JP7719781B2 - 自動回転プリアライメントを用いたエッジリング搬送 - Google Patents

自動回転プリアライメントを用いたエッジリング搬送

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Publication number
JP7719781B2
JP7719781B2 JP2022544651A JP2022544651A JP7719781B2 JP 7719781 B2 JP7719781 B2 JP 7719781B2 JP 2022544651 A JP2022544651 A JP 2022544651A JP 2022544651 A JP2022544651 A JP 2022544651A JP 7719781 B2 JP7719781 B2 JP 7719781B2
Authority
JP
Japan
Prior art keywords
edge ring
carrier plate
end effector
robot
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022544651A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2021150548A5 (https=
JP2023514065A5 (https=
JP2023514065A (ja
Inventor
ゲネッティ・デーモン・タイロン
アンジェロ・ダリル
グールド・リチャード・エイチ．
パウエル・ロイ・スコット
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of JP2023514065A publication Critical patent/JP2023514065A/ja
Publication of JPWO2021150548A5 publication Critical patent/JPWO2021150548A5/ja
Publication of JP2023514065A5 publication Critical patent/JP2023514065A5/ja
Application granted granted Critical
Publication of JP7719781B2 publication Critical patent/JP7719781B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Robotics (AREA)
  • Manipulator (AREA)
  • Drying Of Semiconductors (AREA)
  • Silver Salt Photography Or Processing Solution Therefor (AREA)
  • Attitude Control For Articles On Conveyors (AREA)
  • Feeding Of Articles To Conveyors (AREA)
JP2022544651A 2020-01-23 2021-01-20 自動回転プリアライメントを用いたエッジリング搬送 Active JP7719781B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202062964908P 2020-01-23 2020-01-23
US62/964,908 2020-01-23
PCT/US2021/014089 WO2021150548A1 (en) 2020-01-23 2021-01-20 Edge ring transfer with automated rotational pre-alignment

Publications (4)

Publication Number Publication Date
JP2023514065A JP2023514065A (ja) 2023-04-05
JPWO2021150548A5 JPWO2021150548A5 (https=) 2024-01-25
JP2023514065A5 JP2023514065A5 (https=) 2024-01-25
JP7719781B2 true JP7719781B2 (ja) 2025-08-06

Family

ID=76991736

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022544651A Active JP7719781B2 (ja) 2020-01-23 2021-01-20 自動回転プリアライメントを用いたエッジリング搬送

Country Status (6)

Country Link
US (1) US12575365B2 (https=)
JP (1) JP7719781B2 (https=)
KR (2) KR102888626B1 (https=)
CN (1) CN115004352A (https=)
TW (1) TWI891711B (https=)
WO (1) WO2021150548A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022139927A (ja) * 2021-03-12 2022-09-26 キオクシア株式会社 半導体製造装置および半導体装置の製造方法
JP7720235B2 (ja) * 2021-11-26 2025-08-07 株式会社安川電機 アライメント装置、基板搬送システム、アライメント方法、及びプログラム
JP7749165B1 (ja) * 2024-02-22 2025-10-03 東京エレクトロン株式会社 基板処理装置
US12603261B2 (en) * 2024-04-04 2026-04-14 Applied Materials, Inc. Aligner station with lifting mechanism

Citations (10)

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JP2004289003A (ja) 2003-03-24 2004-10-14 Seiko Epson Corp 石英リング、プラズマ処理装置および半導体装置の製造方法
JP2010028073A (ja) 2008-06-19 2010-02-04 Tokyo Electron Ltd フォーカスリング及びプラズマ処理装置
JP3168600U (ja) 2009-11-02 2011-06-23 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 傾斜上面を有するホットエッジリング
JP2012508456A (ja) 2008-11-06 2012-04-05 アプライド マテリアルズ インコーポレイテッド 微小位置決めシステムを備える急速熱処理チャンバ
JP2016146472A (ja) 2015-01-16 2016-08-12 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 半導体ウエハ処理中におけるエッジ処理制御のための可動式エッジ連結リング
JP2017098540A (ja) 2015-10-22 2017-06-01 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 正面開口式リングポッド
US20180138069A1 (en) 2016-11-14 2018-05-17 Lam Research Corporation Edge ring centering method using ring dynamic alignment data
JP2019057709A (ja) 2017-09-21 2019-04-11 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 半導体プロセスモジュールのためのインサイチュ装置
US20200013657A1 (en) 2018-07-04 2020-01-09 Samsung Electronics Co., Ltd. Apparatus and methods for edge ring replacement, inspection and alignment using image sensors
JP2022525248A (ja) 2019-05-20 2022-05-11 アプライド マテリアルズ インコーポレイテッド プロセスキットリングアダプタ

