CN112956286B - 蒸发室用的芯部片、蒸发室以及电子设备 - Google Patents

蒸发室用的芯部片、蒸发室以及电子设备 Download PDF

Info

Publication number
CN112956286B
CN112956286B CN202080004775.XA CN202080004775A CN112956286B CN 112956286 B CN112956286 B CN 112956286B CN 202080004775 A CN202080004775 A CN 202080004775A CN 112956286 B CN112956286 B CN 112956286B
Authority
CN
China
Prior art keywords
groove
electronic device
evaporation chamber
flow path
liquid storage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202080004775.XA
Other languages
English (en)
Chinese (zh)
Other versions
CN112956286A (zh
Inventor
小田和范
武田利彦
高桥伸一郎
太田贵之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to CN202510766280.5A priority Critical patent/CN120640614A/zh
Publication of CN112956286A publication Critical patent/CN112956286A/zh
Application granted granted Critical
Publication of CN112956286B publication Critical patent/CN112956286B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0217Mechanical details of casings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309Evaporators
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Physical Vapour Deposition (AREA)
CN202080004775.XA 2019-10-09 2020-09-09 蒸发室用的芯部片、蒸发室以及电子设备 Active CN112956286B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202510766280.5A CN120640614A (zh) 2019-10-09 2020-09-09 蒸发室用的芯部片、蒸发室以及电子设备

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2019-186221 2019-10-09
JP2019-186194 2019-10-09
JP2019186194 2019-10-09
JP2019186221 2019-10-09
PCT/JP2020/034182 WO2021070544A1 (ja) 2019-10-09 2020-09-09 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよび電子機器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202510766280.5A Division CN120640614A (zh) 2019-10-09 2020-09-09 蒸发室用的芯部片、蒸发室以及电子设备

Publications (2)

Publication Number Publication Date
CN112956286A CN112956286A (zh) 2021-06-11
CN112956286B true CN112956286B (zh) 2025-06-27

Family

ID=75437878

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080004775.XA Active CN112956286B (zh) 2019-10-09 2020-09-09 蒸发室用的芯部片、蒸发室以及电子设备

Country Status (3)

Country Link
JP (1) JP7745154B2 (enExample)
CN (1) CN112956286B (enExample)
WO (1) WO2021070544A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022230749A1 (enExample) * 2021-04-27 2022-11-03

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019039662A (ja) * 2017-08-24 2019-03-14 大日本印刷株式会社 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよびベーパーチャンバの製造方法
CN113366631A (zh) * 2019-03-11 2021-09-07 大日本印刷株式会社 蒸发室、电子设备以及蒸发室用片

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7203064B2 (en) * 2003-12-12 2007-04-10 Intel Corporation Heat exchanger with cooling channels having varying geometry
US7234513B2 (en) * 2004-02-24 2007-06-26 National Tsing Hua University Microchannel flat-plate heat pipe with parallel grooves for recycling coolant
JP2007266153A (ja) * 2006-03-28 2007-10-11 Sony Corp プレート型熱輸送装置及び電子機器
JP2010014292A (ja) * 2008-07-01 2010-01-21 Sony Corp 熱輸送デバイス、電子機器及び積層構造体
KR20140029633A (ko) 2012-08-29 2014-03-11 한국전자통신연구원 모세관력이 향상된 방열소자 및 그 제조방법
JP2015225709A (ja) * 2014-05-26 2015-12-14 トヨタ自動車株式会社 燃料電池用のセパレータおよび燃料電池
JP6433848B2 (ja) * 2015-05-01 2018-12-05 国立大学法人名古屋大学 熱交換器、蒸発体、および電子機器
CN105592671A (zh) * 2016-03-11 2016-05-18 苏州市万松电气有限公司 采用热管散热器的列车供电箱
US20180156545A1 (en) 2016-12-05 2018-06-07 Microsoft Technology Licensing, Llc Vapor chamber with three-dimensional printed spanning structure
JP7145412B2 (ja) 2017-09-28 2022-10-03 大日本印刷株式会社 ベーパーチャンバおよび電子機器
JP7148889B2 (ja) 2017-10-06 2022-10-06 大日本印刷株式会社 ベーパーチャンバ、電子機器およびベーパーチャンバ用金属シート
JP6338006B1 (ja) 2017-11-02 2018-06-06 オムロン株式会社 人集結分析装置、移動先予定作成装置、人集結分析システム、車両、および、人集結分析プログラム
JP6801700B2 (ja) * 2017-11-10 2020-12-16 大日本印刷株式会社 ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019039662A (ja) * 2017-08-24 2019-03-14 大日本印刷株式会社 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよびベーパーチャンバの製造方法
CN113366631A (zh) * 2019-03-11 2021-09-07 大日本印刷株式会社 蒸发室、电子设备以及蒸发室用片

Also Published As

Publication number Publication date
JP2021092388A (ja) 2021-06-17
TW202117260A (zh) 2021-05-01
WO2021070544A1 (ja) 2021-04-15
JP7745154B2 (ja) 2025-09-29
CN112956286A (zh) 2021-06-11

Similar Documents

Publication Publication Date Title
CN120640614A (zh) 蒸发室用的芯部片、蒸发室以及电子设备
TWI794886B (zh) 蒸氣腔、電子機器及蒸氣腔之製造方法
JP7002025B2 (ja) ベーパーチャンバ、電子機器、およびベーパーチャンバの製造方法
US20250212367A1 (en) Wick sheet for vapor chamber, vapor chamber, and electronic apparatus
JP7723915B2 (ja) ベーパーチャンバおよび電子機器
JP2022179520A (ja) ベーパーチャンバ、電子機器およびベーパーチャンバ用金属シート
JP7780721B2 (ja) ベーパーチャンバ用のウィックシート、ベーパーチャンバおよび電子機器
JP2023052355A (ja) ベーパーチャンバ、ベーパーチャンバ用シートおよびベーパーチャンバの製造方法
KR20240038011A (ko) 베이퍼 챔버, 베이퍼 챔버용의 윅 시트 및 전자 기기
CN112956286B (zh) 蒸发室用的芯部片、蒸发室以及电子设备
JP7769918B2 (ja) ベーパーチャンバ、ベーパーチャンバ用のウィックシート及び電子機器
CN117255927A (zh) 蒸发室、蒸发室用的芯部片材以及电子设备
TWI906224B (zh) 蒸氣腔用之毛細結構片材、蒸氣腔及電子機器
JP2020200952A (ja) ベーパーチャンバ、電子機器、及び、ベーパーチャンバ用金属シート
CN116745573A (zh) 蒸发室用的主体片材、蒸发室以及电子设备
KR20230137960A (ko) 베이퍼 챔버용 본체 시트, 베이퍼 챔버 및 전자 기기
JP2021188799A (ja) ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant