CN112956286B - 蒸发室用的芯部片、蒸发室以及电子设备 - Google Patents
蒸发室用的芯部片、蒸发室以及电子设备 Download PDFInfo
- Publication number
- CN112956286B CN112956286B CN202080004775.XA CN202080004775A CN112956286B CN 112956286 B CN112956286 B CN 112956286B CN 202080004775 A CN202080004775 A CN 202080004775A CN 112956286 B CN112956286 B CN 112956286B
- Authority
- CN
- China
- Prior art keywords
- groove
- electronic device
- evaporation chamber
- flow path
- liquid storage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202510766280.5A CN120640614A (zh) | 2019-10-09 | 2020-09-09 | 蒸发室用的芯部片、蒸发室以及电子设备 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-186221 | 2019-10-09 | ||
| JP2019-186194 | 2019-10-09 | ||
| JP2019186194 | 2019-10-09 | ||
| JP2019186221 | 2019-10-09 | ||
| PCT/JP2020/034182 WO2021070544A1 (ja) | 2019-10-09 | 2020-09-09 | ベーパーチャンバ用のウィックシート、ベーパーチャンバおよび電子機器 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202510766280.5A Division CN120640614A (zh) | 2019-10-09 | 2020-09-09 | 蒸发室用的芯部片、蒸发室以及电子设备 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112956286A CN112956286A (zh) | 2021-06-11 |
| CN112956286B true CN112956286B (zh) | 2025-06-27 |
Family
ID=75437878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080004775.XA Active CN112956286B (zh) | 2019-10-09 | 2020-09-09 | 蒸发室用的芯部片、蒸发室以及电子设备 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7745154B2 (enExample) |
| CN (1) | CN112956286B (enExample) |
| WO (1) | WO2021070544A1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2022230749A1 (enExample) * | 2021-04-27 | 2022-11-03 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019039662A (ja) * | 2017-08-24 | 2019-03-14 | 大日本印刷株式会社 | ベーパーチャンバ用のウィックシート、ベーパーチャンバおよびベーパーチャンバの製造方法 |
| CN113366631A (zh) * | 2019-03-11 | 2021-09-07 | 大日本印刷株式会社 | 蒸发室、电子设备以及蒸发室用片 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7203064B2 (en) * | 2003-12-12 | 2007-04-10 | Intel Corporation | Heat exchanger with cooling channels having varying geometry |
| US7234513B2 (en) * | 2004-02-24 | 2007-06-26 | National Tsing Hua University | Microchannel flat-plate heat pipe with parallel grooves for recycling coolant |
| JP2007266153A (ja) * | 2006-03-28 | 2007-10-11 | Sony Corp | プレート型熱輸送装置及び電子機器 |
| JP2010014292A (ja) * | 2008-07-01 | 2010-01-21 | Sony Corp | 熱輸送デバイス、電子機器及び積層構造体 |
| KR20140029633A (ko) | 2012-08-29 | 2014-03-11 | 한국전자통신연구원 | 모세관력이 향상된 방열소자 및 그 제조방법 |
| JP2015225709A (ja) * | 2014-05-26 | 2015-12-14 | トヨタ自動車株式会社 | 燃料電池用のセパレータおよび燃料電池 |
| JP6433848B2 (ja) * | 2015-05-01 | 2018-12-05 | 国立大学法人名古屋大学 | 熱交換器、蒸発体、および電子機器 |
| CN105592671A (zh) * | 2016-03-11 | 2016-05-18 | 苏州市万松电气有限公司 | 采用热管散热器的列车供电箱 |
| US20180156545A1 (en) | 2016-12-05 | 2018-06-07 | Microsoft Technology Licensing, Llc | Vapor chamber with three-dimensional printed spanning structure |
| JP7145412B2 (ja) | 2017-09-28 | 2022-10-03 | 大日本印刷株式会社 | ベーパーチャンバおよび電子機器 |
| JP7148889B2 (ja) | 2017-10-06 | 2022-10-06 | 大日本印刷株式会社 | ベーパーチャンバ、電子機器およびベーパーチャンバ用金属シート |
| JP6338006B1 (ja) | 2017-11-02 | 2018-06-06 | オムロン株式会社 | 人集結分析装置、移動先予定作成装置、人集結分析システム、車両、および、人集結分析プログラム |
| JP6801700B2 (ja) * | 2017-11-10 | 2020-12-16 | 大日本印刷株式会社 | ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法 |
-
2020
- 2020-09-09 WO PCT/JP2020/034182 patent/WO2021070544A1/ja not_active Ceased
- 2020-09-09 CN CN202080004775.XA patent/CN112956286B/zh active Active
-
2021
- 2021-02-15 JP JP2021021944A patent/JP7745154B2/ja active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019039662A (ja) * | 2017-08-24 | 2019-03-14 | 大日本印刷株式会社 | ベーパーチャンバ用のウィックシート、ベーパーチャンバおよびベーパーチャンバの製造方法 |
| CN113366631A (zh) * | 2019-03-11 | 2021-09-07 | 大日本印刷株式会社 | 蒸发室、电子设备以及蒸发室用片 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2021092388A (ja) | 2021-06-17 |
| TW202117260A (zh) | 2021-05-01 |
| WO2021070544A1 (ja) | 2021-04-15 |
| JP7745154B2 (ja) | 2025-09-29 |
| CN112956286A (zh) | 2021-06-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |