JP7709353B2 - 基板、積層構造、及び積層構造の製造方法 - Google Patents

基板、積層構造、及び積層構造の製造方法

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Publication number
JP7709353B2
JP7709353B2 JP2021164737A JP2021164737A JP7709353B2 JP 7709353 B2 JP7709353 B2 JP 7709353B2 JP 2021164737 A JP2021164737 A JP 2021164737A JP 2021164737 A JP2021164737 A JP 2021164737A JP 7709353 B2 JP7709353 B2 JP 7709353B2
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Japan
Prior art keywords
substrate
self
electrode
assembled film
group
Prior art date
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Application number
JP2021164737A
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English (en)
Japanese (ja)
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JP2023055392A (ja
Inventor
基裕 山原
一幸 登尾
貢士 田口
直登 菅沼
豊治 寺田
孝志 晴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kabushikigaisya SAKIGAKEHANDOTAI
Toray Engineering Co Ltd
Original Assignee
Kabushikigaisya SAKIGAKEHANDOTAI
Toray Engineering Co Ltd
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Application filed by Kabushikigaisya SAKIGAKEHANDOTAI, Toray Engineering Co Ltd filed Critical Kabushikigaisya SAKIGAKEHANDOTAI
Priority to JP2021164737A priority Critical patent/JP7709353B2/ja
Publication of JP2023055392A publication Critical patent/JP2023055392A/ja
Priority to JP2025025057A priority patent/JP2025068057A/ja
Application granted granted Critical
Publication of JP7709353B2 publication Critical patent/JP7709353B2/ja
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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP2021164737A 2021-10-06 2021-10-06 基板、積層構造、及び積層構造の製造方法 Active JP7709353B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021164737A JP7709353B2 (ja) 2021-10-06 2021-10-06 基板、積層構造、及び積層構造の製造方法
JP2025025057A JP2025068057A (ja) 2021-10-06 2025-02-19 基板、積層構造、及び積層構造の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021164737A JP7709353B2 (ja) 2021-10-06 2021-10-06 基板、積層構造、及び積層構造の製造方法

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JP2025025057A Division JP2025068057A (ja) 2021-10-06 2025-02-19 基板、積層構造、及び積層構造の製造方法

Publications (2)

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JP2023055392A JP2023055392A (ja) 2023-04-18
JP7709353B2 true JP7709353B2 (ja) 2025-07-16

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JP2021164737A Active JP7709353B2 (ja) 2021-10-06 2021-10-06 基板、積層構造、及び積層構造の製造方法
JP2025025057A Pending JP2025068057A (ja) 2021-10-06 2025-02-19 基板、積層構造、及び積層構造の製造方法

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025248907A1 (ja) * 2024-05-27 2025-12-04 Ｊｘ金属株式会社 ハイブリッド接合方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007220884A (ja) 2006-02-16 2007-08-30 Kagawa Univ 電極とその製造方法およびそれを用いたリード配線とその接続方法およびそれらを用いた電子部品と電子機器
WO2010073660A1 (ja) 2008-12-25 2010-07-01 パナソニック株式会社 リード、配線部材、パッケージ部品、樹脂付金属部品及び樹脂封止半導体装置、並びにこれらの製造方法
JP2010242136A (ja) 2009-04-02 2010-10-28 Kazufumi Ogawa 金属微粒子、メッキ液、リード線及び関連する方法
JP2012023067A (ja) 2010-07-12 2012-02-02 Panasonic Corp 電子部品実装方法
JP2012195614A (ja) 2007-09-20 2012-10-11 Ibiden Co Ltd 積層体の製造方法
JP2013105803A (ja) 2011-11-11 2013-05-30 Seiko Epson Corp 接合方法および接合体
WO2017110808A1 (ja) 2015-12-24 2017-06-29 大日本印刷株式会社 配線構造体とその製造方法および電子装置
JP2020509578A (ja) 2017-03-02 2020-03-26 エーファウ・グループ・エー・タルナー・ゲーエムベーハー チップを接合する方法および装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007220884A (ja) 2006-02-16 2007-08-30 Kagawa Univ 電極とその製造方法およびそれを用いたリード配線とその接続方法およびそれらを用いた電子部品と電子機器
JP2012195614A (ja) 2007-09-20 2012-10-11 Ibiden Co Ltd 積層体の製造方法
WO2010073660A1 (ja) 2008-12-25 2010-07-01 パナソニック株式会社 リード、配線部材、パッケージ部品、樹脂付金属部品及び樹脂封止半導体装置、並びにこれらの製造方法
JP2010242136A (ja) 2009-04-02 2010-10-28 Kazufumi Ogawa 金属微粒子、メッキ液、リード線及び関連する方法
JP2012023067A (ja) 2010-07-12 2012-02-02 Panasonic Corp 電子部品実装方法
JP2013105803A (ja) 2011-11-11 2013-05-30 Seiko Epson Corp 接合方法および接合体
WO2017110808A1 (ja) 2015-12-24 2017-06-29 大日本印刷株式会社 配線構造体とその製造方法および電子装置
JP2020509578A (ja) 2017-03-02 2020-03-26 エーファウ・グループ・エー・タルナー・ゲーエムベーハー チップを接合する方法および装置

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Publication number Publication date
JP2023055392A (ja) 2023-04-18
JP2025068057A (ja) 2025-04-24

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