JP7751084B2 - 電子機器 - Google Patents

電子機器

Info

Publication number
JP7751084B2
JP7751084B2 JP2024514826A JP2024514826A JP7751084B2 JP 7751084 B2 JP7751084 B2 JP 7751084B2 JP 2024514826 A JP2024514826 A JP 2024514826A JP 2024514826 A JP2024514826 A JP 2024514826A JP 7751084 B2 JP7751084 B2 JP 7751084B2
Authority
JP
Japan
Prior art keywords
base plate
circuit board
contact
heat
shield
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024514826A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023199608A5 (https=
JPWO2023199608A1 (https=
Inventor
卓之 蜂谷
祐太 玉樹
真也 土田
鉄文 野澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Interactive Entertainment Inc
Original Assignee
Sony Interactive Entertainment Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Interactive Entertainment Inc filed Critical Sony Interactive Entertainment Inc
Publication of JPWO2023199608A1 publication Critical patent/JPWO2023199608A1/ja
Publication of JPWO2023199608A5 publication Critical patent/JPWO2023199608A5/ja
Application granted granted Critical
Publication of JP7751084B2 publication Critical patent/JP7751084B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10212—Programmable component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP2024514826A 2022-04-11 2023-02-21 電子機器 Active JP7751084B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022065379 2022-04-11
JP2022065379 2022-04-11
PCT/JP2023/006291 WO2023199608A1 (ja) 2022-04-11 2023-02-21 電子機器

Publications (3)

Publication Number Publication Date
JPWO2023199608A1 JPWO2023199608A1 (https=) 2023-10-19
JPWO2023199608A5 JPWO2023199608A5 (https=) 2024-12-24
JP7751084B2 true JP7751084B2 (ja) 2025-10-07

Family

ID=88329233

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024514826A Active JP7751084B2 (ja) 2022-04-11 2023-02-21 電子機器

Country Status (5)

Country Link
US (1) US20250240866A1 (https=)
EP (1) EP4510799A4 (https=)
JP (1) JP7751084B2 (https=)
CN (1) CN118923220A (https=)
WO (1) WO2023199608A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025216088A1 (ja) * 2024-04-08 2025-10-16 株式会社ソニー・インタラクティブエンタテインメント 電子機器
WO2025216086A1 (ja) * 2024-04-08 2025-10-16 株式会社ソニー・インタラクティブエンタテインメント 電子機器

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150201533A1 (en) 2013-01-15 2015-07-16 Earl Anthony Daughtry, JR. Heat-Dissipating EMI/RFI Shield
US20170112022A1 (en) 2015-10-19 2017-04-20 Fujitsu Limited Heat sink and electronic apparatus
JP2017135368A (ja) 2015-12-22 2017-08-03 トムソン ライセンシングＴｈｏｍｓｏｎ Ｌｉｃｅｎｓｉｎｇ 開口窓熱伝達経路を用いた電子回路基板の遮蔽
WO2021193621A1 (ja) 2020-03-27 2021-09-30 株式会社ソニー・インタラクティブエンタテインメント 電子機器
WO2021193879A1 (ja) 2020-03-27 2021-09-30 株式会社ソニー・インタラクティブエンタテインメント 電子機器
WO2021193882A1 (ja) 2020-03-27 2021-09-30 株式会社ソニー・インタラクティブエンタテインメント 電子機器
US20210385982A1 (en) 2017-09-29 2021-12-09 Interdigital Ce Patent Holdings Apparatus for use in electronic equipment

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0563098U (ja) * 1992-01-31 1993-08-20 日本電気株式会社 通信機器のハウジング構造
JP2013038243A (ja) * 2011-08-09 2013-02-21 Kyocera Corp シールド構造体及び携帯端末
EP2933833A1 (en) * 2014-04-16 2015-10-21 Thomson Licensing Electromagnetic shielding device
EP3200226B1 (en) * 2014-10-17 2021-12-29 Huawei Technologies Co., Ltd. Heat dissipation shielding structure and communication product
WO2016159382A1 (ja) * 2015-04-03 2016-10-06 株式会社ソニー・インタラクティブエンタテインメント 電子機器
JP6691495B2 (ja) 2017-03-06 2020-04-28 株式会社ソニー・インタラクティブエンタテインメント 電子機器
CN111713184A (zh) * 2018-02-19 2020-09-25 交互数字Ce专利控股公司 用于电子设备的散热器组件

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150201533A1 (en) 2013-01-15 2015-07-16 Earl Anthony Daughtry, JR. Heat-Dissipating EMI/RFI Shield
US20170112022A1 (en) 2015-10-19 2017-04-20 Fujitsu Limited Heat sink and electronic apparatus
JP2017135368A (ja) 2015-12-22 2017-08-03 トムソン ライセンシングＴｈｏｍｓｏｎ Ｌｉｃｅｎｓｉｎｇ 開口窓熱伝達経路を用いた電子回路基板の遮蔽
US20210385982A1 (en) 2017-09-29 2021-12-09 Interdigital Ce Patent Holdings Apparatus for use in electronic equipment
WO2021193621A1 (ja) 2020-03-27 2021-09-30 株式会社ソニー・インタラクティブエンタテインメント 電子機器
WO2021193879A1 (ja) 2020-03-27 2021-09-30 株式会社ソニー・インタラクティブエンタテインメント 電子機器
WO2021193882A1 (ja) 2020-03-27 2021-09-30 株式会社ソニー・インタラクティブエンタテインメント 電子機器

Also Published As

Publication number Publication date
WO2023199608A1 (ja) 2023-10-19
CN118923220A (zh) 2024-11-08
EP4510799A4 (en) 2026-04-15
US20250240866A1 (en) 2025-07-24
JPWO2023199608A1 (https=) 2023-10-19
EP4510799A1 (en) 2025-02-19

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