JPWO2022202098A1 - - Google Patents
Info
- Publication number
- JPWO2022202098A1 JPWO2022202098A1 JP2023508841A JP2023508841A JPWO2022202098A1 JP WO2022202098 A1 JPWO2022202098 A1 JP WO2022202098A1 JP 2023508841 A JP2023508841 A JP 2023508841A JP 2023508841 A JP2023508841 A JP 2023508841A JP WO2022202098 A1 JPWO2022202098 A1 JP WO2022202098A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
- H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
- H10P76/2041—Photolithographic processes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials For Photolithography (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Polymerisation Methods In General (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021046929 | 2021-03-22 | ||
| JP2021046929 | 2021-03-22 | ||
| PCT/JP2022/007899 WO2022202098A1 (ja) | 2021-03-22 | 2022-02-25 | 感光性樹脂組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022202098A1 true JPWO2022202098A1 (https=) | 2022-09-29 |
| JPWO2022202098A5 JPWO2022202098A5 (https=) | 2024-11-08 |
| JP7786452B2 JP7786452B2 (ja) | 2025-12-16 |
Family
ID=83395591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023508841A Active JP7786452B2 (ja) | 2021-03-22 | 2022-02-25 | 感光性樹脂組成物 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7786452B2 (https=) |
| KR (1) | KR102922080B1 (https=) |
| CN (1) | CN116982003A (https=) |
| WO (1) | WO2022202098A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI804086B (zh) * | 2021-03-26 | 2023-06-01 | 財團法人工業技術研究院 | 聚醯亞胺、薄膜組合物及其所形成之薄膜 |
| US12607932B2 (en) | 2021-03-26 | 2026-04-21 | Industrial Technology Research Institute | Photosensitive composition and film prepared from the same |
| CN115626989B (zh) * | 2022-10-28 | 2023-06-13 | 嘉兴瑞华泰薄膜技术有限公司 | 光敏聚酰亚胺、光敏聚酰亚胺薄膜及其制备方法和应用 |
| JPWO2024185652A1 (https=) * | 2023-03-08 | 2024-09-12 | ||
| JP7736225B1 (ja) * | 2023-12-26 | 2025-09-09 | 住友ベークライト株式会社 | 感光性樹脂組成物、硬化物および半導体装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01118514A (ja) * | 1987-11-02 | 1989-05-11 | Hitachi Chem Co Ltd | 感光性樹脂組成物 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01113748A (ja) * | 1987-10-27 | 1989-05-02 | Hitachi Chem Co Ltd | 感光性樹脂組成物 |
| KR100583857B1 (ko) * | 1998-04-01 | 2006-05-26 | 가부시키가이샤 가네카 | 폴리이미드화합물 |
| WO1999051662A1 (en) * | 1998-04-01 | 1999-10-14 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Polyimide compositions |
| JP2000147768A (ja) * | 1998-11-07 | 2000-05-26 | Pi Gijutsu Kenkyusho:Kk | ネガ型感光性ポリイミド組成物及び絶縁膜 |
| JP2000347404A (ja) | 1999-06-02 | 2000-12-15 | Hitachi Chemical Dupont Microsystems Ltd | 感光性重合体組成物並びにこれを用いた電子部品及びその製造法 |
| TWI877051B (zh) * | 2019-11-27 | 2025-03-11 | 日商富士軟片股份有限公司 | 樹脂 |
-
2022
- 2022-02-25 CN CN202280019418.XA patent/CN116982003A/zh active Pending
- 2022-02-25 WO PCT/JP2022/007899 patent/WO2022202098A1/ja not_active Ceased
- 2022-02-25 KR KR1020237030944A patent/KR102922080B1/ko active Active
- 2022-02-25 JP JP2023508841A patent/JP7786452B2/ja active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01118514A (ja) * | 1987-11-02 | 1989-05-11 | Hitachi Chem Co Ltd | 感光性樹脂組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022202098A1 (ja) | 2022-09-29 |
| KR102922080B1 (ko) | 2026-02-03 |
| JP7786452B2 (ja) | 2025-12-16 |
| TW202244131A (zh) | 2022-11-16 |
| CN116982003A (zh) | 2023-10-31 |
| KR20230160249A (ko) | 2023-11-23 |
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