JP7682379B2 - 接合体および弾性波素子 - Google Patents

接合体および弾性波素子 Download PDF

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Publication number
JP7682379B2
JP7682379B2 JP2024511194A JP2024511194A JP7682379B2 JP 7682379 B2 JP7682379 B2 JP 7682379B2 JP 2024511194 A JP2024511194 A JP 2024511194A JP 2024511194 A JP2024511194 A JP 2024511194A JP 7682379 B2 JP7682379 B2 JP 7682379B2
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Japan
Prior art keywords
piezoelectric material
layer
material layer
substrate
argon
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JP2024511194A
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English (en)
Japanese (ja)
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JPWO2023188514A5 (https=
JPWO2023188514A1 (https=
Inventor
祐葵 伊藤
泰士 高橋
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NGK Insulators Ltd
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NGK Insulators Ltd
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Publication of JPWO2023188514A1 publication Critical patent/JPWO2023188514A1/ja
Publication of JPWO2023188514A5 publication Critical patent/JPWO2023188514A5/ja
Priority to JP2025080369A priority Critical patent/JP7811679B2/ja
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
JP2024511194A 2022-03-30 2022-11-10 接合体および弾性波素子 Active JP7682379B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025080369A JP7811679B2 (ja) 2022-03-30 2025-05-13 接合体および弾性波素子

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022056518 2022-03-30
JP2022056518 2022-03-30
PCT/JP2022/041912 WO2023188514A1 (ja) 2022-03-30 2022-11-10 接合体および弾性波素子

Related Child Applications (1)

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JP2025080369A Division JP7811679B2 (ja) 2022-03-30 2025-05-13 接合体および弾性波素子

Publications (3)

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JPWO2023188514A1 JPWO2023188514A1 (https=) 2023-10-05
JPWO2023188514A5 JPWO2023188514A5 (https=) 2024-10-10
JP7682379B2 true JP7682379B2 (ja) 2025-05-23

Family

ID=88199939

Family Applications (2)

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JP2024511194A Active JP7682379B2 (ja) 2022-03-30 2022-11-10 接合体および弾性波素子
JP2025080369A Active JP7811679B2 (ja) 2022-03-30 2025-05-13 接合体および弾性波素子

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JP2025080369A Active JP7811679B2 (ja) 2022-03-30 2025-05-13 接合体および弾性波素子

Country Status (6)

Country Link
US (1) US20250023551A1 (https=)
JP (2) JP7682379B2 (https=)
KR (1) KR102937541B1 (https=)
CN (1) CN118872204A (https=)
DE (1) DE112022006665T5 (https=)
WO (1) WO2023188514A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20260052906A1 (en) * 2024-08-16 2026-02-19 Tel Manufacturing And Engineering Of America, Inc. Method for processing a substrate

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011171359A (ja) 2010-02-16 2011-09-01 Hitachi Cable Ltd 圧電薄膜素子及び圧電薄膜デバイス
US20180175826A1 (en) 2016-12-15 2018-06-21 Qorvo Us, Inc. Bulk acoustic wave resonator with multilayer piezoelectric structure
JP2020182137A (ja) 2019-04-26 2020-11-05 京セラ株式会社 弾性波装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06303073A (ja) * 1993-02-17 1994-10-28 Fujitsu Ltd 弾性表面波デバイスとその製造方法
JPH07202631A (ja) * 1993-11-25 1995-08-04 Fujitsu Ltd 弾性表面波装置及びその製造方法
WO2020250490A1 (ja) 2019-06-11 2020-12-17 日本碍子株式会社 複合基板、弾性波素子および複合基板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011171359A (ja) 2010-02-16 2011-09-01 Hitachi Cable Ltd 圧電薄膜素子及び圧電薄膜デバイス
US20180175826A1 (en) 2016-12-15 2018-06-21 Qorvo Us, Inc. Bulk acoustic wave resonator with multilayer piezoelectric structure
JP2020182137A (ja) 2019-04-26 2020-11-05 京セラ株式会社 弾性波装置

Also Published As

Publication number Publication date
JP7811679B2 (ja) 2026-02-05
KR20240167884A (ko) 2024-11-28
US20250023551A1 (en) 2025-01-16
JP2025107428A (ja) 2025-07-17
JPWO2023188514A1 (https=) 2023-10-05
KR102937541B1 (ko) 2026-03-10
CN118872204A (zh) 2024-10-29
WO2023188514A1 (ja) 2023-10-05
DE112022006665T5 (de) 2024-12-12

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