JPWO2023032755A1 - - Google Patents
Info
- Publication number
- JPWO2023032755A1 JPWO2023032755A1 JP2023545476A JP2023545476A JPWO2023032755A1 JP WO2023032755 A1 JPWO2023032755 A1 JP WO2023032755A1 JP 2023545476 A JP2023545476 A JP 2023545476A JP 2023545476 A JP2023545476 A JP 2023545476A JP WO2023032755 A1 JPWO2023032755 A1 JP WO2023032755A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/06—Heater elements structurally combined with coupling elements or holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
- H05B3/72—Plates of sheet metal
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021141106 | 2021-08-31 | ||
| JP2021141106 | 2021-08-31 | ||
| PCT/JP2022/031708 WO2023032755A1 (ja) | 2021-08-31 | 2022-08-23 | 加熱装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023032755A1 true JPWO2023032755A1 (https=) | 2023-03-09 |
| JPWO2023032755A5 JPWO2023032755A5 (https=) | 2024-05-17 |
| JP7783285B2 JP7783285B2 (ja) | 2025-12-09 |
Family
ID=85412514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023545476A Active JP7783285B2 (ja) | 2021-08-31 | 2022-08-23 | 加熱装置 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7783285B2 (https=) |
| WO (1) | WO2023032755A1 (https=) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003060017A (ja) * | 2001-08-10 | 2003-02-28 | Kyocera Corp | 電極内蔵セラミック部材及びその製造方法 |
| JP2004071182A (ja) * | 2002-08-01 | 2004-03-04 | Ngk Spark Plug Co Ltd | 複合ヒータ |
| WO2004089039A1 (ja) * | 2003-03-31 | 2004-10-14 | Ibiden Co., Ltd. | 半導体製造・検査装置用ヒータ |
| JP2016143760A (ja) * | 2015-02-02 | 2016-08-08 | 住友大阪セメント株式会社 | 静電チャック装置 |
| JP2016207595A (ja) * | 2015-04-28 | 2016-12-08 | 日本特殊陶業株式会社 | 加熱装置 |
| JP2017037721A (ja) * | 2015-08-07 | 2017-02-16 | 日本発條株式会社 | ヒータユニット |
| JP2020004892A (ja) * | 2018-06-29 | 2020-01-09 | 日本特殊陶業株式会社 | 基板保持部材及びその製造方法 |
| JP2020057763A (ja) * | 2018-09-27 | 2020-04-09 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
-
2022
- 2022-08-23 JP JP2023545476A patent/JP7783285B2/ja active Active
- 2022-08-23 WO PCT/JP2022/031708 patent/WO2023032755A1/ja not_active Ceased
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003060017A (ja) * | 2001-08-10 | 2003-02-28 | Kyocera Corp | 電極内蔵セラミック部材及びその製造方法 |
| JP2004071182A (ja) * | 2002-08-01 | 2004-03-04 | Ngk Spark Plug Co Ltd | 複合ヒータ |
| WO2004089039A1 (ja) * | 2003-03-31 | 2004-10-14 | Ibiden Co., Ltd. | 半導体製造・検査装置用ヒータ |
| JP2016143760A (ja) * | 2015-02-02 | 2016-08-08 | 住友大阪セメント株式会社 | 静電チャック装置 |
| JP2016207595A (ja) * | 2015-04-28 | 2016-12-08 | 日本特殊陶業株式会社 | 加熱装置 |
| JP2017037721A (ja) * | 2015-08-07 | 2017-02-16 | 日本発條株式会社 | ヒータユニット |
| JP2020004892A (ja) * | 2018-06-29 | 2020-01-09 | 日本特殊陶業株式会社 | 基板保持部材及びその製造方法 |
| JP2020057763A (ja) * | 2018-09-27 | 2020-04-09 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023032755A1 (ja) | 2023-03-09 |
| JP7783285B2 (ja) | 2025-12-09 |
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