JP7632779B1 - エッチング組成物 - Google Patents

エッチング組成物 Download PDF

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Publication number
JP7632779B1
JP7632779B1 JP2024569039A JP2024569039A JP7632779B1 JP 7632779 B1 JP7632779 B1 JP 7632779B1 JP 2024569039 A JP2024569039 A JP 2024569039A JP 2024569039 A JP2024569039 A JP 2024569039A JP 7632779 B1 JP7632779 B1 JP 7632779B1
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JP
Japan
Prior art keywords
mass
etching
less
allyltriethoxysilane
etching composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024569039A
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English (en)
Japanese (ja)
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JPWO2025023288A1 (https=
JPWO2025023288A5 (https=
Inventor
遥 平高
勲 山下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tosoh Corp
Original Assignee
Tosoh Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tosoh Corp filed Critical Tosoh Corp
Priority to JP2024203360A priority Critical patent/JP2025019188A/ja
Publication of JPWO2025023288A1 publication Critical patent/JPWO2025023288A1/ja
Application granted granted Critical
Publication of JP7632779B1 publication Critical patent/JP7632779B1/ja
Publication of JPWO2025023288A5 publication Critical patent/JPWO2025023288A5/ja
Active legal-status Critical Current
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/69—Etching of wafers, substrates or parts of devices using masks for semiconductor materials
    • H10P50/691—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Weting (AREA)
  • Semiconductor Memories (AREA)
JP2024569039A 2023-07-25 2024-07-25 エッチング組成物 Active JP7632779B1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024203360A JP2025019188A (ja) 2023-07-25 2024-11-21 エッチング組成物

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2023121091 2023-07-25
JP2023121091 2023-07-25
JP2023192706 2023-11-13
JP2023192706 2023-11-13
PCT/JP2024/026543 WO2025023288A1 (ja) 2023-07-25 2024-07-25 エッチング組成物

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024203360A Division JP2025019188A (ja) 2023-07-25 2024-11-21 エッチング組成物

Publications (3)

Publication Number Publication Date
JPWO2025023288A1 JPWO2025023288A1 (https=) 2025-01-30
JP7632779B1 true JP7632779B1 (ja) 2025-02-19
JPWO2025023288A5 JPWO2025023288A5 (https=) 2025-07-01

Family

ID=94375416

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024569039A Active JP7632779B1 (ja) 2023-07-25 2024-07-25 エッチング組成物

Country Status (3)

Country Link
JP (1) JP7632779B1 (https=)
TW (1) TW202509184A (https=)
WO (1) WO2025023288A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070009448A1 (en) * 2005-02-25 2007-01-11 Kanca John A Iii Silanol based dental treatment
US20190382659A1 (en) * 2018-06-15 2019-12-19 Enf Technology Co., Ltd. Polysiloxane-based compound, silicon nitride layer etching composition including the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070009448A1 (en) * 2005-02-25 2007-01-11 Kanca John A Iii Silanol based dental treatment
US20190382659A1 (en) * 2018-06-15 2019-12-19 Enf Technology Co., Ltd. Polysiloxane-based compound, silicon nitride layer etching composition including the same

Also Published As

Publication number Publication date
JPWO2025023288A1 (https=) 2025-01-30
WO2025023288A1 (ja) 2025-01-30
TW202509184A (zh) 2025-03-01

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