KR20240117001A - 폴리아마이드 수지 조성물 및 폴리아마이드 성형체 - Google Patents

폴리아마이드 수지 조성물 및 폴리아마이드 성형체 Download PDF

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Publication number
KR20240117001A
KR20240117001A KR1020247022685A KR20247022685A KR20240117001A KR 20240117001 A KR20240117001 A KR 20240117001A KR 1020247022685 A KR1020247022685 A KR 1020247022685A KR 20247022685 A KR20247022685 A KR 20247022685A KR 20240117001 A KR20240117001 A KR 20240117001A
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KR
South Korea
Prior art keywords
polyamide resin
derived
acid
resin composition
diamine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247022685A
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English (en)
Korean (ko)
Inventor
고스케 우에다
와타루 마키구치
하루카 도이
고헤이 니시노
이사오 와시오
다카히로 곤도
Original Assignee
미쓰이 가가쿠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰이 가가쿠 가부시키가이샤 filed Critical 미쓰이 가가쿠 가부시키가이샤
Publication of KR20240117001A publication Critical patent/KR20240117001A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C08K3/105—Compounds containing metals of Groups 1 to 3 or of Groups 11 to 13 of the Periodic Table
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/16—Halogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/346—Clay
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/014—Stabilisers against oxidation, heat, light or ozone

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020247022685A 2022-01-12 2023-01-06 폴리아마이드 수지 조성물 및 폴리아마이드 성형체 Pending KR20240117001A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2022-003317 2022-01-12
JP2022003317 2022-01-12
PCT/JP2023/000141 WO2023136205A1 (ja) 2022-01-12 2023-01-06 ポリアミド樹脂組成物及びポリアミド成形体

Publications (1)

Publication Number Publication Date
KR20240117001A true KR20240117001A (ko) 2024-07-30

Family

ID=87279040

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247022685A Pending KR20240117001A (ko) 2022-01-12 2023-01-06 폴리아마이드 수지 조성물 및 폴리아마이드 성형체

Country Status (6)

Country Link
US (1) US20250092220A1 (https=)
EP (1) EP4464746A4 (https=)
JP (1) JP7744445B2 (https=)
KR (1) KR20240117001A (https=)
CN (1) CN118574894A (https=)
WO (1) WO2023136205A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4860193A (https=) 1971-11-16 1973-08-23
JPS53125497A (en) 1977-04-06 1978-11-01 Bayer Ag Transparent copolyamide
JPS63154739A (ja) 1986-12-19 1988-06-28 Toray Ind Inc ポリアミドの製造法
JPH0632979A (ja) 1992-07-20 1994-02-08 Asahi Chem Ind Co Ltd ポリアミド樹脂組成物

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2348752A1 (de) * 1973-09-28 1975-04-24 Hoechst Ag Thermoplastische formmassen
DE60216854T2 (de) * 2001-06-05 2007-09-06 KURARAY CO., LTD, Kurashiki Polyamidzusammensetzung
JPWO2003085029A1 (ja) 2002-04-05 2005-08-11 三井化学株式会社 発光ダイオード反射板用樹脂組成物
EP3165554A4 (en) * 2014-07-02 2018-02-28 Toyo Ink SC Holdings Co., Ltd. Heat-curable resin composition, polyamide, adhesive sheet, cured article, and printed wiring board
JP7042752B2 (ja) * 2016-05-04 2022-03-28 エムス ヒェミー アーゲー ポリアミド成形材料及びそれからなる成形品
JP7468184B2 (ja) 2020-06-23 2024-04-16 株式会社デンソー 電界マップ作成装置および電界マップ使用装置
EP4183813A4 (en) * 2020-07-16 2024-08-07 Mitsui Chemicals, Inc. CRYSTALLINE POLYAMIDE RESIN, RESIN COMPOSITION AND MOLDED BODIES

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4860193A (https=) 1971-11-16 1973-08-23
JPS53125497A (en) 1977-04-06 1978-11-01 Bayer Ag Transparent copolyamide
JPS63154739A (ja) 1986-12-19 1988-06-28 Toray Ind Inc ポリアミドの製造法
JPH0632979A (ja) 1992-07-20 1994-02-08 Asahi Chem Ind Co Ltd ポリアミド樹脂組成物

Also Published As

Publication number Publication date
JP7744445B2 (ja) 2025-09-25
EP4464746A1 (en) 2024-11-20
CN118574894A (zh) 2024-08-30
JPWO2023136205A1 (https=) 2023-07-20
EP4464746A4 (en) 2025-12-24
US20250092220A1 (en) 2025-03-20
WO2023136205A1 (ja) 2023-07-20

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