CN118574894A - 聚酰胺树脂组合物和聚酰胺成形体 - Google Patents

聚酰胺树脂组合物和聚酰胺成形体 Download PDF

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Publication number
CN118574894A
CN118574894A CN202380016989.2A CN202380016989A CN118574894A CN 118574894 A CN118574894 A CN 118574894A CN 202380016989 A CN202380016989 A CN 202380016989A CN 118574894 A CN118574894 A CN 118574894A
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CN
China
Prior art keywords
polyamide resin
derived
acid
resin composition
diamine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380016989.2A
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English (en)
Chinese (zh)
Inventor
植田浩佑
牧口航
土井悠
西野浩平
鹫尾功
近藤隆博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Chemicals Inc
Original Assignee
Mitsui Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Publication of CN118574894A publication Critical patent/CN118574894A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C08K3/105—Compounds containing metals of Groups 1 to 3 or of Groups 11 to 13 of the Periodic Table
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/16—Halogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/346—Clay
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/014—Stabilisers against oxidation, heat, light or ozone

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202380016989.2A 2022-01-12 2023-01-06 聚酰胺树脂组合物和聚酰胺成形体 Pending CN118574894A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022003317 2022-01-12
JP2022-003317 2022-01-12
PCT/JP2023/000141 WO2023136205A1 (ja) 2022-01-12 2023-01-06 ポリアミド樹脂組成物及びポリアミド成形体

Publications (1)

Publication Number Publication Date
CN118574894A true CN118574894A (zh) 2024-08-30

Family

ID=87279040

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380016989.2A Pending CN118574894A (zh) 2022-01-12 2023-01-06 聚酰胺树脂组合物和聚酰胺成形体

Country Status (6)

Country Link
US (1) US20250092220A1 (https=)
EP (1) EP4464746A4 (https=)
JP (1) JP7744445B2 (https=)
KR (1) KR20240117001A (https=)
CN (1) CN118574894A (https=)
WO (1) WO2023136205A1 (https=)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE791468A (fr) 1971-11-16 1973-05-16 Hoechst Ag Polyamides transparents et leur preparation
DE2348752A1 (de) * 1973-09-28 1975-04-24 Hoechst Ag Thermoplastische formmassen
DE2715413A1 (de) * 1977-04-06 1978-10-12 Bayer Ag Transparente copolyamide
JPH0717747B2 (ja) * 1986-12-19 1995-03-01 東レ株式会社 ポリアミドの製造法
JP3155619B2 (ja) 1992-07-20 2001-04-16 旭化成株式会社 ポリアミド樹脂組成物
DE60216854T2 (de) * 2001-06-05 2007-09-06 KURARAY CO., LTD, Kurashiki Polyamidzusammensetzung
JPWO2003085029A1 (ja) 2002-04-05 2005-08-11 三井化学株式会社 発光ダイオード反射板用樹脂組成物
EP3165554A4 (en) * 2014-07-02 2018-02-28 Toyo Ink SC Holdings Co., Ltd. Heat-curable resin composition, polyamide, adhesive sheet, cured article, and printed wiring board
JP7042752B2 (ja) * 2016-05-04 2022-03-28 エムス ヒェミー アーゲー ポリアミド成形材料及びそれからなる成形品
JP7468184B2 (ja) 2020-06-23 2024-04-16 株式会社デンソー 電界マップ作成装置および電界マップ使用装置
EP4183813A4 (en) * 2020-07-16 2024-08-07 Mitsui Chemicals, Inc. CRYSTALLINE POLYAMIDE RESIN, RESIN COMPOSITION AND MOLDED BODIES

Also Published As

Publication number Publication date
JP7744445B2 (ja) 2025-09-25
EP4464746A1 (en) 2024-11-20
JPWO2023136205A1 (https=) 2023-07-20
EP4464746A4 (en) 2025-12-24
KR20240117001A (ko) 2024-07-30
US20250092220A1 (en) 2025-03-20
WO2023136205A1 (ja) 2023-07-20

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