JP7761574B2 - 表示素子用封止剤、その硬化物および表示装置 - Google Patents

表示素子用封止剤、その硬化物および表示装置

Info

Publication number
JP7761574B2
JP7761574B2 JP2022550606A JP2022550606A JP7761574B2 JP 7761574 B2 JP7761574 B2 JP 7761574B2 JP 2022550606 A JP2022550606 A JP 2022550606A JP 2022550606 A JP2022550606 A JP 2022550606A JP 7761574 B2 JP7761574 B2 JP 7761574B2
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JP
Japan
Prior art keywords
sealant
mass
meth
acrylate
display elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022550606A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022059740A1 (https=
Inventor
裕介 富田
航太郎 舘野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Chemicals Inc
Original Assignee
Mitsui Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Publication of JPWO2022059740A1 publication Critical patent/JPWO2022059740A1/ja
Application granted granted Critical
Publication of JP7761574B2 publication Critical patent/JP7761574B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
JP2022550606A 2020-09-18 2021-09-16 表示素子用封止剤、その硬化物および表示装置 Active JP7761574B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020157660 2020-09-18
JP2020157660 2020-09-18
PCT/JP2021/034151 WO2022059740A1 (ja) 2020-09-18 2021-09-16 表示素子用封止剤、その硬化物および表示装置

Publications (2)

Publication Number Publication Date
JPWO2022059740A1 JPWO2022059740A1 (https=) 2022-03-24
JP7761574B2 true JP7761574B2 (ja) 2025-10-28

Family

ID=80776699

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022550606A Active JP7761574B2 (ja) 2020-09-18 2021-09-16 表示素子用封止剤、その硬化物および表示装置

Country Status (5)

Country Link
JP (1) JP7761574B2 (https=)
KR (1) KR102734885B1 (https=)
CN (1) CN115804245B (https=)
TW (1) TWI890854B (https=)
WO (1) WO2022059740A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7849401B2 (ja) * 2024-02-19 2026-04-21 デンカ株式会社 組成物、硬化体、および、表示装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012190612A (ja) 2011-03-09 2012-10-04 Sekisui Chem Co Ltd 有機光デバイスの製造方法
WO2019203071A1 (ja) 2018-04-16 2019-10-24 デンカ株式会社 有機エレクトロルミネッセンス表示素子用封止剤
WO2019230846A1 (ja) 2018-05-30 2019-12-05 デンカ株式会社 有機エレクトロルミネッセンス表示素子用封止剤

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2980611A4 (en) * 2013-03-28 2016-03-23 Mitsubishi Rayon Co OPTICAL FILM, PRODUCTION METHOD FOR OPTICAL FILM AND SURFACE-EMBROIDERING BODY
JP2017061606A (ja) * 2015-09-24 2017-03-30 Jsr株式会社 硬化性組成物、硬化物、硬化物の形成方法、積層体及び有機ｅｌデバイス
JPWO2018051732A1 (ja) * 2016-09-15 2019-06-27 Jnc株式会社 インク組成物およびこれを用いた有機電界発光素子
JP6818761B2 (ja) * 2016-10-14 2021-01-20 デンカ株式会社 組成物
KR102658948B1 (ko) * 2017-06-15 2024-04-18 세키스이가가쿠 고교가부시키가이샤 유기 el 표시 소자용 봉지제
JP6936330B2 (ja) * 2017-10-26 2021-09-15 デンカ株式会社 有機エレクトロルミネッセンス表示素子用封止剤
KR20190107262A (ko) * 2018-03-09 2019-09-19 삼성디스플레이 주식회사 전자 장치 및 이의 제조 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012190612A (ja) 2011-03-09 2012-10-04 Sekisui Chem Co Ltd 有機光デバイスの製造方法
WO2019203071A1 (ja) 2018-04-16 2019-10-24 デンカ株式会社 有機エレクトロルミネッセンス表示素子用封止剤
WO2019230846A1 (ja) 2018-05-30 2019-12-05 デンカ株式会社 有機エレクトロルミネッセンス表示素子用封止剤

Also Published As

Publication number Publication date
CN115804245B (zh) 2025-09-12
CN115804245A (zh) 2023-03-14
KR20230022967A (ko) 2023-02-16
TWI890854B (zh) 2025-07-21
WO2022059740A1 (ja) 2022-03-24
TW202214814A (zh) 2022-04-16
JPWO2022059740A1 (https=) 2022-03-24
KR102734885B1 (ko) 2024-11-26

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