JP7794970B2 - ガスディフューザハウジング、デバイス、および関係する方法 - Google Patents
ガスディフューザハウジング、デバイス、および関係する方法Info
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- JP7794970B2 JP7794970B2 JP2024528482A JP2024528482A JP7794970B2 JP 7794970 B2 JP7794970 B2 JP 7794970B2 JP 2024528482 A JP2024528482 A JP 2024528482A JP 2024528482 A JP2024528482 A JP 2024528482A JP 7794970 B2 JP7794970 B2 JP 7794970B2
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45559—Diffusion of reactive gas to substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
- B22F5/10—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of articles with cavities or holes, not otherwise provided for in the preceding subgroups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/141—Processes of additive manufacturing using only solid materials
- B29C64/153—Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/264—Arrangements for irradiation
- B29C64/268—Arrangements for irradiation using laser beams; using electron beams [EB]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
- B33Y70/10—Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45568—Porous nozzles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45578—Elongated nozzles, tubes with holes
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/14—Feed and outlet means for the gases; Modifying the flow of the reactive gases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
- H10P72/1926—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
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- Organic Chemistry (AREA)
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- Civil Engineering (AREA)
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- Crystallography & Structural Chemistry (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Aeration Devices For Treatment Of Activated Polluted Sludge (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
- Laminated Bodies (AREA)
Description
複数の半導体ウエハを含んでいるように適応された密閉空間を含む別のデバイスが、「フロントオープニングユニファイドポッド(Front Opening Unified Pod)」または「フロントオープニングユニバーサルポッド(Front Opening Universal Pod)」を表し得る、「FOUP」と呼ばれることがある、ウエハキャリアである。FOUPは、複数の半導体ウエハを移送するために、密閉内部においてそれらのウエハを含んでいる。使用中に、チャンバ内部においてウエハを含んでいる間、その内部は、空気雰囲気とは対照的に、不活性ガス雰囲気で充填される。不活性ガスは、一般に、ディフューザによって密閉チャンバ内部に加えられる。ディフューザは、乱された場合にウエハの表面に積もり得る、内部に存在し得る汚染物質粒子を乱すことを回避するために、安定したおよび拡散された流れとしてウエハキャリアの内部に不活性ガスを導入する。
Claims (24)
- 細長いハウジング
を備える、方向性ガスディフューザであって、ハウジングが、
入口端部と、
閉端部と、
前記ハウジングの前面上に延在する開口と、
前記入口端部と前記閉端部との間に延在する、滑らかな内面を有するチャネルと
を備え、前記入口端部と前記閉端部との間の前記チャネルが、
前記前面に沿って延在する前記開口と、
細長い裏面と、
細長い側面と
によって長手方向に画定され、
前記チャネルの断面積が、前記方向性ガスディフューザの長手方向に沿って変動し、
前記チャネルの深さは、前記入口端部と前記閉端部との間の前記チャネルの中間点において、最も大きくなるよう形成されている、方向性ガスディフューザ。 - 前記チャネルの長さが前記チャネルの幅よりも大きく、前記チャネルの幅が前記チャネルの最大深さよりも大きい、請求項1に記載のディフューザ。
- 前記細長い裏面が非多孔質であり、2つの前記細長い側面が非多孔質である、請求項1に記載のディフューザ。
- 前記ハウジングが、前記細長い裏面から前記前面まで延在する多層複合物を更に備える、請求項1に記載のディフューザ。
- 前記多層複合物が、金属又は金属合金、金属複合材マトリックス、セラミック、あるいはポリマーを含む、請求項4に記載のディフューザ。
- 前記多層複合物がシームを含んでいない、請求項4に記載のディフューザ。
- 前記開口に固定されたディフューザメンブレンを更に備える、請求項1に記載のディフューザ。
- チャネルの長さに沿って均一な断面積をもつャネルを有するディフューザよりも、チャネルの長さに沿って変動する断面積をもつ前記チャネルを有する前記ディフューザの方が、前記ディフューザメンブレンの長さに沿って前記ディフューザメンブレンを通る流体のより均一な流量を作り出す、請求項7に記載のディフューザ。
- 前記ディフューザが、前記ディフューザメンブレンを通して水の層流を作り出すことが可能であり、それにより、前記ディフューザは、前記ディフューザメンブレンが下を向く状態で水平方向に位置し、前記ディフューザを通過する水が、前記ディフューザメンブレンの長さに沿った流れる水から形をなす連続的な薄い水膜を作り出すことが可能である、請求項7に記載のディフューザ。
