JP7744445B2 - ポリアミド樹脂組成物及びポリアミド成形体 - Google Patents

ポリアミド樹脂組成物及びポリアミド成形体

Info

Publication number
JP7744445B2
JP7744445B2 JP2023574012A JP2023574012A JP7744445B2 JP 7744445 B2 JP7744445 B2 JP 7744445B2 JP 2023574012 A JP2023574012 A JP 2023574012A JP 2023574012 A JP2023574012 A JP 2023574012A JP 7744445 B2 JP7744445 B2 JP 7744445B2
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JP
Japan
Prior art keywords
polyamide resin
derived
acid
resin composition
mol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023574012A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023136205A1 (https=
Inventor
浩佑 植田
航 牧口
悠 土井
浩平 西野
功 鷲尾
隆博 近藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Chemicals Inc
Original Assignee
Mitsui Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Publication of JPWO2023136205A1 publication Critical patent/JPWO2023136205A1/ja
Application granted granted Critical
Publication of JP7744445B2 publication Critical patent/JP7744445B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C08K3/105—Compounds containing metals of Groups 1 to 3 or of Groups 11 to 13 of the Periodic Table
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/16—Halogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/346—Clay
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/014—Stabilisers against oxidation, heat, light or ozone

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2023574012A 2022-01-12 2023-01-06 ポリアミド樹脂組成物及びポリアミド成形体 Active JP7744445B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022003317 2022-01-12
JP2022003317 2022-01-12
PCT/JP2023/000141 WO2023136205A1 (ja) 2022-01-12 2023-01-06 ポリアミド樹脂組成物及びポリアミド成形体

Publications (2)

Publication Number Publication Date
JPWO2023136205A1 JPWO2023136205A1 (https=) 2023-07-20
JP7744445B2 true JP7744445B2 (ja) 2025-09-25

Family

ID=87279040

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023574012A Active JP7744445B2 (ja) 2022-01-12 2023-01-06 ポリアミド樹脂組成物及びポリアミド成形体

Country Status (6)

Country Link
US (1) US20250092220A1 (https=)
EP (1) EP4464746A4 (https=)
JP (1) JP7744445B2 (https=)
KR (1) KR20240117001A (https=)
CN (1) CN118574894A (https=)
WO (1) WO2023136205A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016001949A1 (ja) 2014-07-02 2016-01-07 東洋インキＳｃホールディングス株式会社 熱硬化性樹脂組成物、ポリアミド、接着性シート、硬化物およびプリント配線板
WO2022014390A1 (ja) 2020-07-16 2022-01-20 三井化学株式会社 結晶性ポリアミド樹脂、樹脂組成物および成形体

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE791468A (fr) 1971-11-16 1973-05-16 Hoechst Ag Polyamides transparents et leur preparation
DE2348752A1 (de) * 1973-09-28 1975-04-24 Hoechst Ag Thermoplastische formmassen
DE2715413A1 (de) * 1977-04-06 1978-10-12 Bayer Ag Transparente copolyamide
JPH0717747B2 (ja) * 1986-12-19 1995-03-01 東レ株式会社 ポリアミドの製造法
JP3155619B2 (ja) 1992-07-20 2001-04-16 旭化成株式会社 ポリアミド樹脂組成物
DE60216854T2 (de) * 2001-06-05 2007-09-06 KURARAY CO., LTD, Kurashiki Polyamidzusammensetzung
JPWO2003085029A1 (ja) 2002-04-05 2005-08-11 三井化学株式会社 発光ダイオード反射板用樹脂組成物
JP7042752B2 (ja) * 2016-05-04 2022-03-28 エムス ヒェミー アーゲー ポリアミド成形材料及びそれからなる成形品
JP7468184B2 (ja) 2020-06-23 2024-04-16 株式会社デンソー 電界マップ作成装置および電界マップ使用装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016001949A1 (ja) 2014-07-02 2016-01-07 東洋インキＳｃホールディングス株式会社 熱硬化性樹脂組成物、ポリアミド、接着性シート、硬化物およびプリント配線板
WO2022014390A1 (ja) 2020-07-16 2022-01-20 三井化学株式会社 結晶性ポリアミド樹脂、樹脂組成物および成形体

Also Published As

Publication number Publication date
EP4464746A1 (en) 2024-11-20
CN118574894A (zh) 2024-08-30
JPWO2023136205A1 (https=) 2023-07-20
EP4464746A4 (en) 2025-12-24
KR20240117001A (ko) 2024-07-30
US20250092220A1 (en) 2025-03-20
WO2023136205A1 (ja) 2023-07-20

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