JP7558882B2 - 電子装置 - Google Patents

電子装置 Download PDF

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Publication number
JP7558882B2
JP7558882B2 JP2021074861A JP2021074861A JP7558882B2 JP 7558882 B2 JP7558882 B2 JP 7558882B2 JP 2021074861 A JP2021074861 A JP 2021074861A JP 2021074861 A JP2021074861 A JP 2021074861A JP 7558882 B2 JP7558882 B2 JP 7558882B2
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JP
Japan
Prior art keywords
distance
straight line
electronic device
line portion
package
Prior art date
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Active
Application number
JP2021074861A
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English (en)
Japanese (ja)
Other versions
JP2022169064A (ja
JP2022169064A5 (enExample
Inventor
直哉 白井
芳和 三原
智康 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
NGK Electronics Devices Inc
Original Assignee
NGK Insulators Ltd
NGK Electronics Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd, NGK Electronics Devices Inc filed Critical NGK Insulators Ltd
Priority to JP2021074861A priority Critical patent/JP7558882B2/ja
Priority to US17/700,717 priority patent/US11929301B2/en
Publication of JP2022169064A publication Critical patent/JP2022169064A/ja
Publication of JP2022169064A5 publication Critical patent/JP2022169064A5/ja
Application granted granted Critical
Publication of JP7558882B2 publication Critical patent/JP7558882B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2021074861A 2021-04-27 2021-04-27 電子装置 Active JP7558882B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021074861A JP7558882B2 (ja) 2021-04-27 2021-04-27 電子装置
US17/700,717 US11929301B2 (en) 2021-04-27 2022-03-22 Package and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021074861A JP7558882B2 (ja) 2021-04-27 2021-04-27 電子装置

Publications (3)

Publication Number Publication Date
JP2022169064A JP2022169064A (ja) 2022-11-09
JP2022169064A5 JP2022169064A5 (enExample) 2023-03-10
JP7558882B2 true JP7558882B2 (ja) 2024-10-01

Family

ID=83694524

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021074861A Active JP7558882B2 (ja) 2021-04-27 2021-04-27 電子装置

Country Status (2)

Country Link
US (1) US11929301B2 (enExample)
JP (1) JP7558882B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4475167B1 (en) * 2023-06-06 2025-07-30 Infineon Technologies AG Methods for producing a seal for a semiconductor module, and a housing for a semiconductor module

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009016649A (ja) 2007-07-06 2009-01-22 Nikon Corp 固体撮像装置
JP2010219441A (ja) 2009-03-18 2010-09-30 Sumitomo Metal Electronics Devices Inc 電子部品収納用パッケージ
WO2013161660A1 (ja) 2012-04-23 2013-10-31 京セラ株式会社 半導体素子収納用パッケージおよび半導体装置
WO2016111044A1 (ja) 2015-01-08 2016-07-14 株式会社村田製作所 圧電振動部品及びその製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001015624A (ja) * 1999-06-28 2001-01-19 Ngk Spark Plug Co Ltd 配線基板封止用リッド及びこれを用いた配線基板
JP2005150133A (ja) 2003-11-11 2005-06-09 Sumitomo Metal Electronics Devices Inc 半導体素子収納用容器
JP3862737B1 (ja) 2005-10-18 2006-12-27 栄樹 津島 クラッド材およびその製造方法、クラッド材の成型方法、クラッド材を用いた放熱基板
JP5137425B2 (ja) * 2006-04-24 2013-02-06 パナソニック株式会社 光学デバイス用パッケージとその製造方法
JP2012028491A (ja) * 2010-07-22 2012-02-09 Taiyo Yuden Co Ltd 電気化学デバイス
JP5836796B2 (ja) * 2011-12-28 2015-12-24 日本特殊陶業株式会社 セラミックパッケージ
JP6167494B2 (ja) * 2012-09-26 2017-07-26 セイコーエプソン株式会社 電子デバイス用容器の製造方法、電子デバイスの製造方法、電子デバイス、電子機器及び移動体機器
JP6565671B2 (ja) * 2015-03-11 2019-08-28 株式会社大真空 圧電デバイス
JP2020150049A (ja) * 2019-03-12 2020-09-17 住友電工デバイス・イノベーション株式会社 半導体装置の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009016649A (ja) 2007-07-06 2009-01-22 Nikon Corp 固体撮像装置
JP2010219441A (ja) 2009-03-18 2010-09-30 Sumitomo Metal Electronics Devices Inc 電子部品収納用パッケージ
WO2013161660A1 (ja) 2012-04-23 2013-10-31 京セラ株式会社 半導体素子収納用パッケージおよび半導体装置
WO2016111044A1 (ja) 2015-01-08 2016-07-14 株式会社村田製作所 圧電振動部品及びその製造方法

Also Published As

Publication number Publication date
US20220344236A1 (en) 2022-10-27
JP2022169064A (ja) 2022-11-09
US11929301B2 (en) 2024-03-12

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