路板6可為一固態硬碟電路板，其頂面62及底面63分別設有多個晶片64，例如快閃記憶體晶片(NAND Flash Memory)及其控制晶片。更進一步地，如圖4所示，還可視需要而將一散熱片65設置於位於頂面62的晶片64上面，以協助該些晶片64散熱。
如圖2及圖4所示，主電路板5可再包括一固定件52。固定件52設於電路基板50上且位於設置區504內，用以固定擴充電路板6的另一側邊61。電路基板50上通常會嵌置多個中央具有螺孔505a的固定座505，且排成一排，以供一使用者根據擴充電路板6的長度來選擇其中一個固定座506來設置固定件52。更進一步地，固定件52還包括一支持座521及一螺絲522。支持座521螺合於電路基板50的固定座505的螺孔505a，用以支持擴充電路板6 的另一側邊61。螺絲522螺合於支持座521的一螺孔521a，用以將擴充電路板6的另一側邊61固定於支持座521上。
另外，散熱孔503的數量與位置可配合電路佈局或散熱需求而作調整，例如可為一個或多個散熱孔503。在此實施例中，散熱孔503有多個且排成兩排分列於固定件座505的兩旁。
如圖4所示，擴充電路板6的底面63與電路基板50的頂面501之間的間隙G1雖然很狹窄，然而，由於電路基板50上有貫穿的散熱孔503通往間隙G1，故可藉由散熱孔503起到通風作用，讓擴充電路板6的底面63上的晶片64所產生的熱可經由散熱孔503進行良好的散熱，避免擴充電路板6(例如固態硬碟電路板)的工作效能受到高熱影響而劣化。
請參見圖5所示，其中顯示本新型之具有散熱孔的主電路板5的另一個實施例，與上述實施例不同的是，該另一個實施例的主電路板5的電路基板50a係為一PCI-E擴充板，以使擴充電路板6(固態硬碟電路板)能通過PCI-E通道進行資料傳輸。
請參見圖6，其中顯示本新型的上述圓形的散熱孔503的其它態樣，其中，圖(a)顯示散熱孔503的輪廓形狀可形成圖形或文字或兩者整合之態樣，圖(b)顯示散熱孔503的輪廓形狀可形成文字的態樣，圖(c)顯示散熱孔503的輪廓形狀可形成楕圓形的態樣，圖(d)顯示散熱孔503的輪廓形狀可形成四邊形且大小不均一的態樣，然而，前述僅為例舉，散熱孔503的態樣不以此為限，例如，也可以是數字、符號或其它任意態樣。
請參見圖7，其中顯示本新型之電子裝置的一個實施例，其包括上述的電路基板50、上述的擴充連接器51，及一金屬板7，可再包括上述的固定件52。電路基板50係固定於金屬板7。金屬板7除了提供電路基板50固定之作用之外，還可為電路基板50提供一個共同接地。在此實施例中，金屬板7可進一步具有一或多個貫穿的通風孔70，通風孔70對應於上述的散熱孔503。另外，在此實施例中，電子裝置還有一機殻8，金屬板7是固定在機殻8的其 中一個板子上，例如圖中所示的底板81，而底板81也可再設置一或多個貫穿的通風孔82對應上述的通風孔70。
請參見圖8，其中顯示本新型之電子裝置的另一個實施例，其顯示電路基板50固定於一金屬板7a，金屬板7a除了提供電路基板50固定之作用之外，還可為電路基板50提供一個共同接地。與前段實施例不同的是，金屬板7a實質上是一金屬機殻700中的一片板子，例如一電腦主機殻的一側板或底板。更進一步地，金屬板7a還具有一或多個貫穿的通風孔70a，通風孔70a對應於上述散熱孔503。
相對於先前技術，本發明之主電路板5藉由其電路基板50的散熱孔503，協助裝設於電路基板50上的擴充電路板6(例如固態硬碟電路板)的散熱，可解決習知擴充電路板之散熱不良問題。

Claims (12)

