JPWO2023136205A1 - - Google Patents

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Publication number
JPWO2023136205A1
JPWO2023136205A1 JP2023574012A JP2023574012A JPWO2023136205A1 JP WO2023136205 A1 JPWO2023136205 A1 JP WO2023136205A1 JP 2023574012 A JP2023574012 A JP 2023574012A JP 2023574012 A JP2023574012 A JP 2023574012A JP WO2023136205 A1 JPWO2023136205 A1 JP WO2023136205A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023574012A
Other languages
Japanese (ja)
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JP7744445B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed filed Critical
Publication of JPWO2023136205A1 publication Critical patent/JPWO2023136205A1/ja
Application granted granted Critical
Publication of JP7744445B2 publication Critical patent/JP7744445B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C08K3/105—Compounds containing metals of Groups 1 to 3 or of Groups 11 to 13 of the Periodic Table
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/16—Halogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/346—Clay
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/014—Stabilisers against oxidation, heat, light or ozone

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2023574012A 2022-01-12 2023-01-06 ポリアミド樹脂組成物及びポリアミド成形体 Active JP7744445B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022003317 2022-01-12
JP2022003317 2022-01-12
PCT/JP2023/000141 WO2023136205A1 (ja) 2022-01-12 2023-01-06 ポリアミド樹脂組成物及びポリアミド成形体

Publications (2)

Publication Number Publication Date
JPWO2023136205A1 true JPWO2023136205A1 (https=) 2023-07-20
JP7744445B2 JP7744445B2 (ja) 2025-09-25

Family

ID=87279040

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023574012A Active JP7744445B2 (ja) 2022-01-12 2023-01-06 ポリアミド樹脂組成物及びポリアミド成形体

Country Status (6)

Country Link
US (1) US20250092220A1 (https=)
EP (1) EP4464746A4 (https=)
JP (1) JP7744445B2 (https=)
KR (1) KR20240117001A (https=)
CN (1) CN118574894A (https=)
WO (1) WO2023136205A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2348752A1 (de) * 1973-09-28 1975-04-24 Hoechst Ag Thermoplastische formmassen
JPS53125497A (en) * 1977-04-06 1978-11-01 Bayer Ag Transparent copolyamide
JPS63154739A (ja) * 1986-12-19 1988-06-28 Toray Ind Inc ポリアミドの製造法
JPH0632979A (ja) * 1992-07-20 1994-02-08 Asahi Chem Ind Co Ltd ポリアミド樹脂組成物
WO2016001949A1 (ja) * 2014-07-02 2016-01-07 東洋インキＳｃホールディングス株式会社 熱硬化性樹脂組成物、ポリアミド、接着性シート、硬化物およびプリント配線板
WO2022014390A1 (ja) * 2020-07-16 2022-01-20 三井化学株式会社 結晶性ポリアミド樹脂、樹脂組成物および成形体

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE791468A (fr) 1971-11-16 1973-05-16 Hoechst Ag Polyamides transparents et leur preparation
DE60216854T2 (de) * 2001-06-05 2007-09-06 KURARAY CO., LTD, Kurashiki Polyamidzusammensetzung
JPWO2003085029A1 (ja) 2002-04-05 2005-08-11 三井化学株式会社 発光ダイオード反射板用樹脂組成物
JP7042752B2 (ja) * 2016-05-04 2022-03-28 エムス ヒェミー アーゲー ポリアミド成形材料及びそれからなる成形品
JP7468184B2 (ja) 2020-06-23 2024-04-16 株式会社デンソー 電界マップ作成装置および電界マップ使用装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2348752A1 (de) * 1973-09-28 1975-04-24 Hoechst Ag Thermoplastische formmassen
JPS53125497A (en) * 1977-04-06 1978-11-01 Bayer Ag Transparent copolyamide
JPS63154739A (ja) * 1986-12-19 1988-06-28 Toray Ind Inc ポリアミドの製造法
JPH0632979A (ja) * 1992-07-20 1994-02-08 Asahi Chem Ind Co Ltd ポリアミド樹脂組成物
WO2016001949A1 (ja) * 2014-07-02 2016-01-07 東洋インキＳｃホールディングス株式会社 熱硬化性樹脂組成物、ポリアミド、接着性シート、硬化物およびプリント配線板
WO2022014390A1 (ja) * 2020-07-16 2022-01-20 三井化学株式会社 結晶性ポリアミド樹脂、樹脂組成物および成形体
JP7391225B2 (ja) * 2020-07-16 2023-12-04 三井化学株式会社 結晶性ポリアミド樹脂、樹脂組成物および成形体

Also Published As

Publication number Publication date
JP7744445B2 (ja) 2025-09-25
EP4464746A1 (en) 2024-11-20
CN118574894A (zh) 2024-08-30
EP4464746A4 (en) 2025-12-24
KR20240117001A (ko) 2024-07-30
US20250092220A1 (en) 2025-03-20
WO2023136205A1 (ja) 2023-07-20

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