JPWO2023188514A1 - - Google Patents
Info
- Publication number
- JPWO2023188514A1 JPWO2023188514A1 JP2024511194A JP2024511194A JPWO2023188514A1 JP WO2023188514 A1 JPWO2023188514 A1 JP WO2023188514A1 JP 2024511194 A JP2024511194 A JP 2024511194A JP 2024511194 A JP2024511194 A JP 2024511194A JP WO2023188514 A1 JPWO2023188514 A1 JP WO2023188514A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/25—Constructional features of resonators using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025080369A JP7811679B2 (ja) | 2022-03-30 | 2025-05-13 | 接合体および弾性波素子 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022056518 | 2022-03-30 | ||
| JP2022056518 | 2022-03-30 | ||
| PCT/JP2022/041912 WO2023188514A1 (ja) | 2022-03-30 | 2022-11-10 | 接合体および弾性波素子 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025080369A Division JP7811679B2 (ja) | 2022-03-30 | 2025-05-13 | 接合体および弾性波素子 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023188514A1 true JPWO2023188514A1 (https=) | 2023-10-05 |
| JPWO2023188514A5 JPWO2023188514A5 (https=) | 2024-10-10 |
| JP7682379B2 JP7682379B2 (ja) | 2025-05-23 |
Family
ID=88199939
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024511194A Active JP7682379B2 (ja) | 2022-03-30 | 2022-11-10 | 接合体および弾性波素子 |
| JP2025080369A Active JP7811679B2 (ja) | 2022-03-30 | 2025-05-13 | 接合体および弾性波素子 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025080369A Active JP7811679B2 (ja) | 2022-03-30 | 2025-05-13 | 接合体および弾性波素子 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20250023551A1 (https=) |
| JP (2) | JP7682379B2 (https=) |
| KR (1) | KR102937541B1 (https=) |
| CN (1) | CN118872204A (https=) |
| DE (1) | DE112022006665T5 (https=) |
| WO (1) | WO2023188514A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20260052906A1 (en) * | 2024-08-16 | 2026-02-19 | Tel Manufacturing And Engineering Of America, Inc. | Method for processing a substrate |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06303073A (ja) * | 1993-02-17 | 1994-10-28 | Fujitsu Ltd | 弾性表面波デバイスとその製造方法 |
| JPH07202631A (ja) * | 1993-11-25 | 1995-08-04 | Fujitsu Ltd | 弾性表面波装置及びその製造方法 |
| JP2011171359A (ja) * | 2010-02-16 | 2011-09-01 | Hitachi Cable Ltd | 圧電薄膜素子及び圧電薄膜デバイス |
| US20180175826A1 (en) * | 2016-12-15 | 2018-06-21 | Qorvo Us, Inc. | Bulk acoustic wave resonator with multilayer piezoelectric structure |
| JP2020182137A (ja) * | 2019-04-26 | 2020-11-05 | 京セラ株式会社 | 弾性波装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020250490A1 (ja) | 2019-06-11 | 2020-12-17 | 日本碍子株式会社 | 複合基板、弾性波素子および複合基板の製造方法 |
-
2022
- 2022-11-10 DE DE112022006665.2T patent/DE112022006665T5/de active Pending
- 2022-11-10 WO PCT/JP2022/041912 patent/WO2023188514A1/ja not_active Ceased
- 2022-11-10 KR KR1020247035752A patent/KR102937541B1/ko active Active
- 2022-11-10 JP JP2024511194A patent/JP7682379B2/ja active Active
- 2022-11-10 CN CN202280093066.2A patent/CN118872204A/zh active Pending
-
2024
- 2024-09-27 US US18/899,612 patent/US20250023551A1/en active Pending
-
2025
- 2025-05-13 JP JP2025080369A patent/JP7811679B2/ja active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06303073A (ja) * | 1993-02-17 | 1994-10-28 | Fujitsu Ltd | 弾性表面波デバイスとその製造方法 |
| JPH07202631A (ja) * | 1993-11-25 | 1995-08-04 | Fujitsu Ltd | 弾性表面波装置及びその製造方法 |
| JP2011171359A (ja) * | 2010-02-16 | 2011-09-01 | Hitachi Cable Ltd | 圧電薄膜素子及び圧電薄膜デバイス |
| US20180175826A1 (en) * | 2016-12-15 | 2018-06-21 | Qorvo Us, Inc. | Bulk acoustic wave resonator with multilayer piezoelectric structure |
| JP2020182137A (ja) * | 2019-04-26 | 2020-11-05 | 京セラ株式会社 | 弾性波装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7682379B2 (ja) | 2025-05-23 |
| JP7811679B2 (ja) | 2026-02-05 |
| KR20240167884A (ko) | 2024-11-28 |
| US20250023551A1 (en) | 2025-01-16 |
| JP2025107428A (ja) | 2025-07-17 |
| KR102937541B1 (ko) | 2026-03-10 |
| CN118872204A (zh) | 2024-10-29 |
| WO2023188514A1 (ja) | 2023-10-05 |
| DE112022006665T5 (de) | 2024-12-12 |
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