JP7688727B2 - アルカリ可溶性樹脂、感光性樹脂組成物及びその硬化物 - Google Patents

アルカリ可溶性樹脂、感光性樹脂組成物及びその硬化物 Download PDF

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JP7688727B2
JP7688727B2 JP2023569364A JP2023569364A JP7688727B2 JP 7688727 B2 JP7688727 B2 JP 7688727B2 JP 2023569364 A JP2023569364 A JP 2023569364A JP 2023569364 A JP2023569364 A JP 2023569364A JP 7688727 B2 JP7688727 B2 JP 7688727B2
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group
alkali
acid
soluble resin
carbon atoms
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Japanese (ja)
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JPWO2023120355A5 (https=
JPWO2023120355A1 (https=
Inventor
拓真 寺田
信章 大槻
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Nippon Shokubai Co Ltd
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Nippon Shokubai Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14Polycondensates modified by chemical after-treatment
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP2023569364A 2021-12-21 2022-12-15 アルカリ可溶性樹脂、感光性樹脂組成物及びその硬化物 Active JP7688727B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2021207332 2021-12-21
JP2021207332 2021-12-21
JP2022165600 2022-10-14
JP2022165600 2022-10-14
PCT/JP2022/046165 WO2023120355A1 (ja) 2021-12-21 2022-12-15 アルカリ可溶性樹脂、感光性樹脂組成物及びその硬化物

Publications (3)

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JPWO2023120355A1 JPWO2023120355A1 (https=) 2023-06-29
JPWO2023120355A5 JPWO2023120355A5 (https=) 2024-09-03
JP7688727B2 true JP7688727B2 (ja) 2025-06-04

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JP (1) JP7688727B2 (https=)
TW (1) TW202340302A (https=)
WO (1) WO2023120355A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN121152825A (zh) * 2023-08-01 2025-12-16 株式会社艾迪科 组合物、黑色矩阵、固化物及固化物的制造方法以及显示装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006071880A (ja) 2004-09-01 2006-03-16 Taiyo Ink Mfg Ltd 光導波路材料用の光硬化性・熱硬化性ドライフィルム、及びその硬化物並びに光・電気混載基板
JP2017068242A (ja) 2015-09-30 2017-04-06 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP2020186325A (ja) 2019-05-15 2020-11-19 株式会社日本触媒 アルカリ可溶性樹脂、及び、硬化性樹脂組成物
WO2021039799A1 (ja) 2019-08-27 2021-03-04 株式会社日本触媒 硬化性組成物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006071880A (ja) 2004-09-01 2006-03-16 Taiyo Ink Mfg Ltd 光導波路材料用の光硬化性・熱硬化性ドライフィルム、及びその硬化物並びに光・電気混載基板
JP2017068242A (ja) 2015-09-30 2017-04-06 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP2020186325A (ja) 2019-05-15 2020-11-19 株式会社日本触媒 アルカリ可溶性樹脂、及び、硬化性樹脂組成物
WO2021039799A1 (ja) 2019-08-27 2021-03-04 株式会社日本触媒 硬化性組成物

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WO2023120355A1 (ja) 2023-06-29
JPWO2023120355A1 (https=) 2023-06-29
TW202340302A (zh) 2023-10-16

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