JP7786452B2 - 感光性樹脂組成物 - Google Patents

感光性樹脂組成物

Info

Publication number
JP7786452B2
JP7786452B2 JP2023508841A JP2023508841A JP7786452B2 JP 7786452 B2 JP7786452 B2 JP 7786452B2 JP 2023508841 A JP2023508841 A JP 2023508841A JP 2023508841 A JP2023508841 A JP 2023508841A JP 7786452 B2 JP7786452 B2 JP 7786452B2
Authority
JP
Japan
Prior art keywords
photosensitive resin
group
bond
resin composition
manufactured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023508841A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022202098A1 (https=
JPWO2022202098A5 (https=
Inventor
貴文 遠藤
秀則 石井
崇洋 坂口
浩司 荻野
有輝 星野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Chemical Corp
Original Assignee
Nissan Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Corp filed Critical Nissan Chemical Corp
Publication of JPWO2022202098A1 publication Critical patent/JPWO2022202098A1/ja
Publication of JPWO2022202098A5 publication Critical patent/JPWO2022202098A5/ja
Application granted granted Critical
Publication of JP7786452B2 publication Critical patent/JP7786452B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymerisation Methods In General (AREA)
JP2023508841A 2021-03-22 2022-02-25 感光性樹脂組成物 Active JP7786452B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021046929 2021-03-22
JP2021046929 2021-03-22
PCT/JP2022/007899 WO2022202098A1 (ja) 2021-03-22 2022-02-25 感光性樹脂組成物

Publications (3)

Publication Number Publication Date
JPWO2022202098A1 JPWO2022202098A1 (https=) 2022-09-29
JPWO2022202098A5 JPWO2022202098A5 (https=) 2024-11-08
JP7786452B2 true JP7786452B2 (ja) 2025-12-16

Family

ID=83395591

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023508841A Active JP7786452B2 (ja) 2021-03-22 2022-02-25 感光性樹脂組成物

Country Status (4)

Country Link
JP (1) JP7786452B2 (https=)
KR (1) KR102922080B1 (https=)
CN (1) CN116982003A (https=)
WO (1) WO2022202098A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI804086B (zh) * 2021-03-26 2023-06-01 財團法人工業技術研究院 聚醯亞胺、薄膜組合物及其所形成之薄膜
US12607932B2 (en) 2021-03-26 2026-04-21 Industrial Technology Research Institute Photosensitive composition and film prepared from the same
CN115626989B (zh) * 2022-10-28 2023-06-13 嘉兴瑞华泰薄膜技术有限公司 光敏聚酰亚胺、光敏聚酰亚胺薄膜及其制备方法和应用
JPWO2024185652A1 (https=) * 2023-03-08 2024-09-12
JP7736225B1 (ja) * 2023-12-26 2025-09-09 住友ベークライト株式会社 感光性樹脂組成物、硬化物および半導体装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01113748A (ja) * 1987-10-27 1989-05-02 Hitachi Chem Co Ltd 感光性樹脂組成物
JPH01118514A (ja) * 1987-11-02 1989-05-11 Hitachi Chem Co Ltd 感光性樹脂組成物
KR100583857B1 (ko) * 1998-04-01 2006-05-26 가부시키가이샤 가네카 폴리이미드화합물
WO1999051662A1 (en) * 1998-04-01 1999-10-14 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Polyimide compositions
JP2000147768A (ja) * 1998-11-07 2000-05-26 Pi Gijutsu Kenkyusho:Kk ネガ型感光性ポリイミド組成物及び絶縁膜
JP2000347404A (ja) 1999-06-02 2000-12-15 Hitachi Chemical Dupont Microsystems Ltd 感光性重合体組成物並びにこれを用いた電子部品及びその製造法
TWI877051B (zh) * 2019-11-27 2025-03-11 日商富士軟片股份有限公司 樹脂

Also Published As

Publication number Publication date
JPWO2022202098A1 (https=) 2022-09-29
WO2022202098A1 (ja) 2022-09-29
KR102922080B1 (ko) 2026-02-03
TW202244131A (zh) 2022-11-16
CN116982003A (zh) 2023-10-31
KR20230160249A (ko) 2023-11-23

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