JPWO2023199608A1 - - Google Patents

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Publication number
JPWO2023199608A1
JPWO2023199608A1 JP2024514826A JP2024514826A JPWO2023199608A1 JP WO2023199608 A1 JPWO2023199608 A1 JP WO2023199608A1 JP 2024514826 A JP2024514826 A JP 2024514826A JP 2024514826 A JP2024514826 A JP 2024514826A JP WO2023199608 A1 JPWO2023199608 A1 JP WO2023199608A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024514826A
Other languages
Japanese (ja)
Other versions
JPWO2023199608A5 (https=
JP7751084B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023199608A1 publication Critical patent/JPWO2023199608A1/ja
Publication of JPWO2023199608A5 publication Critical patent/JPWO2023199608A5/ja
Application granted granted Critical
Publication of JP7751084B2 publication Critical patent/JP7751084B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10212—Programmable component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP2024514826A 2022-04-11 2023-02-21 電子機器 Active JP7751084B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022065379 2022-04-11
JP2022065379 2022-04-11
PCT/JP2023/006291 WO2023199608A1 (ja) 2022-04-11 2023-02-21 電子機器

Publications (3)

Publication Number Publication Date
JPWO2023199608A1 true JPWO2023199608A1 (https=) 2023-10-19
JPWO2023199608A5 JPWO2023199608A5 (https=) 2024-12-24
JP7751084B2 JP7751084B2 (ja) 2025-10-07

Family

ID=88329233

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024514826A Active JP7751084B2 (ja) 2022-04-11 2023-02-21 電子機器

Country Status (5)

Country Link
US (1) US20250240866A1 (https=)
EP (1) EP4510799A4 (https=)
JP (1) JP7751084B2 (https=)
CN (1) CN118923220A (https=)
WO (1) WO2023199608A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025216088A1 (ja) * 2024-04-08 2025-10-16 株式会社ソニー・インタラクティブエンタテインメント 電子機器
WO2025216086A1 (ja) * 2024-04-08 2025-10-16 株式会社ソニー・インタラクティブエンタテインメント 電子機器

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0563098U (ja) * 1992-01-31 1993-08-20 日本電気株式会社 通信機器のハウジング構造
US20150201533A1 (en) * 2013-01-15 2015-07-16 Earl Anthony Daughtry, JR. Heat-Dissipating EMI/RFI Shield
US20170112022A1 (en) * 2015-10-19 2017-04-20 Fujitsu Limited Heat sink and electronic apparatus
JP2017135368A (ja) * 2015-12-22 2017-08-03 トムソン ライセンシングＴｈｏｍｓｏｎ Ｌｉｃｅｎｓｉｎｇ 開口窓熱伝達経路を用いた電子回路基板の遮蔽
WO2021193621A1 (ja) * 2020-03-27 2021-09-30 株式会社ソニー・インタラクティブエンタテインメント 電子機器
WO2021193879A1 (ja) * 2020-03-27 2021-09-30 株式会社ソニー・インタラクティブエンタテインメント 電子機器
WO2021193882A1 (ja) * 2020-03-27 2021-09-30 株式会社ソニー・インタラクティブエンタテインメント 電子機器
US20210385982A1 (en) * 2017-09-29 2021-12-09 Interdigital Ce Patent Holdings Apparatus for use in electronic equipment

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013038243A (ja) * 2011-08-09 2013-02-21 Kyocera Corp シールド構造体及び携帯端末
EP2933833A1 (en) * 2014-04-16 2015-10-21 Thomson Licensing Electromagnetic shielding device
EP3200226B1 (en) * 2014-10-17 2021-12-29 Huawei Technologies Co., Ltd. Heat dissipation shielding structure and communication product
WO2016159382A1 (ja) * 2015-04-03 2016-10-06 株式会社ソニー・インタラクティブエンタテインメント 電子機器
JP6691495B2 (ja) 2017-03-06 2020-04-28 株式会社ソニー・インタラクティブエンタテインメント 電子機器
CN111713184A (zh) * 2018-02-19 2020-09-25 交互数字Ce专利控股公司 用于电子设备的散热器组件

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0563098U (ja) * 1992-01-31 1993-08-20 日本電気株式会社 通信機器のハウジング構造
US20150201533A1 (en) * 2013-01-15 2015-07-16 Earl Anthony Daughtry, JR. Heat-Dissipating EMI/RFI Shield
US20170112022A1 (en) * 2015-10-19 2017-04-20 Fujitsu Limited Heat sink and electronic apparatus
JP2017135368A (ja) * 2015-12-22 2017-08-03 トムソン ライセンシングＴｈｏｍｓｏｎ Ｌｉｃｅｎｓｉｎｇ 開口窓熱伝達経路を用いた電子回路基板の遮蔽
US20210385982A1 (en) * 2017-09-29 2021-12-09 Interdigital Ce Patent Holdings Apparatus for use in electronic equipment
WO2021193621A1 (ja) * 2020-03-27 2021-09-30 株式会社ソニー・インタラクティブエンタテインメント 電子機器
WO2021193879A1 (ja) * 2020-03-27 2021-09-30 株式会社ソニー・インタラクティブエンタテインメント 電子機器
WO2021193882A1 (ja) * 2020-03-27 2021-09-30 株式会社ソニー・インタラクティブエンタテインメント 電子機器

Also Published As

Publication number Publication date
WO2023199608A1 (ja) 2023-10-19
CN118923220A (zh) 2024-11-08
EP4510799A4 (en) 2026-04-15
US20250240866A1 (en) 2025-07-24
JP7751084B2 (ja) 2025-10-07
EP4510799A1 (en) 2025-02-19

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