JP7716593B2 - 熱硬化性樹脂組成物、樹脂シート、放熱板、樹脂シートの製造方法、及び放熱板の製造方法 - Google Patents

熱硬化性樹脂組成物、樹脂シート、放熱板、樹脂シートの製造方法、及び放熱板の製造方法

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Publication number
JP7716593B2
JP7716593B2 JP2024532452A JP2024532452A JP7716593B2 JP 7716593 B2 JP7716593 B2 JP 7716593B2 JP 2024532452 A JP2024532452 A JP 2024532452A JP 2024532452 A JP2024532452 A JP 2024532452A JP 7716593 B2 JP7716593 B2 JP 7716593B2
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Japan
Prior art keywords
resin composition
thermosetting resin
weight
resin
resin sheet
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JP2024532452A
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English (en)
Japanese (ja)
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JPWO2024214487A1 (https=
Inventor
雅枝 矢野
佐紀 阿部
裕二 外山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Arisawa Mfg Co Ltd
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Arisawa Mfg Co Ltd
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Publication of JPWO2024214487A1 publication Critical patent/JPWO2024214487A1/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing atoms other than carbon or hydrogen
    • C08L23/0869—Copolymers of ethene with unsaturated hydrocarbons containing atoms other than carbon or hydrogen with unsaturated acids, e.g. [meth]acrylic acid; with unsaturated esters, e.g. [meth]acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
JP2024532452A 2023-04-14 2024-03-18 熱硬化性樹脂組成物、樹脂シート、放熱板、樹脂シートの製造方法、及び放熱板の製造方法 Active JP7716593B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023066101 2023-04-14
JP2023066101 2023-04-14
PCT/JP2024/010424 WO2024214487A1 (ja) 2023-04-14 2024-03-18 熱硬化性樹脂組成物、樹脂シート、放熱板、樹脂シートの製造方法、及び放熱板の製造方法

Publications (2)

Publication Number Publication Date
JPWO2024214487A1 JPWO2024214487A1 (https=) 2024-10-17
JP7716593B2 true JP7716593B2 (ja) 2025-07-31

Family

ID=93059174

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024532452A Active JP7716593B2 (ja) 2023-04-14 2024-03-18 熱硬化性樹脂組成物、樹脂シート、放熱板、樹脂シートの製造方法、及び放熱板の製造方法

Country Status (4)

Country Link
JP (1) JP7716593B2 (https=)
KR (1) KR20250135888A (https=)
CN (1) CN120731237A (https=)
WO (1) WO2024214487A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008106231A (ja) 2006-09-29 2008-05-08 Toray Ind Inc 電子機器用接着剤シート
JP2016000784A (ja) 2014-06-12 2016-01-07 日東電工株式会社 封止用樹脂シート
CN105733266A (zh) 2016-03-31 2016-07-06 安徽富悦达电子有限公司 一种耐高温抗菌性电缆
WO2023068024A1 (ja) 2021-10-20 2023-04-27 株式会社有沢製作所 熱硬化性樹脂組成物、放熱シート、放熱板、放熱シートの製造方法、及び放熱板の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3209132B2 (ja) 1997-02-27 2001-09-17 日立化成工業株式会社 金属ベース基板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008106231A (ja) 2006-09-29 2008-05-08 Toray Ind Inc 電子機器用接着剤シート
JP2016000784A (ja) 2014-06-12 2016-01-07 日東電工株式会社 封止用樹脂シート
CN105733266A (zh) 2016-03-31 2016-07-06 安徽富悦达电子有限公司 一种耐高温抗菌性电缆
WO2023068024A1 (ja) 2021-10-20 2023-04-27 株式会社有沢製作所 熱硬化性樹脂組成物、放熱シート、放熱板、放熱シートの製造方法、及び放熱板の製造方法

Also Published As

Publication number Publication date
WO2024214487A1 (ja) 2024-10-17
KR20250135888A (ko) 2025-09-15
JPWO2024214487A1 (https=) 2024-10-17
CN120731237A (zh) 2025-09-30

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