JP7745154B2 - ベーパーチャンバ用のウィックシート、ベーパーチャンバおよび電子機器 - Google Patents

ベーパーチャンバ用のウィックシート、ベーパーチャンバおよび電子機器

Info

Publication number
JP7745154B2
JP7745154B2 JP2021021944A JP2021021944A JP7745154B2 JP 7745154 B2 JP7745154 B2 JP 7745154B2 JP 2021021944 A JP2021021944 A JP 2021021944A JP 2021021944 A JP2021021944 A JP 2021021944A JP 7745154 B2 JP7745154 B2 JP 7745154B2
Authority
JP
Japan
Prior art keywords
flow path
liquid storage
liquid
sheet
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021021944A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021092388A (ja
JP2021092388A5 (enExample
Inventor
和範 小田
利彦 武田
伸一郎 高橋
貴之 太田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2020565506A external-priority patent/JP6856827B1/ja
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Publication of JP2021092388A publication Critical patent/JP2021092388A/ja
Publication of JP2021092388A5 publication Critical patent/JP2021092388A5/ja
Application granted granted Critical
Publication of JP7745154B2 publication Critical patent/JP7745154B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Physical Vapour Deposition (AREA)
JP2021021944A 2019-10-09 2021-02-15 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよび電子機器 Active JP7745154B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2019186194 2019-10-09
JP2019186194 2019-10-09
JP2019186221 2019-10-09
JP2019186221 2019-10-09
JP2020565506A JP6856827B1 (ja) 2019-10-09 2020-09-09 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよび電子機器

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2020565506A Division JP6856827B1 (ja) 2019-10-09 2020-09-09 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよび電子機器

Publications (3)

Publication Number Publication Date
JP2021092388A JP2021092388A (ja) 2021-06-17
JP2021092388A5 JP2021092388A5 (enExample) 2023-09-11
JP7745154B2 true JP7745154B2 (ja) 2025-09-29

Family

ID=75437878

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021021944A Active JP7745154B2 (ja) 2019-10-09 2021-02-15 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよび電子機器

Country Status (3)

Country Link
JP (1) JP7745154B2 (enExample)
CN (1) CN112956286B (enExample)
WO (1) WO2021070544A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240224469A1 (en) * 2021-04-27 2024-07-04 Dai Nippon Printing Co., Ltd. Vapor chamber, wick sheet for vapor chamber, and electronic apparatus

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140060780A1 (en) 2012-08-29 2014-03-06 Electronics And Telecommunications Research Institute Flat heat pipe and fabrication method thereof
US20180156545A1 (en) 2016-12-05 2018-06-07 Microsoft Technology Licensing, Llc Vapor chamber with three-dimensional printed spanning structure
JP2019039662A (ja) 2017-08-24 2019-03-14 大日本印刷株式会社 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよびベーパーチャンバの製造方法
JP2019066175A (ja) 2017-09-28 2019-04-25 大日本印刷株式会社 ベーパーチャンバ、電子機器およびベーパーチャンバ用金属シート
WO2019088031A1 (ja) 2017-11-02 2019-05-09 オムロン株式会社 人集結分析装置、移動先予定作成装置、人集結分析システム、車両、および、人集結分析プログラム
JP2019070512A (ja) 2017-10-06 2019-05-09 大日本印刷株式会社 ベーパーチャンバ、電子機器およびベーパーチャンバ用金属シート

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7203064B2 (en) * 2003-12-12 2007-04-10 Intel Corporation Heat exchanger with cooling channels having varying geometry
US7234513B2 (en) * 2004-02-24 2007-06-26 National Tsing Hua University Microchannel flat-plate heat pipe with parallel grooves for recycling coolant
JP2007266153A (ja) * 2006-03-28 2007-10-11 Sony Corp プレート型熱輸送装置及び電子機器
JP2010014292A (ja) * 2008-07-01 2010-01-21 Sony Corp 熱輸送デバイス、電子機器及び積層構造体
JP2015225709A (ja) * 2014-05-26 2015-12-14 トヨタ自動車株式会社 燃料電池用のセパレータおよび燃料電池
JP6433848B2 (ja) * 2015-05-01 2018-12-05 国立大学法人名古屋大学 熱交換器、蒸発体、および電子機器
CN105592671A (zh) * 2016-03-11 2016-05-18 苏州市万松电气有限公司 采用热管散热器的列车供电箱
JP6801700B2 (ja) * 2017-11-10 2020-12-16 大日本印刷株式会社 ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法
TWI897457B (zh) * 2019-03-11 2025-09-11 日商大日本印刷股份有限公司 蒸氣腔、電子機器及蒸氣腔用片材

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140060780A1 (en) 2012-08-29 2014-03-06 Electronics And Telecommunications Research Institute Flat heat pipe and fabrication method thereof
US20180156545A1 (en) 2016-12-05 2018-06-07 Microsoft Technology Licensing, Llc Vapor chamber with three-dimensional printed spanning structure
JP2019039662A (ja) 2017-08-24 2019-03-14 大日本印刷株式会社 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよびベーパーチャンバの製造方法
JP2019066175A (ja) 2017-09-28 2019-04-25 大日本印刷株式会社 ベーパーチャンバ、電子機器およびベーパーチャンバ用金属シート
JP2019070512A (ja) 2017-10-06 2019-05-09 大日本印刷株式会社 ベーパーチャンバ、電子機器およびベーパーチャンバ用金属シート
WO2019088031A1 (ja) 2017-11-02 2019-05-09 オムロン株式会社 人集結分析装置、移動先予定作成装置、人集結分析システム、車両、および、人集結分析プログラム

Also Published As

Publication number Publication date
JP2021092388A (ja) 2021-06-17
WO2021070544A1 (ja) 2021-04-15
CN112956286A (zh) 2021-06-11
TW202117260A (zh) 2021-05-01
CN112956286B (zh) 2025-06-27

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