JP7739305B2 - 基板の洗浄方法 - Google Patents

基板の洗浄方法

Info

Publication number
JP7739305B2
JP7739305B2 JP2022546987A JP2022546987A JP7739305B2 JP 7739305 B2 JP7739305 B2 JP 7739305B2 JP 2022546987 A JP2022546987 A JP 2022546987A JP 2022546987 A JP2022546987 A JP 2022546987A JP 7739305 B2 JP7739305 B2 JP 7739305B2
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JP
Japan
Prior art keywords
group
component
cleaning
resin mask
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022546987A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022050386A1 (https=
JPWO2022050386A5 (https=
Inventor
晃平 山田
敬騰 鄭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kao Corp
Original Assignee
Kao Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kao Corp filed Critical Kao Corp
Publication of JPWO2022050386A1 publication Critical patent/JPWO2022050386A1/ja
Publication of JPWO2022050386A5 publication Critical patent/JPWO2022050386A5/ja
Application granted granted Critical
Publication of JP7739305B2 publication Critical patent/JP7739305B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/265—Carboxylic acids or salts thereof
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G03F7/325—Non-aqueous compositions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Emergency Medicine (AREA)
  • Health & Medical Sciences (AREA)
  • Detergent Compositions (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
JP2022546987A 2020-09-04 2021-09-03 基板の洗浄方法 Active JP7739305B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020149274 2020-09-04
JP2020149274 2020-09-04
PCT/JP2021/032486 WO2022050386A1 (ja) 2020-09-04 2021-09-03 基板の洗浄方法

Publications (3)

Publication Number Publication Date
JPWO2022050386A1 JPWO2022050386A1 (https=) 2022-03-10
JPWO2022050386A5 JPWO2022050386A5 (https=) 2024-06-21
JP7739305B2 true JP7739305B2 (ja) 2025-09-16

Family

ID=80491086

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022546987A Active JP7739305B2 (ja) 2020-09-04 2021-09-03 基板の洗浄方法

Country Status (5)

Country Link
JP (1) JP7739305B2 (https=)
KR (1) KR102902784B1 (https=)
CN (2) CN121736843A (https=)
TW (1) TWI911270B (https=)
WO (1) WO2022050386A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118295222B (zh) * 2024-05-06 2025-08-12 惠州达诚微电子材料有限公司 一种光刻胶用剥离液及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000089480A (ja) 1998-09-09 2000-03-31 Kao Corp 剥離剤組成物
JP2001005200A (ja) 1999-06-21 2001-01-12 Nagase Denshi Kagaku Kk レジスト剥離剤組成物及びその使用方法
JP2004004775A (ja) 2002-04-26 2004-01-08 Kao Corp レジスト用剥離剤組成物
JP2004518819A (ja) 2001-02-12 2004-06-24 イーエスシー， インコーポレイテッド 化学機械平坦化（ｃｍｐ）後の洗浄組成物
JP2016527707A (ja) 2013-06-06 2016-09-08 アドバンスド テクノロジー マテリアルズ，インコーポレイテッド 窒化チタンを選択的にエッチングするための組成物及び方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4033419A1 (de) * 1990-10-20 1992-04-23 Wolman Gmbh Dr Polymere stickstoffverbindungen und metall fixierende saeuren enthaltende holzschutzmittel
JP3953476B2 (ja) * 2003-06-26 2007-08-08 ドングウー ファイン−ケム カンパニー、 リミテッド フォトレジスト剥離液組成物及びそれを用いたフォトレジストの剥離方法
US8778212B2 (en) * 2012-05-22 2014-07-15 Cabot Microelectronics Corporation CMP composition containing zirconia particles and method of use
JP7136894B2 (ja) * 2018-06-26 2022-09-13 旭化成株式会社 感光性樹脂組成物、硬化レリーフパターンの製造方法、及び半導体装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000089480A (ja) 1998-09-09 2000-03-31 Kao Corp 剥離剤組成物
JP2001005200A (ja) 1999-06-21 2001-01-12 Nagase Denshi Kagaku Kk レジスト剥離剤組成物及びその使用方法
JP2004518819A (ja) 2001-02-12 2004-06-24 イーエスシー， インコーポレイテッド 化学機械平坦化（ｃｍｐ）後の洗浄組成物
JP2004004775A (ja) 2002-04-26 2004-01-08 Kao Corp レジスト用剥離剤組成物
JP2016527707A (ja) 2013-06-06 2016-09-08 アドバンスド テクノロジー マテリアルズ，インコーポレイテッド 窒化チタンを選択的にエッチングするための組成物及び方法

Also Published As

Publication number Publication date
JPWO2022050386A1 (https=) 2022-03-10
TWI911270B (zh) 2026-01-11
KR20230061402A (ko) 2023-05-08
TW202214831A (zh) 2022-04-16
CN116018397A (zh) 2023-04-25
KR102902784B1 (ko) 2025-12-19
WO2022050386A1 (ja) 2022-03-10
CN121736843A (zh) 2026-03-27

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