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US7066707B1 (en) * 2001-08-31 2006-06-27 Asyst Technologies, Inc. Wafer engine
US7251883B2 (en) * 2002-09-30 2007-08-07 Sony Corporation Electronic-component alignment method and apparatus therefor
KR101590655B1 (ko) 2007-12-27 2016-02-18 램 리써치 코포레이션 동적 정렬 빔 교정의 방법 및 시스템
TWI421945B (zh) 2008-11-06 2014-01-01 Applied Materials Inc 含有微定位系統之快速熱處理腔室與處理基材之方法
JP5258981B2 (ja) * 2010-02-05 2013-08-07 東京エレクトロン株式会社 基板保持具及び基板搬送装置及び基板処理装置
JP6003011B2 (ja) 2011-03-31 2016-10-05 東京エレクトロン株式会社 基板処理装置
JP6212455B2 (ja) * 2014-03-12 2017-10-11 東芝メモリ株式会社 マーキング装置およびマーキング方法
JP6316082B2 (ja) 2014-04-30 2018-04-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
US10242848B2 (en) * 2014-12-12 2019-03-26 Lam Research Corporation Carrier ring structure and chamber systems including the same
US10062599B2 (en) 2015-10-22 2018-08-28 Lam Research Corporation Automated replacement of consumable parts using interfacing chambers
US10124492B2 (en) 2015-10-22 2018-11-13 Lam Research Corporation Automated replacement of consumable parts using end effectors interfacing with plasma processing system
US9892956B1 (en) 2016-10-12 2018-02-13 Lam Research Corporation Wafer positioning pedestal for semiconductor processing
KR102702089B1 (ko) * 2019-03-22 2024-09-03 삼성전자주식회사 에지 링을 갖는 기판 처리 장치
KR102946972B1 (ko) * 2019-06-06 2026-04-01 램 리써치 코포레이션 회전 정렬이 필요한 에지 링의 자동화된 이송
US11626305B2 (en) * 2019-06-25 2023-04-11 Applied Materials, Inc. Sensor-based correction of robot-held object
JPWO2024071073A1 (https=) * 2022-09-30 2024-04-04

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004289003A (ja) 2003-03-24 2004-10-14 Seiko Epson Corp 石英リング、プラズマ処理装置および半導体装置の製造方法
JP2010028073A (ja) 2008-06-19 2010-02-04 Tokyo Electron Ltd フォーカスリング及びプラズマ処理装置
JP2012508456A (ja) 2008-11-06 2012-04-05 アプライド マテリアルズ インコーポレイテッド 微小位置決めシステムを備える急速熱処理チャンバ
JP3168600U (ja) 2009-11-02 2011-06-23 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 傾斜上面を有するホットエッジリング
JP2016146472A (ja) 2015-01-16 2016-08-12 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 半導体ウエハ処理中におけるエッジ処理制御のための可動式エッジ連結リング
JP2017098540A (ja) 2015-10-22 2017-06-01 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 正面開口式リングポッド
US20180138069A1 (en) 2016-11-14 2018-05-17 Lam Research Corporation Edge ring centering method using ring dynamic alignment data
JP2019057709A (ja) 2017-09-21 2019-04-11 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 半導体プロセスモジュールのためのインサイチュ装置
US20200013657A1 (en) 2018-07-04 2020-01-09 Samsung Electronics Co., Ltd. Apparatus and methods for edge ring replacement, inspection and alignment using image sensors
JP2022525248A (ja) 2019-05-20 2022-05-11 アプライド マテリアルズ インコーポレイテッド プロセスキットリングアダプタ

Also Published As

Publication number Publication date
US12575365B2 (en) 2026-03-10
TWI891711B (zh) 2025-08-01
JP2023514065A (ja) 2023-04-05
KR20250165690A (ko) 2025-11-26
KR102888626B1 (ko) 2025-11-19
KR20220127926A (ko) 2022-09-20
US20230047039A1 (en) 2023-02-16
CN115004352A (zh) 2022-09-02
TW202147376A (zh) 2021-12-16
WO2021150548A1 (en) 2021-07-29

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