  1. 一種具有散熱孔的主電路板，包括： 一電路基板，係具有一頂面、一底面及貫穿該頂面與該底面的至少一散熱孔，該頂面具有一設置區，用以設置一擴充電路板，該至少一散熱孔係位於該設置區內；及 一擴充連接器，設於該電路基板上且位於該設置區內，用以連接該擴充電路板的一側邊。
  2. 如請求項1所述的主電路板，其中各該散熱孔的輪廓形狀係形成文字、數字、符號及圖形的至少其中之一。
  3. 如請求項1所述的主電路板，更包括一固定件，該固定件設於該電路基板上且位於該設置區內，用以固定該擴充電路板的另一側邊。
  4. 如請求項3所述的主電路板，其中該固定件包括： 一支持座，螺合於該電路基板的一螺孔，用以支持該擴充電路板的該另一側邊；及 一螺絲，螺合於該支持座的一螺孔，用以將該擴充電路板的該另一側邊固定於該支持座上。
  5. 如請求項1所述的主電路板，其中該擴充連接器係為一M.2連接器。
  6. 一種電子裝置，包括： 一電路基板，係具有一頂面、一底面及貫穿該頂面與該底面的至少一散熱孔，該頂面具有一設置區，該至少一散熱孔係位於該設置區內； 一擴充連接器，設於該電路基板上，且位於該設置區內；及 一擴充電路板，設置於該電路基板的該設置區內，且該擴充電路板的一側邊係連接該擴充連接器。
  7. 如請求項6所述的電子裝置，其中各該散熱孔的輪廓形狀係形成文字、數字、符號及圖形的至少其中之一。
  8. 如請求項6所述的電子裝置，更包括一固定件，該固定件設於該電路基板上且位於該設置區內，用以固定該擴充電路板的另一側邊。
  9. 如請求項8所述的電子裝置，其中該固定件包括： 一支持座，螺合於該電路基板的一螺孔，用以支持該擴充電路板的該另一側邊；及 一螺絲，螺合於該支持座的一螺孔，用以將該擴充電路板的該另一側邊固定於該支持座上。
  10. 如請求項6所述的電子裝置，更包括一金屬板，該電路基板係固定於該金屬板上。
  11. 如請求項10所述的電子裝置，其中該金屬板具有貫穿的通風孔，該通風孔對應電路基板的散熱孔。
  12. 如請求項6所述的電子裝置，其中該擴充連接器係為一M.2連接器，該擴充電路板的一頂面及一底面各具有至少一晶片。
TW106218043U 2017-12-05 2017-12-05 具有散熱孔的主電路板及其電子裝置 TWM561980U (zh)

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US16/110,635 US20190174618A1 (en) 2017-12-05 2018-08-23 Printed Circuit Assembly with Vents and Electronic Device with the Assembly
EP18192437.4A EP3495917A1 (en) 2017-12-05 2018-09-04 Printed circuit assembly with vents and electronic device with the assembly
KR2020180004265U KR20200001237U (ko) 2017-12-05 2018-09-13 방열 홀을 구비하는 메인 회로판 및 그 전자 장치
JP2018004152U JP3219620U (ja) 2017-12-05 2018-10-25 放熱孔を備えた回路基板アセンブリ及び回路基板アセンブリを用いた電子装置

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CN110392481A (zh) * 2019-08-28 2019-10-29 上海创功通讯技术有限公司 印刷电路板组件及电子设备
TWI709849B (zh) * 2020-01-20 2020-11-11 技嘉科技股份有限公司 散熱組件及主機板模組
US11262813B2 (en) * 2020-05-05 2022-03-01 Quanta Computer Inc. Double-sided and tool-less M.2 module design
US11553625B2 (en) * 2020-07-23 2023-01-10 Quanta Computer Inc. Tool-less M.2 device carrier with grounding and thermal flow
JP2022147620A (ja) * 2021-03-23 2022-10-06 キオクシア株式会社 メモリシステム、及びラベル部品
TWM617810U (zh) * 2021-05-25 2021-10-01 艾維克科技股份有限公司 擴充卡固定結構
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