JP7568826B2 - プローブカード - Google Patents

プローブカード Download PDF

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Publication number
JP7568826B2
JP7568826B2 JP2023506376A JP2023506376A JP7568826B2 JP 7568826 B2 JP7568826 B2 JP 7568826B2 JP 2023506376 A JP2023506376 A JP 2023506376A JP 2023506376 A JP2023506376 A JP 2023506376A JP 7568826 B2 JP7568826 B2 JP 7568826B2
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JP
Japan
Prior art keywords
coating
probe card
wiring board
substrate
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023506376A
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English (en)
Japanese (ja)
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JPWO2022195648A1 (https=
Inventor
祐樹 中村
雅敏 羽坂
寛士 山中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Electronic Materials Corp
Original Assignee
Japan Electronic Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Electronic Materials Corp filed Critical Japan Electronic Materials Corp
Publication of JPWO2022195648A1 publication Critical patent/JPWO2022195648A1/ja
Application granted granted Critical
Publication of JP7568826B2 publication Critical patent/JP7568826B2/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/03—Electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2023506376A 2021-03-15 2021-03-15 プローブカード Active JP7568826B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/010294 WO2022195648A1 (ja) 2021-03-15 2021-03-15 プローブカード

Publications (2)

Publication Number Publication Date
JPWO2022195648A1 JPWO2022195648A1 (https=) 2022-09-22
JP7568826B2 true JP7568826B2 (ja) 2024-10-16

Family

ID=83320040

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023506376A Active JP7568826B2 (ja) 2021-03-15 2021-03-15 プローブカード

Country Status (6)

Country Link
US (1) US12467953B2 (https=)
JP (1) JP7568826B2 (https=)
KR (1) KR102825586B1 (https=)
CN (1) CN116547543B (https=)
TW (1) TWI795122B (https=)
WO (1) WO2022195648A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7459368B2 (ja) * 2021-02-19 2024-04-01 日本電子材料株式会社 プローブカード用アライメントチップ、プローブカード及びプローブカード補修方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000346875A (ja) 1999-06-07 2000-12-15 Advantest Corp プローブカードおよびこれを用いたｉｃ試験装置
JP2002532822A (ja) 1998-12-04 2002-10-02 ピージェイオー（インディサーム）リミテッド 導電性材料

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4567432A (en) * 1983-06-09 1986-01-28 Texas Instruments Incorporated Apparatus for testing integrated circuits
JPH0196944A (ja) 1987-10-08 1989-04-14 Nec Corp 高周波特性測定装置
JPH05226430A (ja) * 1992-02-10 1993-09-03 Nitto Denko Corp プローブカード構造体およびその製法
JPH09321413A (ja) * 1996-05-30 1997-12-12 Hitachi Ltd 電子回路基板の配線修正方法およびその装置
JPH11154694A (ja) 1997-11-21 1999-06-08 Matsushita Electric Ind Co Ltd ウェハ一括型測定検査用アライメント方法およびプローブカードの製造方法
US6429671B1 (en) 1998-11-25 2002-08-06 Advanced Micro Devices, Inc. Electrical test probe card having a removable probe head assembly with alignment features and a method for aligning the probe head assembly to the probe card
GB9826596D0 (en) 1998-12-04 1999-01-27 P J O Ind Limited Conductive materials
JP2001330626A (ja) 2000-05-22 2001-11-30 Micronics Japan Co Ltd プローブカード及びこれにアライメントマークを形成する方法
JP2004233155A (ja) * 2003-01-29 2004-08-19 Fujitsu Ltd プローブカードおよび半導体チップの検査方法
KR200339049Y1 (ko) 2003-10-13 2004-01-16 김영혜 이중 전압의 사용이 가능한 면상발열판을 구비한 히터
JP4971636B2 (ja) 2006-01-06 2012-07-11 川崎マイクロエレクトロニクス株式会社 プローブカードの取り付け位置ずれの検出方法及びプローバ装置
WO2008120575A1 (ja) 2007-04-03 2008-10-09 Advantest Corporation コンタクタの実装方法
KR100913916B1 (ko) * 2008-04-17 2009-08-26 (주)오리엔탈드림 발열체의 절연피막 형성방법
JP5251395B2 (ja) * 2008-09-24 2013-07-31 富士通株式会社 多層配線基板、プローブカード、及び、多層配線基板の製造方法
JP5199859B2 (ja) 2008-12-24 2013-05-15 株式会社日本マイクロニクス プローブカード
JP2011117761A (ja) 2009-12-01 2011-06-16 Japan Electronic Materials Corp プローブカードおよびプローブカードの製造方法
JP6259590B2 (ja) * 2013-06-12 2018-01-10 株式会社日本マイクロニクス プローブカード及びその製造方法
KR20160066678A (ko) * 2014-12-02 2016-06-13 단국대학교 산학협력단 필름 히터 및 이를 구비한 프로브 스테이션
JP6652443B2 (ja) * 2016-05-06 2020-02-26 株式会社日本マイクロニクス 多層配線基板及びこれを用いたプローブカード
JP6782103B2 (ja) * 2016-06-21 2020-11-11 株式会社日本マイクロニクス プローブカード、検査装置および検査方法
JP6348626B2 (ja) 2017-02-23 2018-06-27 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
CN107132470A (zh) * 2017-05-31 2017-09-05 格科微电子（上海）有限公司 适用于晶圆级测试的治具
CN107523864B (zh) * 2017-09-26 2024-12-17 深圳市石金科技股份有限公司 一种多晶硅铸锭炉的组合式加热器及多晶硅铸锭炉
TWM587275U (zh) * 2018-12-04 2019-12-01 蔚華科技股份有限公司 測試半導體設備之結構
CN210657221U (zh) * 2019-07-17 2020-06-02 浙江晶阳机电有限公司 一种硅芯铸锭炉用加热结构
JP7459368B2 (ja) 2021-02-19 2024-04-01 日本電子材料株式会社 プローブカード用アライメントチップ、プローブカード及びプローブカード補修方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002532822A (ja) 1998-12-04 2002-10-02 ピージェイオー（インディサーム）リミテッド 導電性材料
JP2000346875A (ja) 1999-06-07 2000-12-15 Advantest Corp プローブカードおよびこれを用いたｉｃ試験装置

Also Published As

Publication number Publication date
US12467953B2 (en) 2025-11-11
JPWO2022195648A1 (https=) 2022-09-22
KR102825586B1 (ko) 2025-06-26
TW202314258A (zh) 2023-04-01
CN116547543A (zh) 2023-08-04
WO2022195648A1 (ja) 2022-09-22
TW202238152A (zh) 2022-10-01
TWI795122B (zh) 2023-03-01
KR20230082670A (ko) 2023-06-08
US20240044942A1 (en) 2024-02-08
CN116547543B (zh) 2026-01-27

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