JPWO2025023288A1 - - Google Patents
Info
- Publication number
- JPWO2025023288A1 JPWO2025023288A1 JP2024569039A JP2024569039A JPWO2025023288A1 JP WO2025023288 A1 JPWO2025023288 A1 JP WO2025023288A1 JP 2024569039 A JP2024569039 A JP 2024569039A JP 2024569039 A JP2024569039 A JP 2024569039A JP WO2025023288 A1 JPWO2025023288 A1 JP WO2025023288A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/69—Etching of wafers, substrates or parts of devices using masks for semiconductor materials
- H10P50/691—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Weting (AREA)
- Semiconductor Memories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024203360A JP2025019188A (ja) | 2023-07-25 | 2024-11-21 | エッチング組成物 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023121091 | 2023-07-25 | ||
| JP2023121091 | 2023-07-25 | ||
| JP2023192706 | 2023-11-13 | ||
| JP2023192706 | 2023-11-13 | ||
| PCT/JP2024/026543 WO2025023288A1 (ja) | 2023-07-25 | 2024-07-25 | エッチング組成物 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024203360A Division JP2025019188A (ja) | 2023-07-25 | 2024-11-21 | エッチング組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2025023288A1 true JPWO2025023288A1 (https=) | 2025-01-30 |
| JP7632779B1 JP7632779B1 (ja) | 2025-02-19 |
| JPWO2025023288A5 JPWO2025023288A5 (https=) | 2025-07-01 |
Family
ID=94375416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024569039A Active JP7632779B1 (ja) | 2023-07-25 | 2024-07-25 | エッチング組成物 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7632779B1 (https=) |
| TW (1) | TW202509184A (https=) |
| WO (1) | WO2025023288A1 (https=) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070009448A1 (en) * | 2005-02-25 | 2007-01-11 | Kanca John A Iii | Silanol based dental treatment |
| CN110606954B (zh) * | 2018-06-15 | 2023-03-24 | 易案爱富科技有限公司 | 聚硅氧烷类化合物、包含所述聚硅氧烷类化合物的氮化硅层蚀刻组合物 |
-
2024
- 2024-07-25 TW TW113127664A patent/TW202509184A/zh unknown
- 2024-07-25 JP JP2024569039A patent/JP7632779B1/ja active Active
- 2024-07-25 WO PCT/JP2024/026543 patent/WO2025023288A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2025023288A1 (ja) | 2025-01-30 |
| JP7632779B1 (ja) | 2025-02-19 |
| TW202509184A (zh) | 2025-03-01 |
Similar Documents
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