KR20220130758A - 사선 플로우 경로들 (oblique flow paths) 을 갖는 가스 분배 대면 플레이트 (faceplate) - Google Patents

사선 플로우 경로들 (oblique flow paths) 을 갖는 가스 분배 대면 플레이트 (faceplate) Download PDF

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Publication number
KR20220130758A
KR20220130758A KR1020227028703A KR20227028703A KR20220130758A KR 20220130758 A KR20220130758 A KR 20220130758A KR 1020227028703 A KR1020227028703 A KR 1020227028703A KR 20227028703 A KR20227028703 A KR 20227028703A KR 20220130758 A KR20220130758 A KR 20220130758A
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South Korea
Prior art keywords
gas
ports
passages
inlet
cluster
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English (en)
Korean (ko)
Inventor
헨리 스티븐 포볼니
엔드류 디. 베일리 3세
앤서니 데 라 예라
네비유 바술라 세르몰로
숀 토카이린
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램 리써치 코포레이션
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/14—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening
    • B05B1/18—Roses; Shower heads
    • B05B1/185—Roses; Shower heads characterised by their outlet element; Mounting arrangements therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/005—Nozzles or other outlets specially adapted for discharging one or more gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/14—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening
    • B05B1/18—Roses; Shower heads
    • B05B1/182—Roses; Shower heads characterised by their outlet openings or elements; Mounting arrangements therefor
    • B05B1/1821—Roses; Shower heads characterised by their outlet openings or elements; Mounting arrangements therefor the outlet openings arranged in plural groups or rows
    • B05B1/1822—Roses; Shower heads characterised by their outlet openings or elements; Mounting arrangements therefor the outlet openings arranged in plural groups or rows with all groups or rows being identical
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/14—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening
    • B05B1/18—Roses; Shower heads
    • B05B1/182—Roses; Shower heads characterised by their outlet openings or elements; Mounting arrangements therefor
    • B05B1/1821—Roses; Shower heads characterised by their outlet openings or elements; Mounting arrangements therefor the outlet openings arranged in plural groups or rows
    • B05B1/1823—Concentric or coaxial groups
    • H01L21/67017—
    • H01L21/67069—
    • H01L21/6708—
    • H01L21/67086—
    • H01L21/67213—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0421—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0426—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0471—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one ion or electron beam chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
KR1020227028703A 2020-01-29 2021-01-28 사선 플로우 경로들 (oblique flow paths) 을 갖는 가스 분배 대면 플레이트 (faceplate) Pending KR20220130758A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202062967197P 2020-01-29 2020-01-29
US62/967,197 2020-01-29
PCT/US2021/015430 WO2021154950A1 (en) 2020-01-29 2021-01-28 Gas distribution faceplate with oblique flow paths

Publications (1)

Publication Number Publication Date
KR20220130758A true KR20220130758A (ko) 2022-09-27

Family

ID=77079437

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227028703A Pending KR20220130758A (ko) 2020-01-29 2021-01-28 사선 플로우 경로들 (oblique flow paths) 을 갖는 가스 분배 대면 플레이트 (faceplate)

Country Status (6)

Country Link
US (1) US12654181B2 (enExample)
JP (2) JP7759881B2 (enExample)
KR (1) KR20220130758A (enExample)
CN (1) CN115315776A (enExample)
TW (1) TWI900524B (enExample)
WO (1) WO2021154950A1 (enExample)

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TW202509995A (zh) * 2023-04-04 2025-03-01 日商東京威力科創股份有限公司 電漿處理裝置及電漿處理裝置內構件

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Publication number Publication date
CN115315776A (zh) 2022-11-08
JP2023513001A (ja) 2023-03-30
JP2025143469A (ja) 2025-10-01
JP7759881B2 (ja) 2025-10-24
TWI900524B (zh) 2025-10-11
US20230057217A1 (en) 2023-02-23
TW202140841A (zh) 2021-11-01
WO2021154950A1 (en) 2021-08-05
US12654181B2 (en) 2026-06-16

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