TWI906375B - 二氧化鈰及研磨劑 - Google Patents

二氧化鈰及研磨劑

Info

Publication number
TWI906375B
TWI906375B TW110135952A TW110135952A TWI906375B TW I906375 B TWI906375 B TW I906375B TW 110135952 A TW110135952 A TW 110135952A TW 110135952 A TW110135952 A TW 110135952A TW I906375 B TWI906375 B TW I906375B
Authority
TW
Taiwan
Prior art keywords
cerium dioxide
cerium
metals
desorption
temperature
Prior art date
Application number
TW110135952A
Other languages
English (en)
Chinese (zh)
Other versions
TW202214523A (zh
Inventor
渋谷友洋
岡村有造
山田拓
Original Assignee
日商Ａｇｃ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ａｇｃ股份有限公司 filed Critical 日商Ａｇｃ股份有限公司
Publication of TW202214523A publication Critical patent/TW202214523A/zh
Application granted granted Critical
Publication of TWI906375B publication Critical patent/TWI906375B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW110135952A 2020-09-30 2021-09-28 二氧化鈰及研磨劑 TWI906375B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020164640 2020-09-30
JP2020-164640 2020-09-30

Publications (2)

Publication Number Publication Date
TW202214523A TW202214523A (zh) 2022-04-16
TWI906375B true TWI906375B (zh) 2025-12-01

Family

ID=80950331

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110135952A TWI906375B (zh) 2020-09-30 2021-09-28 二氧化鈰及研磨劑

Country Status (4)

Country Link
EP (1) EP4223849A4 (https=)
JP (2) JP7697473B2 (https=)
TW (1) TWI906375B (https=)
WO (1) WO2022071120A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101784486A (zh) * 2007-09-07 2010-07-21 旭硝子株式会社 氧化物晶体微粒的制造方法
TW201615275A (zh) * 2014-06-24 2016-05-01 羅地亞經營管理公司 金屬摻雜氧化鈰組合物
CN106978089A (zh) * 2017-04-20 2017-07-25 德米特（苏州）电子环保材料有限公司 一种稀土抛光粉的制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2394960A3 (en) * 1999-05-28 2013-03-13 Hitachi Chemical Co., Ltd. Method for producing cerium oxide
JP4273920B2 (ja) * 2002-10-28 2009-06-03 日産化学工業株式会社 酸化セリウム粒子及び多段階焼成による製造方法
JP2015047568A (ja) * 2013-09-02 2015-03-16 株式会社キャタラー 排気ガス浄化用触媒
JP6371557B2 (ja) * 2014-03-31 2018-08-08 エヌ・イーケムキャット株式会社 リン捕集材およびそれを用いた自動車排気ガス浄化触媒
JP7187770B2 (ja) 2017-11-08 2022-12-13 Ａｇｃ株式会社 研磨剤と研磨方法、および研磨用添加液
JP7167814B2 (ja) 2019-03-29 2022-11-09 三菱ケミカル株式会社 改質ピッチの製造方法
CN114599750A (zh) * 2019-10-22 2022-06-07 Cmc材料股份有限公司 用于硅氧化物和碳掺杂的硅氧化物的化学机械抛光的组合物及方法
WO2022050242A1 (ja) * 2020-09-04 2022-03-10 Ａｇｃ株式会社 酸化セリウム及び研磨剤

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101784486A (zh) * 2007-09-07 2010-07-21 旭硝子株式会社 氧化物晶体微粒的制造方法
TW201615275A (zh) * 2014-06-24 2016-05-01 羅地亞經營管理公司 金屬摻雜氧化鈰組合物
CN106978089A (zh) * 2017-04-20 2017-07-25 德米特（苏州）电子环保材料有限公司 一种稀土抛光粉的制备方法

Also Published As

Publication number Publication date
JP7697473B2 (ja) 2025-06-24
WO2022071120A1 (ja) 2022-04-07
JPWO2022071120A1 (https=) 2022-04-07
EP4223849A4 (en) 2024-10-23
EP4223849A1 (en) 2023-08-09
JP2025105845A (ja) 2025-07-10
TW202214523A (zh) 2022-04-16

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