JP7570822B2 - 情報処理装置、及び情報処理方法 - Google Patents

情報処理装置、及び情報処理方法 Download PDF

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Publication number
JP7570822B2
JP7570822B2 JP2020079055A JP2020079055A JP7570822B2 JP 7570822 B2 JP7570822 B2 JP 7570822B2 JP 2020079055 A JP2020079055 A JP 2020079055A JP 2020079055 A JP2020079055 A JP 2020079055A JP 7570822 B2 JP7570822 B2 JP 7570822B2
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Japan
Prior art keywords
processing
recipe
substrate
data
information
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Japanese (ja)
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JP2021173914A5 (enExample
JP2021173914A (ja
Inventor
巨樹 宮田
健太 北
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Canon Inc
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Canon Inc
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Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2020079055A priority Critical patent/JP7570822B2/ja
Priority to SG10202103767WA priority patent/SG10202103767WA/en
Priority to TW110113541A priority patent/TWI820413B/zh
Priority to KR1020210052051A priority patent/KR20210133151A/ko
Priority to US17/239,332 priority patent/US11829676B2/en
Priority to EP21170546.2A priority patent/EP3904978A3/en
Priority to CN202110465952.0A priority patent/CN113571444A/zh
Publication of JP2021173914A publication Critical patent/JP2021173914A/ja
Publication of JP2021173914A5 publication Critical patent/JP2021173914A5/ja
Priority to US18/492,587 priority patent/US12242765B2/en
Priority to JP2024172065A priority patent/JP7732057B2/ja
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    • G05—CONTROLLING; REGULATING
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    • G05B19/02—Programme-control systems electric
    • G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
    • G05B19/042—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
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    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
    • G05B23/0221—Preprocessing measurements, e.g. data collection rate adjustment; Standardization of measurements; Time series or signal analysis, e.g. frequency analysis or wavelets; Trustworthiness of measurements; Indexes therefor; Measurements using easily measured parameters to estimate parameters difficult to measure; Virtual sensor creation; De-noising; Sensor fusion; Unconventional preprocessing inherently present in specific fault detection methods like PCA-based methods
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    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/706835—Metrology information management or control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
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    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
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    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
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    • G05B23/0259—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the response to fault detection
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    • G05B23/00—Testing or monitoring of control systems or parts thereof
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    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0259—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the response to fault detection
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    • G06F3/14—Digital output to display device ; Cooperation and interconnection of the display device with other functional units
    • G06F3/147—Digital output to display device ; Cooperation and interconnection of the display device with other functional units using display panels
    • G—PHYSICS
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    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • General Engineering & Computer Science (AREA)
  • Databases & Information Systems (AREA)
  • Human Computer Interaction (AREA)
  • Data Mining & Analysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Software Systems (AREA)
  • Computational Linguistics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Power Engineering (AREA)
  • Epidemiology (AREA)
  • Quality & Reliability (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • User Interface Of Digital Computer (AREA)
  • Multi-Process Working Machines And Systems (AREA)
  • General Factory Administration (AREA)
JP2020079055A 2020-04-28 2020-04-28 情報処理装置、及び情報処理方法 Active JP7570822B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2020079055A JP7570822B2 (ja) 2020-04-28 2020-04-28 情報処理装置、及び情報処理方法
SG10202103767WA SG10202103767WA (en) 2020-04-28 2021-04-13 Information processing apparatus and information processing method
TW110113541A TWI820413B (zh) 2020-04-28 2021-04-15 資訊處理設備、資訊處理方法、物品製造系統及物品製造方法
KR1020210052051A KR20210133151A (ko) 2020-04-28 2021-04-22 정보처리장치 및 정보처리방법
US17/239,332 US11829676B2 (en) 2020-04-28 2021-04-23 Information processing apparatus and information processing method
EP21170546.2A EP3904978A3 (en) 2020-04-28 2021-04-26 Information processing apparatus and information processing method
CN202110465952.0A CN113571444A (zh) 2020-04-28 2021-04-28 信息处理装置和信息处理方法
US18/492,587 US12242765B2 (en) 2020-04-28 2023-10-23 Information processing apparatus and information processing method
JP2024172065A JP7732057B2 (ja) 2020-04-28 2024-10-01 情報処理装置、及び情報処理方法

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Application Number Priority Date Filing Date Title
JP2020079055A JP7570822B2 (ja) 2020-04-28 2020-04-28 情報処理装置、及び情報処理方法

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JP2021173914A JP2021173914A (ja) 2021-11-01
JP2021173914A5 JP2021173914A5 (enExample) 2023-05-15
JP7570822B2 true JP7570822B2 (ja) 2024-10-22

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JP2024172065A Active JP7732057B2 (ja) 2020-04-28 2024-10-01 情報処理装置、及び情報処理方法

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US (2) US11829676B2 (enExample)
EP (1) EP3904978A3 (enExample)
JP (2) JP7570822B2 (enExample)
KR (1) KR20210133151A (enExample)
CN (1) CN113571444A (enExample)
SG (1) SG10202103767WA (enExample)
TW (1) TWI820413B (enExample)

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Publication number Priority date Publication date Assignee Title
JP7665347B2 (ja) * 2021-02-04 2025-04-21 キヤノン株式会社 情報処理装置、及び情報処理方法
CN116262440A (zh) * 2021-12-14 2023-06-16 荷兰移动驱动器公司 系统界面控制方法、车辆终端及计算机可读存储介质

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WO2005045907A1 (ja) 2003-11-10 2005-05-19 Renesas Technology Corp. 半導体集積回路装置の製造方法
WO2006019166A1 (ja) 2004-08-19 2006-02-23 Nikon Corporation アライメント情報表示方法とそのプログラム、アライメント方法、露光方法、デバイス製造方法、表示システム、表示装置、プログラム及び測定／検査装置
JP2007042701A (ja) 2005-08-01 2007-02-15 Nikon Corp 情報表示システム
US20130253866A1 (en) 2010-11-13 2013-09-26 Abb Technology Ag Intelligent visualisation in the monitoring of process and/or system variables
JP2014529909A (ja) 2011-09-01 2014-11-13 ケーエルエー−テンカー コーポレイション 問題のある高度プロセス制御パラメータの検出及び訂正のための方法及びシステム

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