JP7786475B2 - 易解体性熱硬化性樹脂組成物および解体方法 - Google Patents

易解体性熱硬化性樹脂組成物および解体方法

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Publication number
JP7786475B2
JP7786475B2 JP2023574555A JP2023574555A JP7786475B2 JP 7786475 B2 JP7786475 B2 JP 7786475B2 JP 2023574555 A JP2023574555 A JP 2023574555A JP 2023574555 A JP2023574555 A JP 2023574555A JP 7786475 B2 JP7786475 B2 JP 7786475B2
Authority
JP
Japan
Prior art keywords
group
resin composition
thermosetting resin
epoxy resins
type epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023574555A
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English (en)
Japanese (ja)
Other versions
JPWO2023234340A1 (https=
JPWO2023234340A5 (https=
Inventor
康二 牧原
玄昭 熊本
正義 橋詰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Publication of JPWO2023234340A1 publication Critical patent/JPWO2023234340A1/ja
Publication of JPWO2023234340A5 publication Critical patent/JPWO2023234340A5/ja
Priority to JP2025149905A priority Critical patent/JP2025186337A/ja
Application granted granted Critical
Publication of JP7786475B2 publication Critical patent/JP7786475B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/62—Plastics recycling; Rubber recycling

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2023574555A 2022-05-31 2023-05-31 易解体性熱硬化性樹脂組成物および解体方法 Active JP7786475B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025149905A JP2025186337A (ja) 2022-05-31 2025-09-10 易解体性熱硬化性樹脂組成物および解体方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022088784 2022-05-31
JP2022088784 2022-05-31
PCT/JP2023/020245 WO2023234340A1 (ja) 2022-05-31 2023-05-31 易解体性熱硬化性樹脂組成物および解体方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025149905A Division JP2025186337A (ja) 2022-05-31 2025-09-10 易解体性熱硬化性樹脂組成物および解体方法

Publications (3)

Publication Number Publication Date
JPWO2023234340A1 JPWO2023234340A1 (https=) 2023-12-07
JPWO2023234340A5 JPWO2023234340A5 (https=) 2024-05-14
JP7786475B2 true JP7786475B2 (ja) 2025-12-16

Family

ID=89024871

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023574555A Active JP7786475B2 (ja) 2022-05-31 2023-05-31 易解体性熱硬化性樹脂組成物および解体方法
JP2025149905A Pending JP2025186337A (ja) 2022-05-31 2025-09-10 易解体性熱硬化性樹脂組成物および解体方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025149905A Pending JP2025186337A (ja) 2022-05-31 2025-09-10 易解体性熱硬化性樹脂組成物および解体方法

Country Status (5)

Country Link
EP (1) EP4534608A1 (https=)
JP (2) JP7786475B2 (https=)
KR (1) KR20250018528A (https=)
CN (1) CN119301202A (https=)
WO (1) WO2023234340A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008156475A (ja) 2006-12-25 2008-07-10 Dow Corning Toray Co Ltd 硬化性シリコーン組成物
JP2010189553A (ja) 2009-02-18 2010-09-02 Hitachi Chem Co Ltd 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP2010535152A (ja) 2007-05-03 2010-11-18 カードライト コーポレイション カルダノールをベースとするダイマーおよびそれらの使用
WO2020031669A1 (ja) 2018-08-10 2020-02-13 信越化学工業株式会社 シリコーン組成物及びその製造方法
JP2022512567A (ja) 2018-09-27 2022-02-07 ビーエーエスエフ ソシエタス・ヨーロピア エポキシ樹脂組成物
JP2022032813A (ja) 2020-08-14 2022-02-25 信越化学工業株式会社 シリコーン接着剤組成物、及びシリコーンゴム硬化物

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5918724A (ja) * 1982-07-23 1984-01-31 Nitto Electric Ind Co Ltd 熱硬化性樹脂組成物
JP2641277B2 (ja) * 1988-11-30 1997-08-13 住友ベークライト株式会社 エポキシ樹脂組成物
JPH0597949A (ja) * 1991-10-03 1993-04-20 Nippon Kayaku Co Ltd シリコーン変性フエノール類ノボラツク樹脂、樹脂組成物及び硬化物
JP2020050689A (ja) 2018-09-21 2020-04-02 日立化成株式会社 処理液及び熱硬化性樹脂硬化物の処理方法
JP7489907B2 (ja) 2020-12-03 2024-05-24 エイブリック株式会社 充放電制御回路及びバッテリ装置
JP7464005B2 (ja) * 2021-05-31 2024-04-09 信越化学工業株式会社 接合部材の解体方法及び接合部材並びに易解体性の液状シリコーン系接着剤

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008156475A (ja) 2006-12-25 2008-07-10 Dow Corning Toray Co Ltd 硬化性シリコーン組成物
JP2010535152A (ja) 2007-05-03 2010-11-18 カードライト コーポレイション カルダノールをベースとするダイマーおよびそれらの使用
JP2010189553A (ja) 2009-02-18 2010-09-02 Hitachi Chem Co Ltd 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
WO2020031669A1 (ja) 2018-08-10 2020-02-13 信越化学工業株式会社 シリコーン組成物及びその製造方法
JP2022512567A (ja) 2018-09-27 2022-02-07 ビーエーエスエフ ソシエタス・ヨーロピア エポキシ樹脂組成物
JP2022032813A (ja) 2020-08-14 2022-02-25 信越化学工業株式会社 シリコーン接着剤組成物、及びシリコーンゴム硬化物

Also Published As

Publication number Publication date
JP2025186337A (ja) 2025-12-23
WO2023234340A1 (ja) 2023-12-07
CN119301202A (zh) 2025-01-10
KR20250018528A (ko) 2025-02-06
JPWO2023234340A1 (https=) 2023-12-07
EP4534608A1 (en) 2025-04-09

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