JP7632780B1 - エッチング組成物 - Google Patents

エッチング組成物 Download PDF

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Publication number
JP7632780B1
JP7632780B1 JP2024569040A JP2024569040A JP7632780B1 JP 7632780 B1 JP7632780 B1 JP 7632780B1 JP 2024569040 A JP2024569040 A JP 2024569040A JP 2024569040 A JP2024569040 A JP 2024569040A JP 7632780 B1 JP7632780 B1 JP 7632780B1
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JP
Japan
Prior art keywords
mass
less
etching
allyltrimethoxysilane
etching composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024569040A
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English (en)
Japanese (ja)
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JPWO2025023298A5 (https=
JPWO2025023298A1 (https=
Inventor
遥 平高
勲 山下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tosoh Corp
Original Assignee
Tosoh Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tosoh Corp filed Critical Tosoh Corp
Priority to JP2024203372A priority Critical patent/JP2025019189A/ja
Publication of JPWO2025023298A1 publication Critical patent/JPWO2025023298A1/ja
Application granted granted Critical
Publication of JP7632780B1 publication Critical patent/JP7632780B1/ja
Publication of JPWO2025023298A5 publication Critical patent/JPWO2025023298A5/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/69—Etching of wafers, substrates or parts of devices using masks for semiconductor materials
    • H10P50/691—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Weting (AREA)
  • Semiconductor Memories (AREA)
JP2024569040A 2023-07-25 2024-07-25 エッチング組成物 Active JP7632780B1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024203372A JP2025019189A (ja) 2023-07-25 2024-11-21 エッチング組成物

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2023121097 2023-07-25
JP2023121097 2023-07-25
JP2023192709 2023-11-13
JP2023192709 2023-11-13
PCT/JP2024/026645 WO2025023298A1 (ja) 2023-07-25 2024-07-25 エッチング組成物

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024203372A Division JP2025019189A (ja) 2023-07-25 2024-11-21 エッチング組成物

Publications (3)

Publication Number Publication Date
JPWO2025023298A1 JPWO2025023298A1 (https=) 2025-01-30
JP7632780B1 true JP7632780B1 (ja) 2025-02-19
JPWO2025023298A5 JPWO2025023298A5 (https=) 2025-07-01

Family

ID=94375448

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024569040A Active JP7632780B1 (ja) 2023-07-25 2024-07-25 エッチング組成物

Country Status (3)

Country Link
JP (1) JP7632780B1 (https=)
TW (1) TW202505000A (https=)
WO (1) WO2025023298A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070009448A1 (en) * 2005-02-25 2007-01-11 Kanca John A Iii Silanol based dental treatment
JP2021015968A (ja) * 2019-07-12 2021-02-12 オーシーアイ カンパニー リミテッドＯＣＩ Ｃｏｍｐａｎｙ Ｌｔｄ． シリコン窒化膜エッチング溶液及びこの製造方法
KR102325905B1 (ko) * 2021-03-22 2021-11-12 연세대학교 산학협력단 실리콘 질화막 식각 조성물 및 이를 이용한 식각방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070009448A1 (en) * 2005-02-25 2007-01-11 Kanca John A Iii Silanol based dental treatment
JP2021015968A (ja) * 2019-07-12 2021-02-12 オーシーアイ カンパニー リミテッドＯＣＩ Ｃｏｍｐａｎｙ Ｌｔｄ． シリコン窒化膜エッチング溶液及びこの製造方法
KR102325905B1 (ko) * 2021-03-22 2021-11-12 연세대학교 산학협력단 실리콘 질화막 식각 조성물 및 이를 이용한 식각방법

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PARK, Taegun et al.，Passivation of poly-Si surface using vinyl and epoxy group additives for selective Si3N4 etching in H3PO4 solution，Applied Surface Science，2022年10月04日，Vol. 608, 155143，pp. 1-9
PARK, TAEGUN ET AL.: "Passivation of poly-Si surface using vinyl and epoxy group additives for selective Si3N4 etching in", APPLIED SURFACE SCIENCE, vol. Vol. 608, 155143, JPN6024037618, 4 October 2022 (2022-10-04), pages 1 - 9, ISSN: 0005500206 *

Also Published As

Publication number Publication date
WO2025023298A1 (ja) 2025-01-30
TW202505000A (zh) 2025-02-01
JPWO2025023298A1 (https=) 2025-01-30

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