KR102922080B1 - 감광성 수지 조성물 - Google Patents

감광성 수지 조성물

Info

Publication number
KR102922080B1
KR102922080B1 KR1020237030944A KR20237030944A KR102922080B1 KR 102922080 B1 KR102922080 B1 KR 102922080B1 KR 1020237030944 A KR1020237030944 A KR 1020237030944A KR 20237030944 A KR20237030944 A KR 20237030944A KR 102922080 B1 KR102922080 B1 KR 102922080B1
Authority
KR
South Korea
Prior art keywords
bond
photosensitive resin
group
manufactured
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020237030944A
Other languages
English (en)
Korean (ko)
Other versions
KR20230160249A (ko
Inventor
다카후미 엔도
히데노리 이시이
다카히로 사카구치
히로시 오기노
유키 호시노
Original Assignee
닛산 가가쿠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛산 가가쿠 가부시키가이샤 filed Critical 닛산 가가쿠 가부시키가이샤
Publication of KR20230160249A publication Critical patent/KR20230160249A/ko
Application granted granted Critical
Publication of KR102922080B1 publication Critical patent/KR102922080B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymerisation Methods In General (AREA)
KR1020237030944A 2021-03-22 2022-02-25 감광성 수지 조성물 Active KR102922080B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-046929 2021-03-22
JP2021046929 2021-03-22
PCT/JP2022/007899 WO2022202098A1 (ja) 2021-03-22 2022-02-25 感光性樹脂組成物

Publications (2)

Publication Number Publication Date
KR20230160249A KR20230160249A (ko) 2023-11-23
KR102922080B1 true KR102922080B1 (ko) 2026-02-03

Family

ID=83395591

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237030944A Active KR102922080B1 (ko) 2021-03-22 2022-02-25 감광성 수지 조성물

Country Status (4)

Country Link
JP (1) JP7786452B2 (https=)
KR (1) KR102922080B1 (https=)
CN (1) CN116982003A (https=)
WO (1) WO2022202098A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI804086B (zh) * 2021-03-26 2023-06-01 財團法人工業技術研究院 聚醯亞胺、薄膜組合物及其所形成之薄膜
US12607932B2 (en) 2021-03-26 2026-04-21 Industrial Technology Research Institute Photosensitive composition and film prepared from the same
CN115626989B (zh) * 2022-10-28 2023-06-13 嘉兴瑞华泰薄膜技术有限公司 光敏聚酰亚胺、光敏聚酰亚胺薄膜及其制备方法和应用
JPWO2024185652A1 (https=) * 2023-03-08 2024-09-12
JP7736225B1 (ja) * 2023-12-26 2025-09-09 住友ベークライト株式会社 感光性樹脂組成物、硬化物および半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000147768A (ja) * 1998-11-07 2000-05-26 Pi Gijutsu Kenkyusho:Kk ネガ型感光性ポリイミド組成物及び絶縁膜
KR100583857B1 (ko) * 1998-04-01 2006-05-26 가부시키가이샤 가네카 폴리이미드화합물

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01113748A (ja) * 1987-10-27 1989-05-02 Hitachi Chem Co Ltd 感光性樹脂組成物
JPH01118514A (ja) * 1987-11-02 1989-05-11 Hitachi Chem Co Ltd 感光性樹脂組成物
WO1999051662A1 (en) * 1998-04-01 1999-10-14 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Polyimide compositions
JP2000347404A (ja) 1999-06-02 2000-12-15 Hitachi Chemical Dupont Microsystems Ltd 感光性重合体組成物並びにこれを用いた電子部品及びその製造法
TWI877051B (zh) * 2019-11-27 2025-03-11 日商富士軟片股份有限公司 樹脂

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100583857B1 (ko) * 1998-04-01 2006-05-26 가부시키가이샤 가네카 폴리이미드화합물
JP2000147768A (ja) * 1998-11-07 2000-05-26 Pi Gijutsu Kenkyusho:Kk ネガ型感光性ポリイミド組成物及び絶縁膜

Also Published As

Publication number Publication date
JPWO2022202098A1 (https=) 2022-09-29
WO2022202098A1 (ja) 2022-09-29
JP7786452B2 (ja) 2025-12-16
TW202244131A (zh) 2022-11-16
CN116982003A (zh) 2023-10-31
KR20230160249A (ko) 2023-11-23

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