JP2023514065A5 - - Google Patents
Info
- Publication number
- JP2023514065A5 JP2023514065A5 JP2022544651A JP2022544651A JP2023514065A5 JP 2023514065 A5 JP2023514065 A5 JP 2023514065A5 JP 2022544651 A JP2022544651 A JP 2022544651A JP 2022544651 A JP2022544651 A JP 2022544651A JP 2023514065 A5 JP2023514065 A5 JP 2023514065A5
- Authority
- JP
- Japan
- Prior art keywords
- edge ring
- carrier plate
- substrate
- end effector
- rotational position
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202062964908P | 2020-01-23 | 2020-01-23 | |
| US62/964,908 | 2020-01-23 | ||
| PCT/US2021/014089 WO2021150548A1 (en) | 2020-01-23 | 2021-01-20 | Edge ring transfer with automated rotational pre-alignment |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2023514065A JP2023514065A (ja) | 2023-04-05 |
| JP2023514065A5 true JP2023514065A5 (https=) | 2024-01-25 |
| JP7719781B2 JP7719781B2 (ja) | 2025-08-06 |
Family
ID=76991736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022544651A Active JP7719781B2 (ja) | 2020-01-23 | 2021-01-20 | 自動回転プリアライメントを用いたエッジリング搬送 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12575365B2 (https=) |
| JP (1) | JP7719781B2 (https=) |
| KR (2) | KR20250165690A (https=) |
| CN (1) | CN115004352A (https=) |
| TW (1) | TWI891711B (https=) |
| WO (1) | WO2021150548A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022139927A (ja) * | 2021-03-12 | 2022-09-26 | キオクシア株式会社 | 半導体製造装置および半導体装置の製造方法 |
| JP7720235B2 (ja) * | 2021-11-26 | 2025-08-07 | 株式会社安川電機 | アライメント装置、基板搬送システム、アライメント方法、及びプログラム |
| WO2025177878A1 (ja) * | 2024-02-22 | 2025-08-28 | 東京エレクトロン株式会社 | 基板処理装置 |
| US12603261B2 (en) * | 2024-04-04 | 2026-04-14 | Applied Materials, Inc. | Aligner station with lifting mechanism |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7066707B1 (en) * | 2001-08-31 | 2006-06-27 | Asyst Technologies, Inc. | Wafer engine |
| WO2004028816A1 (ja) * | 2002-09-30 | 2004-04-08 | Sony Corporation | 電子部品位置合わせ方法及びその装置 |
| JP2004289003A (ja) * | 2003-03-24 | 2004-10-14 | Seiko Epson Corp | 石英リング、プラズマ処理装置および半導体装置の製造方法 |
| KR101590655B1 (ko) | 2007-12-27 | 2016-02-18 | 램 리써치 코포레이션 | 동적 정렬 빔 교정의 방법 및 시스템 |
| JP5227197B2 (ja) * | 2008-06-19 | 2013-07-03 | 東京エレクトロン株式会社 | フォーカスリング及びプラズマ処理装置 |
| US8314371B2 (en) * | 2008-11-06 | 2012-11-20 | Applied Materials, Inc. | Rapid thermal processing chamber with micro-positioning system |
| TWI505370B (zh) | 2008-11-06 | 2015-10-21 | Applied Materials Inc | 含有微定位系統之快速熱處理腔室與處理基材之方法 |
| DE202010014805U1 (de) * | 2009-11-02 | 2011-02-17 | Lam Research Corporation (Delaware Corporation) | Heissrandring mit geneigter oberer Oberfläche |
| CN102741995A (zh) * | 2010-02-05 | 2012-10-17 | 东京毅力科创株式会社 | 基板保持用具、基板输送装置及基板处理装置 |
| JP6003011B2 (ja) | 2011-03-31 | 2016-10-05 | 東京エレクトロン株式会社 | 基板処理装置 |
| JP6212455B2 (ja) * | 2014-03-12 | 2017-10-11 | 東芝メモリ株式会社 | マーキング装置およびマーキング方法 |
| JP6316082B2 (ja) | 2014-04-30 | 2018-04-25 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理方法 |
| US10242848B2 (en) * | 2014-12-12 | 2019-03-26 | Lam Research Corporation | Carrier ring structure and chamber systems including the same |
| US10658222B2 (en) * | 2015-01-16 | 2020-05-19 | Lam Research Corporation | Moveable edge coupling ring for edge process control during semiconductor wafer processing |
| US9881820B2 (en) * | 2015-10-22 | 2018-01-30 | Lam Research Corporation | Front opening ring pod |
| US10062599B2 (en) * | 2015-10-22 | 2018-08-28 | Lam Research Corporation | Automated replacement of consumable parts using interfacing chambers |
| US10124492B2 (en) | 2015-10-22 | 2018-11-13 | Lam Research Corporation | Automated replacement of consumable parts using end effectors interfacing with plasma processing system |
| US9892956B1 (en) | 2016-10-12 | 2018-02-13 | Lam Research Corporation | Wafer positioning pedestal for semiconductor processing |
| US10541168B2 (en) * | 2016-11-14 | 2020-01-21 | Lam Research Corporation | Edge ring centering method using ring dynamic alignment data |
| US11075105B2 (en) * | 2017-09-21 | 2021-07-27 | Applied Materials, Inc. | In-situ apparatus for semiconductor process module |
| KR102433436B1 (ko) | 2018-07-04 | 2022-08-17 | 삼성전자주식회사 | 기판 처리 시스템, 기판 처리 시스템에서의 에지 링 정렬 검사 방법 및 이를 수행하기 위한 원반형 비젼 센서 |
| KR102702089B1 (ko) * | 2019-03-22 | 2024-09-03 | 삼성전자주식회사 | 에지 링을 갖는 기판 처리 장치 |
| US10964584B2 (en) * | 2019-05-20 | 2021-03-30 | Applied Materials, Inc. | Process kit ring adaptor |
| US12142466B2 (en) * | 2019-06-06 | 2024-11-12 | Lam Research Corporation | Automated transfer of edge ring requiring rotational alignment |
| US11626305B2 (en) * | 2019-06-25 | 2023-04-11 | Applied Materials, Inc. | Sensor-based correction of robot-held object |
| JPWO2024071073A1 (https=) * | 2022-09-30 | 2024-04-04 |
-
2021
- 2021-01-20 JP JP2022544651A patent/JP7719781B2/ja active Active
- 2021-01-20 CN CN202180010849.5A patent/CN115004352A/zh active Pending
- 2021-01-20 KR KR1020257038381A patent/KR20250165690A/ko active Pending
- 2021-01-20 KR KR1020227028959A patent/KR102888626B1/ko active Active
- 2021-01-20 US US17/793,715 patent/US12575365B2/en active Active
- 2021-01-20 WO PCT/US2021/014089 patent/WO2021150548A1/en not_active Ceased
- 2021-01-21 TW TW110102253A patent/TWI891711B/zh active
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