JP7783285B2 - 加熱装置 - Google Patents

加熱装置

Info

Publication number
JP7783285B2
JP7783285B2 JP2023545476A JP2023545476A JP7783285B2 JP 7783285 B2 JP7783285 B2 JP 7783285B2 JP 2023545476 A JP2023545476 A JP 2023545476A JP 2023545476 A JP2023545476 A JP 2023545476A JP 7783285 B2 JP7783285 B2 JP 7783285B2
Authority
JP
Japan
Prior art keywords
plate
hole
heating
heating device
heating plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023545476A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023032755A5 (https=
JPWO2023032755A1 (https=
Inventor
貴雄 堀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of JPWO2023032755A1 publication Critical patent/JPWO2023032755A1/ja
Publication of JPWO2023032755A5 publication Critical patent/JPWO2023032755A5/ja
Application granted granted Critical
Publication of JP7783285B2 publication Critical patent/JP7783285B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/02Details
    • H05B3/06Heater elements structurally combined with coupling elements or holders
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/20Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/68Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H05B3/72Plates of sheet metal

Landscapes

  • Resistance Heating (AREA)
JP2023545476A 2021-08-31 2022-08-23 加熱装置 Active JP7783285B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021141106 2021-08-31
JP2021141106 2021-08-31
PCT/JP2022/031708 WO2023032755A1 (ja) 2021-08-31 2022-08-23 加熱装置

Publications (3)

Publication Number Publication Date
JPWO2023032755A1 JPWO2023032755A1 (https=) 2023-03-09
JPWO2023032755A5 JPWO2023032755A5 (https=) 2024-05-17
JP7783285B2 true JP7783285B2 (ja) 2025-12-09

Family

ID=85412514

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023545476A Active JP7783285B2 (ja) 2021-08-31 2022-08-23 加熱装置

Country Status (2)

Country Link
JP (1) JP7783285B2 (https=)
WO (1) WO2023032755A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003060017A (ja) 2001-08-10 2003-02-28 Kyocera Corp 電極内蔵セラミック部材及びその製造方法
JP2004071182A (ja) 2002-08-01 2004-03-04 Ngk Spark Plug Co Ltd 複合ヒータ
WO2004089039A1 (ja) 2003-03-31 2004-10-14 Ibiden Co., Ltd. 半導体製造・検査装置用ヒータ
JP2016143760A (ja) 2015-02-02 2016-08-08 住友大阪セメント株式会社 静電チャック装置
JP2016207595A (ja) 2015-04-28 2016-12-08 日本特殊陶業株式会社 加熱装置
JP2017037721A (ja) 2015-08-07 2017-02-16 日本発條株式会社 ヒータユニット
JP2020004892A (ja) 2018-06-29 2020-01-09 日本特殊陶業株式会社 基板保持部材及びその製造方法
JP2020057763A (ja) 2018-09-27 2020-04-09 東京エレクトロン株式会社 基板処理装置および基板処理方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003060017A (ja) 2001-08-10 2003-02-28 Kyocera Corp 電極内蔵セラミック部材及びその製造方法
JP2004071182A (ja) 2002-08-01 2004-03-04 Ngk Spark Plug Co Ltd 複合ヒータ
WO2004089039A1 (ja) 2003-03-31 2004-10-14 Ibiden Co., Ltd. 半導体製造・検査装置用ヒータ
JP2016143760A (ja) 2015-02-02 2016-08-08 住友大阪セメント株式会社 静電チャック装置
JP2016207595A (ja) 2015-04-28 2016-12-08 日本特殊陶業株式会社 加熱装置
JP2017037721A (ja) 2015-08-07 2017-02-16 日本発條株式会社 ヒータユニット
JP2020004892A (ja) 2018-06-29 2020-01-09 日本特殊陶業株式会社 基板保持部材及びその製造方法
JP2020057763A (ja) 2018-09-27 2020-04-09 東京エレクトロン株式会社 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
WO2023032755A1 (ja) 2023-03-09
JPWO2023032755A1 (https=) 2023-03-09

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