JPWO2022071120A1 - - Google Patents
Info
- Publication number
- JPWO2022071120A1 JPWO2022071120A1 JP2022553899A JP2022553899A JPWO2022071120A1 JP WO2022071120 A1 JPWO2022071120 A1 JP WO2022071120A1 JP 2022553899 A JP2022553899 A JP 2022553899A JP 2022553899 A JP2022553899 A JP 2022553899A JP WO2022071120 A1 JPWO2022071120 A1 JP WO2022071120A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10P95/06—Planarisation of inorganic insulating materials
- H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025074308A JP2025105845A (ja) | 2020-09-30 | 2025-04-28 | 酸化セリウム及び研磨剤 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020164640 | 2020-09-30 | ||
| JP2020164640 | 2020-09-30 | ||
| PCT/JP2021/035109 WO2022071120A1 (ja) | 2020-09-30 | 2021-09-24 | 酸化セリウム及び研磨剤 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025074308A Division JP2025105845A (ja) | 2020-09-30 | 2025-04-28 | 酸化セリウム及び研磨剤 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022071120A1 true JPWO2022071120A1 (https=) | 2022-04-07 |
| JP7697473B2 JP7697473B2 (ja) | 2025-06-24 |
Family
ID=80950331
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022553899A Active JP7697473B2 (ja) | 2020-09-30 | 2021-09-24 | 酸化セリウム及び研磨剤 |
| JP2025074308A Pending JP2025105845A (ja) | 2020-09-30 | 2025-04-28 | 酸化セリウム及び研磨剤 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025074308A Pending JP2025105845A (ja) | 2020-09-30 | 2025-04-28 | 酸化セリウム及び研磨剤 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP4223849A4 (https=) |
| JP (2) | JP7697473B2 (https=) |
| TW (1) | TWI906375B (https=) |
| WO (1) | WO2022071120A1 (https=) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000073211A1 (en) * | 1999-05-28 | 2000-12-07 | Hitachi Chemical Co., Ltd. | Method for producing cerium oxide, cerium oxide abrasive, method for polishing substrate using the same and method for manufacturing semiconductor device |
| JP2004168638A (ja) * | 2002-10-28 | 2004-06-17 | Nissan Chem Ind Ltd | 酸化セリウム粒子及び多段階焼成による製造方法 |
| WO2009031447A1 (ja) * | 2007-09-07 | 2009-03-12 | Asahi Glass Company, Limited | 酸化物結晶微粒子の製造方法 |
| JP2015047568A (ja) * | 2013-09-02 | 2015-03-16 | 株式会社キャタラー | 排気ガス浄化用触媒 |
| JP2015188881A (ja) * | 2014-03-31 | 2015-11-02 | エヌ・イーケムキャット株式会社 | リン捕集材およびそれを用いた自動車排気ガス浄化触媒 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6691061B2 (ja) | 2014-06-24 | 2020-04-28 | ローディア オペレーションズ | 金属ドープ酸化セリウム組成物 |
| CN106978089A (zh) * | 2017-04-20 | 2017-07-25 | 德米特（苏州）电子环保材料有限公司 | 一种稀土抛光粉的制备方法 |
| JP7187770B2 (ja) | 2017-11-08 | 2022-12-13 | Ａｇｃ株式会社 | 研磨剤と研磨方法、および研磨用添加液 |
| JP7167814B2 (ja) | 2019-03-29 | 2022-11-09 | 三菱ケミカル株式会社 | 改質ピッチの製造方法 |
| CN114599750A (zh) * | 2019-10-22 | 2022-06-07 | Cmc材料股份有限公司 | 用于硅氧化物和碳掺杂的硅氧化物的化学机械抛光的组合物及方法 |
| WO2022050242A1 (ja) * | 2020-09-04 | 2022-03-10 | Ａｇｃ株式会社 | 酸化セリウム及び研磨剤 |
-
2021
- 2021-09-24 WO PCT/JP2021/035109 patent/WO2022071120A1/ja not_active Ceased
- 2021-09-24 JP JP2022553899A patent/JP7697473B2/ja active Active
- 2021-09-24 EP EP21875422.4A patent/EP4223849A4/en active Pending
- 2021-09-28 TW TW110135952A patent/TWI906375B/zh active
-
2025
- 2025-04-28 JP JP2025074308A patent/JP2025105845A/ja active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000073211A1 (en) * | 1999-05-28 | 2000-12-07 | Hitachi Chemical Co., Ltd. | Method for producing cerium oxide, cerium oxide abrasive, method for polishing substrate using the same and method for manufacturing semiconductor device |
| JP2004168638A (ja) * | 2002-10-28 | 2004-06-17 | Nissan Chem Ind Ltd | 酸化セリウム粒子及び多段階焼成による製造方法 |
| WO2009031447A1 (ja) * | 2007-09-07 | 2009-03-12 | Asahi Glass Company, Limited | 酸化物結晶微粒子の製造方法 |
| JP2015047568A (ja) * | 2013-09-02 | 2015-03-16 | 株式会社キャタラー | 排気ガス浄化用触媒 |
| JP2015188881A (ja) * | 2014-03-31 | 2015-11-02 | エヌ・イーケムキャット株式会社 | リン捕集材およびそれを用いた自動車排気ガス浄化触媒 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7697473B2 (ja) | 2025-06-24 |
| TWI906375B (zh) | 2025-12-01 |
| WO2022071120A1 (ja) | 2022-04-07 |
| EP4223849A4 (en) | 2024-10-23 |
| EP4223849A1 (en) | 2023-08-09 |
| JP2025105845A (ja) | 2025-07-10 |
| TW202214523A (zh) | 2022-04-16 |
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