JP7759881B2 - 斜行流路を有するガス分配フェースプレート - Google Patents

斜行流路を有するガス分配フェースプレート

Info

Publication number
JP7759881B2
JP7759881B2 JP2022545970A JP2022545970A JP7759881B2 JP 7759881 B2 JP7759881 B2 JP 7759881B2 JP 2022545970 A JP2022545970 A JP 2022545970A JP 2022545970 A JP2022545970 A JP 2022545970A JP 7759881 B2 JP7759881 B2 JP 7759881B2
Authority
JP
Japan
Prior art keywords
gas
passages
ports
inlet
showerhead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022545970A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023513001A (ja
JP2023513001A5 (enExample
Inventor
ポヴォルニー・ヘンリー・スティーブン
ベイリー・ザサード・アンドリュー・ディー．
ラ レラ・アンソニー デ
サーモロ・ネビユ・バーシュラ
トカイリン・ショーン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of JP2023513001A publication Critical patent/JP2023513001A/ja
Publication of JP2023513001A5 publication Critical patent/JP2023513001A5/ja
Priority to JP2025116292A priority Critical patent/JP2025143469A/ja
Application granted granted Critical
Publication of JP7759881B2 publication Critical patent/JP7759881B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/14—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening
    • B05B1/18—Roses; Shower heads
    • B05B1/185—Roses; Shower heads characterised by their outlet element; Mounting arrangements therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/005—Nozzles or other outlets specially adapted for discharging one or more gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/14—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening
    • B05B1/18—Roses; Shower heads
    • B05B1/182—Roses; Shower heads characterised by their outlet openings or elements; Mounting arrangements therefor
    • B05B1/1821—Roses; Shower heads characterised by their outlet openings or elements; Mounting arrangements therefor the outlet openings arranged in plural groups or rows
    • B05B1/1822—Roses; Shower heads characterised by their outlet openings or elements; Mounting arrangements therefor the outlet openings arranged in plural groups or rows with all groups or rows being identical
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/14—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening
    • B05B1/18—Roses; Shower heads
    • B05B1/182—Roses; Shower heads characterised by their outlet openings or elements; Mounting arrangements therefor
    • B05B1/1821—Roses; Shower heads characterised by their outlet openings or elements; Mounting arrangements therefor the outlet openings arranged in plural groups or rows
    • B05B1/1823—Concentric or coaxial groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0421—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0426—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0471—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one ion or electron beam chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
JP2022545970A 2020-01-29 2021-01-28 斜行流路を有するガス分配フェースプレート Active JP7759881B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025116292A JP2025143469A (ja) 2020-01-29 2025-07-10 斜行流路を有するガス分配フェースプレート

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202062967197P 2020-01-29 2020-01-29
US62/967,197 2020-01-29
PCT/US2021/015430 WO2021154950A1 (en) 2020-01-29 2021-01-28 Gas distribution faceplate with oblique flow paths

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025116292A Division JP2025143469A (ja) 2020-01-29 2025-07-10 斜行流路を有するガス分配フェースプレート

Publications (3)

Publication Number Publication Date
JP2023513001A JP2023513001A (ja) 2023-03-30
JP2023513001A5 JP2023513001A5 (enExample) 2024-02-05
JP7759881B2 true JP7759881B2 (ja) 2025-10-24

Family

ID=77079437

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022545970A Active JP7759881B2 (ja) 2020-01-29 2021-01-28 斜行流路を有するガス分配フェースプレート
JP2025116292A Pending JP2025143469A (ja) 2020-01-29 2025-07-10 斜行流路を有するガス分配フェースプレート

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025116292A Pending JP2025143469A (ja) 2020-01-29 2025-07-10 斜行流路を有するガス分配フェースプレート

Country Status (6)

Country Link
US (1) US12654181B2 (enExample)
JP (2) JP7759881B2 (enExample)
KR (1) KR20220130758A (enExample)
CN (1) CN115315776A (enExample)
TW (1) TWI900524B (enExample)
WO (1) WO2021154950A1 (enExample)

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US12030135B2 (en) 2020-10-14 2024-07-09 Applied Materials, Inc. Methods to fabricate chamber component holes using laser drilling
US11819948B2 (en) 2020-10-14 2023-11-21 Applied Materials, Inc. Methods to fabricate chamber component holes using laser drilling
TW202509995A (zh) * 2023-04-04 2025-03-01 日商東京威力科創股份有限公司 電漿處理裝置及電漿處理裝置內構件

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JP2018082150A (ja) 2016-10-04 2018-05-24 アプライド マテリアルズ インコーポレイテッドApplied Materials, Incorporated 改善したプロファイルを有するデュアルチャネルシャワーヘッド

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