JP7716389B2 - 半導体レーザ装置及び半導体レーザ装置の製造方法 - Google Patents
半導体レーザ装置及び半導体レーザ装置の製造方法Info
- Publication number
- JP7716389B2 JP7716389B2 JP2022514042A JP2022514042A JP7716389B2 JP 7716389 B2 JP7716389 B2 JP 7716389B2 JP 2022514042 A JP2022514042 A JP 2022514042A JP 2022514042 A JP2022514042 A JP 2022514042A JP 7716389 B2 JP7716389 B2 JP 7716389B2
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- layer
- barrier layer
- semiconductor laser
- laser device
- composition
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/305—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure
- H01S5/3086—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure doping of the active layer
- H01S5/309—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure doping of the active layer doping of barrier layers that confine charge carriers in the laser structure, e.g. the barriers in a quantum well structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
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- H—ELECTRICITY
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/16—Window-type lasers, i.e. with a region of non-absorbing material between the active region and the reflecting surface
- H01S5/162—Window-type lasers, i.e. with a region of non-absorbing material between the active region and the reflecting surface with window regions made by diffusion or disordening of the active layer
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- H—ELECTRICITY
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2054—Methods of obtaining the confinement
- H01S5/2081—Methods of obtaining the confinement using special etching techniques
- H01S5/2086—Methods of obtaining the confinement using special etching techniques lateral etch control, e.g. mask induced
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2202—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure by making a groove in the upper laser structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/223—Buried stripe structure
- H01S5/2231—Buried stripe structure with inner confining structure only between the active layer and the upper electrode
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- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/305—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure
- H01S5/3054—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure p-doping
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34313—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer having only As as V-compound, e.g. AlGaAs, InGaAs
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34346—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser characterised by the materials of the barrier layers
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2301/00—Functional characteristics
- H01S2301/02—ASE (amplified spontaneous emission), noise; Reduction thereof
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- H01S2301/00—Functional characteristics
- H01S2301/17—Semiconductor lasers comprising special layers
- H01S2301/176—Specific passivation layers on surfaces other than the emission facet
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- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/0234—Up-side down mountings, e.g. Flip-chip, epi-side down mountings or junction down mountings
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- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
- H01S5/0287—Facet reflectivity
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04254—Electrodes, e.g. characterised by the structure characterised by the shape
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2004—Confining in the direction perpendicular to the layer structure
- H01S5/2018—Optical confinement, e.g. absorbing-, reflecting- or waveguide-layers
- H01S5/2031—Optical confinement, e.g. absorbing-, reflecting- or waveguide-layers characterized by special waveguide layers, e.g. asymmetric waveguide layers or defined bandgap discontinuities
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/305—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/3201—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures incorporating bulkstrain effects, e.g. strain compensation, strain related to polarisation
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/3211—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures characterised by special cladding layers, e.g. details on band-discontinuities
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/3407—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers characterised by special barrier layers
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Geometry (AREA)
- Semiconductor Lasers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025121246A JP2025137668A (ja) | 2020-04-06 | 2025-07-18 | 半導体レーザ装置及び半導体レーザ装置の製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020068647 | 2020-04-06 | ||
