CN118872204A - 接合体及弹性波元件 - Google Patents

接合体及弹性波元件 Download PDF

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Publication number
CN118872204A
CN118872204A CN202280093066.2A CN202280093066A CN118872204A CN 118872204 A CN118872204 A CN 118872204A CN 202280093066 A CN202280093066 A CN 202280093066A CN 118872204 A CN118872204 A CN 118872204A
Authority
CN
China
Prior art keywords
piezoelectric material
layer
material layer
argon
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280093066.2A
Other languages
English (en)
Chinese (zh)
Inventor
伊藤祐葵
高桥泰士
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of CN118872204A publication Critical patent/CN118872204A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
CN202280093066.2A 2022-03-30 2022-11-10 接合体及弹性波元件 Pending CN118872204A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022056518 2022-03-30
JP2022-056518 2022-03-30
PCT/JP2022/041912 WO2023188514A1 (ja) 2022-03-30 2022-11-10 接合体および弾性波素子

Publications (1)

Publication Number Publication Date
CN118872204A true CN118872204A (zh) 2024-10-29

Family

ID=88199939

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280093066.2A Pending CN118872204A (zh) 2022-03-30 2022-11-10 接合体及弹性波元件

Country Status (6)

Country Link
US (1) US20250023551A1 (https=)
JP (2) JP7682379B2 (https=)
KR (1) KR102937541B1 (https=)
CN (1) CN118872204A (https=)
DE (1) DE112022006665T5 (https=)
WO (1) WO2023188514A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20260052906A1 (en) * 2024-08-16 2026-02-19 Tel Manufacturing And Engineering Of America, Inc. Method for processing a substrate

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06303073A (ja) * 1993-02-17 1994-10-28 Fujitsu Ltd 弾性表面波デバイスとその製造方法
JPH07202631A (ja) * 1993-11-25 1995-08-04 Fujitsu Ltd 弾性表面波装置及びその製造方法
JP5029711B2 (ja) * 2010-02-16 2012-09-19 日立電線株式会社 圧電薄膜素子及び圧電薄膜デバイス
US10727809B2 (en) 2016-12-15 2020-07-28 Qorvo Us, Inc. Bulk acoustic wave resonator with multilayer piezoelectric structure
JP7493306B2 (ja) * 2019-04-26 2024-05-31 京セラ株式会社 弾性波装置
WO2020250490A1 (ja) 2019-06-11 2020-12-17 日本碍子株式会社 複合基板、弾性波素子および複合基板の製造方法

Also Published As

Publication number Publication date
JP7682379B2 (ja) 2025-05-23
JP7811679B2 (ja) 2026-02-05
KR20240167884A (ko) 2024-11-28
US20250023551A1 (en) 2025-01-16
JP2025107428A (ja) 2025-07-17
JPWO2023188514A1 (https=) 2023-10-05
KR102937541B1 (ko) 2026-03-10
WO2023188514A1 (ja) 2023-10-05
DE112022006665T5 (de) 2024-12-12

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