- 細長いハウジング
を備える、方向性ガスディフューザであって、前記ハウジングが、
入口を備える入口端部と、
閉端部と、
前記ハウジングの前面上に沿って延在する開口と、
前記入口と前記閉端部との間に延在する、滑らかな内面を有する内部チャネルと、
を備え、前記入口と前記閉端部との間の前記内部チャネルが、
前記前面上の前記開口と、
細長い、非多孔質裏面と、
細長い非多孔質側面と
によって長手方向に画定され、
前記内部チャネルの深さは、前記入口端部と前記閉端部との間の前記内部チャネルの中間点において、最も大きくなるよう形成されている、方向性ガスディフューザ。 - 前記内部チャネルの長さが前記内部チャネルの幅よりも大きく、前記内部チャネルの幅が前記内部チャネルの最大深さよりも大きい、請求項10に記載のディフューザ。
- 前記細長い裏面が非多孔質であり、2つの前記細長い側面が非多孔質である、請求項10に記載のディフューザ。
- 前記ハウジングが、前記細長い裏面から前記前面まで延在する多層複合物を更に備える、請求項10に記載のディフューザ。
- 前記多層複合物が、金属又は金属合金、金属複合材マトリックス、セラミック、あるいはポリマーを含む、請求項13に記載のディフューザ。
- 前記多層複合物がシームを含んでいない、請求項13に記載のディフューザ。
- 1つ又は複数の半導体ウエハを含んでいるように適応された内部を含むチャンバを備える装置であって、前記チャンバが、不活性ガスの源に接続された、前記内部における、請求項1に記載の方向性ガスディフューザを備える、装置。
- ウエハキャリアとウエハ搬送ステーションとから選択される、請求項16に記載の装置。
- 請求項17に記載の装置における前記ウエハ搬送ステーションのチャンバ中の圧力を制御する方法であって、前記方法は、前記チャンバが、複数の半導体ウエハを含んでいる状態で、かつ前記チャンバが、閉じられ、雰囲気圧力未満にある前記内部を含んでいる状態で、前記内部内の圧力を増加させるために前記ディフューザを通して不活性ガスを分配することを含む、方法。
- 請求項17に記載の装置における前記ウエハキャリアのチャンバ中のガス状雰囲気を置換する方法であって、前記方法は、前記チャンバが、ガス状雰囲気中に複数の前記半導体ウエハを含んでいる状態で、前記内部に不活性ガスを加えるために前記ディフューザを通して不活性ガスを分配することを含む、方法。
- 前記チャンバ中のガス状雰囲気が空気であり、前記不活性ガスが空気を置換する、請求項19に記載の方法。
- 付加製造によって、請求項1に記載の方向性ガスディフューザのハウジングを作る方法であって、前記方法が、
固化した供給原料の第1の層を形成することと、
前記固化した供給原料の第1の層の表面上に、固化した供給原料の第2の層を形成することと
を含み、
前記固化した供給原料の第1の層および前記固化した供給原料の第2の層が、前記ハウジングの一部である、方法。 - 表面上に第1の供給原料層を形成することであって、供給原料層が無機粒子を含む、第1の供給原料層を形成することと、
前記第1の供給原料層から、第1の固化した供給原料を形成することと、
前記第1の供給原料層の上に第2の供給原料層を形成することであって、第2の供給原料層が無機粒子を含む、第2の供給原料層を形成することと、
前記第2の供給原料層から、第2の固化した供給原料を形成することと
を更に含み、
前記第1の固化した供給原料の層および前記第2の固化した供給原料の層が、前記方向性ガスディフューザのハウジングの一部である、請求項21に記載の方法。 - レーザーを使用して無機粒子を溶融することによって、前記固化した供給原料を形成することを更に含む、請求項21に記載の方法。
- 前記固化した供給原料が、金属又は金属合金粒子と、金属複合材マトリックス粒子と、セラミック粒子と、ポリマー粒子とから選択される粒子を含む、請求項21に記載の方法。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202163280283P | 2021-11-17 | 2021-11-17 | |
| US63/280,283 | 2021-11-17 | ||
| PCT/US2022/049416 WO2023091340A1 (en) | 2021-11-17 | 2022-11-09 | Gas diffuser housings, devices, and related methods |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024541366A JP2024541366A (ja) | 2024-11-08 |
| JP7794970B2 true JP7794970B2 (ja) | 2026-01-06 |
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| USD1088225S1 (en) * | 2021-08-02 | 2025-08-12 | Fisher & Paykel Healthcare Limited | Surgical gas diffuser |
| USD1011523S1 (en) * | 2021-09-27 | 2024-01-16 | Fisher & Paykel Healthcare Limited | Surgical gas diffuser |
| JP7794970B2 (ja) * | 2021-11-17 | 2026-01-06 | インテグリス・インコーポレーテッド | ガスディフューザハウジング、デバイス、および関係する方法 |
| WO2025264557A1 (en) * | 2024-06-17 | 2025-12-26 | Porex Corporation | Single component gas diffusion component with variation of gas diffusion characteristics |
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| IL312877A (en) | 2024-07-01 |
| WO2023091340A1 (en) | 2023-05-25 |
| CN116136019A (zh) | 2023-05-19 |
| CN219260185U (zh) | 2023-06-27 |
| US20230151490A1 (en) | 2023-05-18 |
| TWI881253B (zh) | 2025-04-21 |
| EP4434082A4 (en) | 2026-02-11 |
| US12460296B2 (en) | 2025-11-04 |
| JP2024541366A (ja) | 2024-11-08 |
| EP4434082A1 (en) | 2024-09-25 |
| TW202329300A (zh) | 2023-07-16 |
| KR20240099479A (ko) | 2024-06-28 |
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