| JP2020068647 | 2020-04-06 | ||
| PCT/JP2021/014301 WO2021206012A1 (ja) | 2020-04-06 | 2021-04-02 | 半導体レーザ装置及び半導体レーザ装置の製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025121246A Division JP2025137668A (ja) | 2020-04-06 | 2025-07-18 | 半導体レーザ装置及び半導体レーザ装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021206012A1 JPWO2021206012A1 (https=) | 2021-10-14 |
| JPWO2021206012A5 JPWO2021206012A5 (https=) | 2022-12-21 |
| JP7716389B2 true JP7716389B2 (ja) | 2025-07-31 |
Family
ID=78022515
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022514042A Active JP7716389B2 (ja) | 2020-04-06 | 2021-04-02 | 半導体レーザ装置及び半導体レーザ装置の製造方法 |
| JP2025121246A Pending JP2025137668A (ja) | 2020-04-06 | 2025-07-18 | 半導体レーザ装置及び半導体レーザ装置の製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025121246A Pending JP2025137668A (ja) | 2020-04-06 | 2025-07-18 | 半導体レーザ装置及び半導体レーザ装置の製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20230021325A1 (https=) |
| JP (2) | JP7716389B2 (https=) |
| CN (1) | CN115362609A (https=) |
| WO (1) | WO2021206012A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7355740B2 (ja) * | 2018-08-24 | 2023-10-03 | ソニーセミコンダクタソリューションズ株式会社 | 発光素子 |
| US12272929B2 (en) * | 2020-09-14 | 2025-04-08 | Lumentum Japan, Inc. | Optical semiconductor device |
| JP7720334B2 (ja) * | 2021-01-29 | 2025-08-07 | ヌヴォトンテクノロジージャパン株式会社 | 半導体レーザ素子 |
| CN115513346B (zh) * | 2022-11-14 | 2023-04-07 | 泉州三安半导体科技有限公司 | 发光二极管和发光装置 |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004128442A (ja) | 2002-07-29 | 2004-04-22 | Ricoh Co Ltd | 半導体発光素子および光送信用モジュールおよび光通信システム |
| JP2005191349A (ja) | 2003-12-26 | 2005-07-14 | Furukawa Electric Co Ltd:The | 半導体レーザ素子 |
| US20070248135A1 (en) | 2006-04-19 | 2007-10-25 | Mawst Luke J | Quantum well lasers with strained quantum wells and dilute nitride barriers |
| JP2009224370A (ja) | 2008-03-13 | 2009-10-01 | Rohm Co Ltd | 窒化物半導体デバイス |
| WO2014126164A1 (ja) | 2013-02-13 | 2014-08-21 | 古河電気工業株式会社 | 半導体光素子、半導体レーザ素子、及びその製造方法、並びに半導体レーザモジュール及び半導体素子の製造方法 |
| WO2017195502A1 (ja) | 2016-05-13 | 2017-11-16 | パナソニックIpマネジメント株式会社 | 窒化物系発光素子 |
| WO2018003551A1 (ja) | 2016-06-30 | 2018-01-04 | パナソニックIpマネジメント株式会社 | 半導体レーザ装置、半導体レーザモジュール及び溶接用レーザ光源システム |
| WO2019187583A1 (ja) | 2018-03-30 | 2019-10-03 | パナソニックIpマネジメント株式会社 | 半導体発光素子 |
| WO2020022116A1 (ja) | 2018-07-27 | 2020-01-30 | パナソニックIpマネジメント株式会社 | 半導体レーザ素子 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0405758A2 (en) * | 1989-06-27 | 1991-01-02 | Hewlett-Packard Company | Broadband semiconductor optical gain medium |
| JP2785167B2 (ja) * | 1992-06-29 | 1998-08-13 | 国際電信電話株式会社 | 多重量子井戸構造および多重量子井戸構造を用いた半導体素子 |
| JPH11340580A (ja) * | 1997-07-30 | 1999-12-10 | Fujitsu Ltd | 半導体レーザ、半導体発光素子、及び、その製造方法 |
| KR100597532B1 (ko) * | 2001-11-05 | 2006-07-10 | 니치아 카가쿠 고교 가부시키가이샤 | 반도체 소자 |
| JP4284946B2 (ja) * | 2002-08-27 | 2009-06-24 | ソニー株式会社 | 窒化物系半導体発光素子 |
| JP3779248B2 (ja) * | 2002-08-27 | 2006-05-24 | 株式会社東芝 | 半導体レーザ素子 |
| US9124071B2 (en) * | 2012-11-27 | 2015-09-01 | Nichia Corporation | Nitride semiconductor laser element |
| JP6807643B2 (ja) * | 2016-01-08 | 2021-01-06 | 浜松ホトニクス株式会社 | 分布帰還型半導体レーザ素子 |
| TWI754326B (zh) * | 2019-07-19 | 2022-02-01 | 全新光電科技股份有限公司 | 包含具有壓縮應力AlGaAsP層的垂直共振腔表面放射雷射二極體(VCSEL) |
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2021
- 2021-04-02 WO PCT/JP2021/014301 patent/WO2021206012A1/ja not_active Ceased
- 2021-04-02 CN CN202180025008.1A patent/CN115362609A/zh active Pending
- 2021-04-02 JP JP2022514042A patent/JP7716389B2/ja active Active
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2022
- 2022-09-28 US US17/954,587 patent/US20230021325A1/en active Pending
-
2025
- 2025-07-18 JP JP2025121246A patent/JP2025137668A/ja active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004128442A (ja) | 2002-07-29 | 2004-04-22 | Ricoh Co Ltd | 半導体発光素子および光送信用モジュールおよび光通信システム |
| JP2005191349A (ja) | 2003-12-26 | 2005-07-14 | Furukawa Electric Co Ltd:The | 半導体レーザ素子 |
| US20070248135A1 (en) | 2006-04-19 | 2007-10-25 | Mawst Luke J | Quantum well lasers with strained quantum wells and dilute nitride barriers |
| JP2009224370A (ja) | 2008-03-13 | 2009-10-01 | Rohm Co Ltd | 窒化物半導体デバイス |
| WO2014126164A1 (ja) | 2013-02-13 | 2014-08-21 | 古河電気工業株式会社 | 半導体光素子、半導体レーザ素子、及びその製造方法、並びに半導体レーザモジュール及び半導体素子の製造方法 |
| WO2017195502A1 (ja) | 2016-05-13 | 2017-11-16 | パナソニックIpマネジメント株式会社 | 窒化物系発光素子 |
| WO2018003551A1 (ja) | 2016-06-30 | 2018-01-04 | パナソニックIpマネジメント株式会社 | 半導体レーザ装置、半導体レーザモジュール及び溶接用レーザ光源システム |
| WO2019187583A1 (ja) | 2018-03-30 | 2019-10-03 | パナソニックIpマネジメント株式会社 | 半導体発光素子 |
| WO2020022116A1 (ja) | 2018-07-27 | 2020-01-30 | パナソニックIpマネジメント株式会社 | 半導体レーザ素子 |
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| JP2025137668A (ja) | 2025-09-19 |
| CN115362609A (zh) | 2022-11-18 |
| US20230021325A1 (en) | 2023-01-26 |
| WO2021206012A1 (ja) | 2021-10-14 |
| JPWO2021206012A1 (https=) | 2021-10-14 |
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