KR20250018528A - 이해체성 열경화성 수지 조성물 및 해체 방법 - Google Patents

이해체성 열경화성 수지 조성물 및 해체 방법 Download PDF

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Publication number
KR20250018528A
KR20250018528A KR1020247042961A KR20247042961A KR20250018528A KR 20250018528 A KR20250018528 A KR 20250018528A KR 1020247042961 A KR1020247042961 A KR 1020247042961A KR 20247042961 A KR20247042961 A KR 20247042961A KR 20250018528 A KR20250018528 A KR 20250018528A
Authority
KR
South Korea
Prior art keywords
resin composition
thermosetting resin
group
thermosetting
cured product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247042961A
Other languages
English (en)
Korean (ko)
Inventor
고지 마키하라
츠네아키 구마모토
마사요시 하시즈메
Original Assignee
스미또모 베이크라이트 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스미또모 베이크라이트 가부시키가이샤 filed Critical 스미또모 베이크라이트 가부시키가이샤
Publication of KR20250018528A publication Critical patent/KR20250018528A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • H01L23/296—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/62—Plastics recycling; Rubber recycling

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020247042961A 2022-05-31 2023-05-31 이해체성 열경화성 수지 조성물 및 해체 방법 Pending KR20250018528A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2022-088784 2022-05-31
JP2022088784 2022-05-31
PCT/JP2023/020245 WO2023234340A1 (ja) 2022-05-31 2023-05-31 易解体性熱硬化性樹脂組成物および解体方法

Publications (1)

Publication Number Publication Date
KR20250018528A true KR20250018528A (ko) 2025-02-06

Family

ID=89024871

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247042961A Pending KR20250018528A (ko) 2022-05-31 2023-05-31 이해체성 열경화성 수지 조성물 및 해체 방법

Country Status (5)

Country Link
EP (1) EP4534608A1 (https=)
JP (2) JP7786475B2 (https=)
KR (1) KR20250018528A (https=)
CN (1) CN119301202A (https=)
WO (1) WO2023234340A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020050689A (ja) 2018-09-21 2020-04-02 日立化成株式会社 処理液及び熱硬化性樹脂硬化物の処理方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5918724A (ja) * 1982-07-23 1984-01-31 Nitto Electric Ind Co Ltd 熱硬化性樹脂組成物
JP2641277B2 (ja) * 1988-11-30 1997-08-13 住友ベークライト株式会社 エポキシ樹脂組成物
JPH0597949A (ja) * 1991-10-03 1993-04-20 Nippon Kayaku Co Ltd シリコーン変性フエノール類ノボラツク樹脂、樹脂組成物及び硬化物
JP5248012B2 (ja) 2006-12-25 2013-07-31 東レ・ダウコーニング株式会社 硬化性シリコーン組成物
KR20110116259A (ko) 2007-05-03 2011-10-25 카돌라이트 코포레이션 카르다놀을 기반으로 하는 이량체 및 이의 용도
JP2010189553A (ja) 2009-02-18 2010-09-02 Hitachi Chem Co Ltd 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP7010381B2 (ja) 2018-08-10 2022-01-26 信越化学工業株式会社 シリコーン組成物及びその製造方法
SG11202101938QA (en) 2018-09-27 2021-04-29 Basf Se Epoxy resin composition
JP7285238B2 (ja) 2020-08-14 2023-06-01 信越化学工業株式会社 シリコーン接着剤組成物、及びシリコーンゴム硬化物
JP7489907B2 (ja) 2020-12-03 2024-05-24 エイブリック株式会社 充放電制御回路及びバッテリ装置
JP7464005B2 (ja) * 2021-05-31 2024-04-09 信越化学工業株式会社 接合部材の解体方法及び接合部材並びに易解体性の液状シリコーン系接着剤

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020050689A (ja) 2018-09-21 2020-04-02 日立化成株式会社 処理液及び熱硬化性樹脂硬化物の処理方法

Also Published As

Publication number Publication date
JP2025186337A (ja) 2025-12-23
JP7786475B2 (ja) 2025-12-16
WO2023234340A1 (ja) 2023-12-07
CN119301202A (zh) 2025-01-10
JPWO2023234340A1 (https=) 2023-12-07
EP4534608A1 (en) 2025-04-09

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P22-X000 Classification modified

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