JP7697473B2 - 酸化セリウム及び研磨剤 - Google Patents

酸化セリウム及び研磨剤 Download PDF

Info

Publication number
JP7697473B2
JP7697473B2 JP2022553899A JP2022553899A JP7697473B2 JP 7697473 B2 JP7697473 B2 JP 7697473B2 JP 2022553899 A JP2022553899 A JP 2022553899A JP 2022553899 A JP2022553899 A JP 2022553899A JP 7697473 B2 JP7697473 B2 JP 7697473B2
Authority
JP
Japan
Prior art keywords
cerium oxide
desorption
polishing
cerium
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022553899A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022071120A1 (https=
Inventor
友洋 渋谷
有造 岡村
拓 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of JPWO2022071120A1 publication Critical patent/JPWO2022071120A1/ja
Priority to JP2025074308A priority Critical patent/JP2025105845A/ja
Application granted granted Critical
Publication of JP7697473B2 publication Critical patent/JP7697473B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2022553899A 2020-09-30 2021-09-24 酸化セリウム及び研磨剤 Active JP7697473B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025074308A JP2025105845A (ja) 2020-09-30 2025-04-28 酸化セリウム及び研磨剤

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020164640 2020-09-30
JP2020164640 2020-09-30
PCT/JP2021/035109 WO2022071120A1 (ja) 2020-09-30 2021-09-24 酸化セリウム及び研磨剤

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025074308A Division JP2025105845A (ja) 2020-09-30 2025-04-28 酸化セリウム及び研磨剤

Publications (2)

Publication Number Publication Date
JPWO2022071120A1 JPWO2022071120A1 (https=) 2022-04-07
JP7697473B2 true JP7697473B2 (ja) 2025-06-24

Family

ID=80950331

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022553899A Active JP7697473B2 (ja) 2020-09-30 2021-09-24 酸化セリウム及び研磨剤
JP2025074308A Pending JP2025105845A (ja) 2020-09-30 2025-04-28 酸化セリウム及び研磨剤

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025074308A Pending JP2025105845A (ja) 2020-09-30 2025-04-28 酸化セリウム及び研磨剤

Country Status (4)

Country Link
EP (1) EP4223849A4 (https=)
JP (2) JP7697473B2 (https=)
TW (1) TWI906375B (https=)
WO (1) WO2022071120A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000073211A1 (en) 1999-05-28 2000-12-07 Hitachi Chemical Co., Ltd. Method for producing cerium oxide, cerium oxide abrasive, method for polishing substrate using the same and method for manufacturing semiconductor device
JP2004168638A (ja) 2002-10-28 2004-06-17 Nissan Chem Ind Ltd 酸化セリウム粒子及び多段階焼成による製造方法
WO2009031447A1 (ja) 2007-09-07 2009-03-12 Asahi Glass Company, Limited 酸化物結晶微粒子の製造方法
JP2015047568A (ja) 2013-09-02 2015-03-16 株式会社キャタラー 排気ガス浄化用触媒
JP2015188881A (ja) 2014-03-31 2015-11-02 エヌ・イーケムキャット株式会社 リン捕集材およびそれを用いた自動車排気ガス浄化触媒

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6691061B2 (ja) 2014-06-24 2020-04-28 ローディア オペレーションズ 金属ドープ酸化セリウム組成物
CN106978089A (zh) * 2017-04-20 2017-07-25 德米特（苏州）电子环保材料有限公司 一种稀土抛光粉的制备方法
JP7187770B2 (ja) 2017-11-08 2022-12-13 Ａｇｃ株式会社 研磨剤と研磨方法、および研磨用添加液
JP7167814B2 (ja) 2019-03-29 2022-11-09 三菱ケミカル株式会社 改質ピッチの製造方法
CN114599750A (zh) * 2019-10-22 2022-06-07 Cmc材料股份有限公司 用于硅氧化物和碳掺杂的硅氧化物的化学机械抛光的组合物及方法
WO2022050242A1 (ja) * 2020-09-04 2022-03-10 Ａｇｃ株式会社 酸化セリウム及び研磨剤

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000073211A1 (en) 1999-05-28 2000-12-07 Hitachi Chemical Co., Ltd. Method for producing cerium oxide, cerium oxide abrasive, method for polishing substrate using the same and method for manufacturing semiconductor device
JP2004168638A (ja) 2002-10-28 2004-06-17 Nissan Chem Ind Ltd 酸化セリウム粒子及び多段階焼成による製造方法
WO2009031447A1 (ja) 2007-09-07 2009-03-12 Asahi Glass Company, Limited 酸化物結晶微粒子の製造方法
JP2015047568A (ja) 2013-09-02 2015-03-16 株式会社キャタラー 排気ガス浄化用触媒
JP2015188881A (ja) 2014-03-31 2015-11-02 エヌ・イーケムキャット株式会社 リン捕集材およびそれを用いた自動車排気ガス浄化触媒

Also Published As

Publication number Publication date
TWI906375B (zh) 2025-12-01
WO2022071120A1 (ja) 2022-04-07
JPWO2022071120A1 (https=) 2022-04-07
EP4223849A4 (en) 2024-10-23
EP4223849A1 (en) 2023-08-09
JP2025105845A (ja) 2025-07-10
TW202214523A (zh) 2022-04-16

Similar Documents

Publication Publication Date Title
JP5475642B2 (ja) 研磨材用酸化セリウム粉末及びこれを含むｃｍｐスラリー
KR102875340B1 (ko) 산화 세륨 입자 및 이의 제조방법, 산화 세륨 입자를 포함하는 화학적 기계적 연마 슬러리 조성물의 제조방법
JP6827318B2 (ja) 酸化セリウム砥粒
KR20100004181A (ko) 화학 기계적 연마용 슬러리 조성물, 이의 제조 방법 및화학 기계적 연마방법
JP7044510B2 (ja) 酸化セリウム含有複合研磨材
EP2896672A2 (en) Manufacturing method of polishing agent, polishing method, and manufacturing method of semiconductor integrated circuit device
JP7790349B2 (ja) 酸化セリウム及び研磨剤
JP7697473B2 (ja) 酸化セリウム及び研磨剤
JP2009007543A (ja) 研磨液組成物
US9328261B2 (en) Polishing agent, polishing method, and manufacturing method of semiconductor integrated circuit device
JP7019379B2 (ja) 複合砥粒
US12503622B2 (en) Cerium-based particle and polishing slurry composition including the same
JP6761339B2 (ja) 酸化セリウム砥粒
KR20250096253A (ko) 화학적 기계적 연마 슬러리 조성물 및 반도체 소자의 제조 방법
KR20250096252A (ko) 화학적 기계적 연마 슬러리 조성물 및 반도체 소자의 제조 방법
KR20250096250A (ko) 화학적 기계적 연마 슬러리 조성물 및 반도체 소자의 제조 방법
JP2015034243A (ja) Ｃｍｐ用研磨液
KR20250096249A (ko) 화학적 기계적 연마 슬러리 조성물 및 반도체 소자의 제조 방법
KR20250096255A (ko) 화학적 기계적 연마 슬러리 조성물 및 반도체 소자의 제조 방법

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240209

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250107

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20250228

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250428

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20250513

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20250526

R150 Certificate of patent or registration of utility model

Ref document number: 7697473

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150