CN118923220A - 电子设备 - Google Patents

电子设备 Download PDF

Info

Publication number
CN118923220A
CN118923220A CN202380029673.7A CN202380029673A CN118923220A CN 118923220 A CN118923220 A CN 118923220A CN 202380029673 A CN202380029673 A CN 202380029673A CN 118923220 A CN118923220 A CN 118923220A
Authority
CN
China
Prior art keywords
circuit board
substrate
heat
chip
protruding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380029673.7A
Other languages
English (en)
Chinese (zh)
Inventor
蜂谷卓之
玉树祐太
土田真也
野泽铁文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Interactive Entertainment Inc
Original Assignee
Sony Interactive Entertainment Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Interactive Entertainment Inc filed Critical Sony Interactive Entertainment Inc
Publication of CN118923220A publication Critical patent/CN118923220A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10212—Programmable component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
CN202380029673.7A 2022-04-11 2023-02-21 电子设备 Pending CN118923220A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-065379 2022-04-11
JP2022065379 2022-04-11
PCT/JP2023/006291 WO2023199608A1 (ja) 2022-04-11 2023-02-21 電子機器

Publications (1)

Publication Number Publication Date
CN118923220A true CN118923220A (zh) 2024-11-08

Family

ID=88329233

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380029673.7A Pending CN118923220A (zh) 2022-04-11 2023-02-21 电子设备

Country Status (5)

Country Link
US (1) US20250240866A1 (https=)
EP (1) EP4510799A4 (https=)
JP (1) JP7751084B2 (https=)
CN (1) CN118923220A (https=)
WO (1) WO2023199608A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025216088A1 (ja) * 2024-04-08 2025-10-16 株式会社ソニー・インタラクティブエンタテインメント 電子機器
WO2025216086A1 (ja) * 2024-04-08 2025-10-16 株式会社ソニー・インタラクティブエンタテインメント 電子機器

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0563098U (ja) * 1992-01-31 1993-08-20 日本電気株式会社 通信機器のハウジング構造
JP2013038243A (ja) * 2011-08-09 2013-02-21 Kyocera Corp シールド構造体及び携帯端末
US9439333B2 (en) * 2013-01-15 2016-09-06 Genesis Technology Usa, Inc. Heat-dissipating EMI/RFI shield
EP2933833A1 (en) * 2014-04-16 2015-10-21 Thomson Licensing Electromagnetic shielding device
EP3200226B1 (en) * 2014-10-17 2021-12-29 Huawei Technologies Co., Ltd. Heat dissipation shielding structure and communication product
WO2016159382A1 (ja) * 2015-04-03 2016-10-06 株式会社ソニー・インタラクティブエンタテインメント 電子機器
JP2017079226A (ja) * 2015-10-19 2017-04-27 富士通株式会社 ヒートシンクおよび電子機器
US20170181266A1 (en) * 2015-12-22 2017-06-22 Thomson Licensing Electronic circuit board shielding with open window heat transfer path
JP6691495B2 (ja) 2017-03-06 2020-04-28 株式会社ソニー・インタラクティブエンタテインメント 電子機器
WO2019061284A1 (en) * 2017-09-29 2019-04-04 Interdigital Ce Patent Holdings APPARATUS FOR USE IN ELECTRONIC EQUIPMENT
CN111713184A (zh) * 2018-02-19 2020-09-25 交互数字Ce专利控股公司 用于电子设备的散热器组件
WO2021193621A1 (ja) * 2020-03-27 2021-09-30 株式会社ソニー・インタラクティブエンタテインメント 電子機器
CN115245063B (zh) * 2020-03-27 2025-11-11 索尼互动娱乐股份有限公司 电子设备
JP7542608B2 (ja) * 2020-03-27 2024-08-30 株式会社ソニー・インタラクティブエンタテインメント 電子機器

Also Published As

Publication number Publication date
WO2023199608A1 (ja) 2023-10-19
EP4510799A4 (en) 2026-04-15
US20250240866A1 (en) 2025-07-24
JP7751084B2 (ja) 2025-10-07
JPWO2023199608A1 (https=) 2023-10-19
EP4510799A1 (en) 2025-02-19

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