JP7558291B2 - インクセット、積層体、及び、積層体の製造方法 - Google Patents

インクセット、積層体、及び、積層体の製造方法 Download PDF

Info

Publication number
JP7558291B2
JP7558291B2 JP2022553506A JP2022553506A JP7558291B2 JP 7558291 B2 JP7558291 B2 JP 7558291B2 JP 2022553506 A JP2022553506 A JP 2022553506A JP 2022553506 A JP2022553506 A JP 2022553506A JP 7558291 B2 JP7558291 B2 JP 7558291B2
Authority
JP
Japan
Prior art keywords
ink
insulating
conductive
meth
acrylate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022553506A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022070593A5 (https=
JPWO2022070593A1 (https=
Inventor
勇介 藤井
和公 横井
洋平 高橋
紘平 竹下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of JPWO2022070593A1 publication Critical patent/JPWO2022070593A1/ja
Publication of JPWO2022070593A5 publication Critical patent/JPWO2022070593A5/ja
Application granted granted Critical
Publication of JP7558291B2 publication Critical patent/JP7558291B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
    • B41M7/009—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock using thermal means, e.g. infrared radiation, heat
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/32—Inkjet printing inks characterised by colouring agents
    • C09D11/322—Pigment inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/40—Ink-sets specially adapted for multi-colour inkjet printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2022553506A 2020-09-30 2021-08-02 インクセット、積層体、及び、積層体の製造方法 Active JP7558291B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202063085155P 2020-09-30 2020-09-30
US63/085,155 2020-09-30
PCT/JP2021/028607 WO2022070593A1 (ja) 2020-09-30 2021-08-02 インクセット、積層体、及び、積層体の製造方法

Publications (3)

Publication Number Publication Date
JPWO2022070593A1 JPWO2022070593A1 (https=) 2022-04-07
JPWO2022070593A5 JPWO2022070593A5 (https=) 2023-06-07
JP7558291B2 true JP7558291B2 (ja) 2024-09-30

Family

ID=80951313

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022553506A Active JP7558291B2 (ja) 2020-09-30 2021-08-02 インクセット、積層体、及び、積層体の製造方法

Country Status (5)

Country Link
US (1) US20230250307A1 (https=)
EP (1) EP4223846A4 (https=)
JP (1) JP7558291B2 (https=)
CN (1) CN116601246B (https=)
WO (1) WO2022070593A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023074507A1 (ja) * 2021-10-25 2023-05-04 富士フイルム株式会社 電子デバイスの製造方法
CN118994970A (zh) * 2024-08-21 2024-11-22 广东工业大学 一种导电油墨的制备方法及其应用

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004241514A (ja) 2003-02-05 2004-08-26 Mitsui Chemicals Inc 多層回路基板およびその製造方法
JP2010182776A (ja) 2009-02-04 2010-08-19 Konica Minolta Holdings Inc 導電膜パターンおよび導電膜パターンの形成方法
JP2012060084A (ja) 2010-09-13 2012-03-22 Toshiba Tec Corp 導電パターンの形成方法および印刷物
JP2012193229A (ja) 2011-03-15 2012-10-11 Seiko Epson Corp 放射線硬化型インクジェットインク用インク組成物、記録物、及びインクジェット記録方法
JP2014189680A (ja) 2013-03-27 2014-10-06 Toppan Forms Co Ltd 銀インク組成物及び導電体
JP2015183180A (ja) 2014-03-26 2015-10-22 株式会社タムラ製作所 感光性組成物
JP2016041820A (ja) 2015-10-27 2016-03-31 セイコーエプソン株式会社 放射線硬化型インクジェット用インク組成物、インクジェット記録方法
JP2016069416A (ja) 2014-09-26 2016-05-09 富士フイルム株式会社 重合性組成物、インクジェット記録用インク組成物、インクジェット記録方法、及び記録物
JP2017516887A (ja) 2014-04-17 2017-06-22 エレクトロニンクス インコーポレイテッド 導電性インク組成物
US20180112089A1 (en) 2015-05-01 2018-04-26 Sun Chemical Corporation Electrically-insulating energy-curable inkjet fluids
JP2019096442A (ja) 2017-11-21 2019-06-20 ナガセケムテックス株式会社 金属パターンを備える基材の製造方法および金属インク
JP2019102499A (ja) 2017-11-28 2019-06-24 東洋インキＳｃホールディングス株式会社 積層体の製造方法、および積層体

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5459936A (en) 1977-10-03 1979-05-15 Canon Inc Recording method and device therefor
JPS62173463A (ja) 1986-01-28 1987-07-30 Fuji Photo Film Co Ltd 画像形成方法
JPS62183457A (ja) 1986-02-07 1987-08-11 Fuji Photo Film Co Ltd 画像形成方法
JP3630089B2 (ja) * 1999-09-29 2005-03-16 セイコーエプソン株式会社 インク組成物およびそれを用いたインクジェット記録方法
JP2003183401A (ja) 2001-12-20 2003-07-03 Showa Denko Kk 硬化性樹脂組成物およびその硬化物
JP4171607B2 (ja) 2002-04-16 2008-10-22 富士フイルム株式会社 水性インク
KR100524069B1 (ko) 2003-04-04 2005-10-26 삼성전자주식회사 홈 에이전트 관리장치 및 관리방법
JP2005317837A (ja) * 2004-04-30 2005-11-10 Calsonic Kansei Corp プリント配線の製造方法
KR100814231B1 (ko) 2005-12-01 2008-03-17 주식회사 엘지화학 옥심 에스테르를 포함하는 트리아진계 광활성 화합물을포함하는 투명한 감광성 조성물
US8940464B2 (en) 2005-12-01 2015-01-27 Basf Se Oxime ester photoinitiators
US20090292039A1 (en) 2006-12-27 2009-11-26 Adeka Corporation Oxime ester compound and photopolymerization initiator containing the same
EP1958994B1 (en) * 2007-01-31 2010-12-08 FUJIFILM Corporation Ink set for inkjet recording and inkjet recording method
JP5227560B2 (ja) * 2007-09-28 2013-07-03 富士フイルム株式会社 インク組成物、インクジェット記録方法、印刷物、及び、成形印刷物の製造方法
JP2009221114A (ja) 2008-03-13 2009-10-01 Fujifilm Corp 重合開始機能を有する化合物、重合開始剤、重合性組成物、カラーフィルタ及びその製造方法、ならびに固体撮像素子
WO2009131189A1 (ja) 2008-04-25 2009-10-29 三菱化学株式会社 ケトオキシムエステル系化合物及びその利用
JP2010015025A (ja) 2008-07-04 2010-01-21 Adeka Corp 特定の光重合開始剤を含有する感光性組成物
JP2010262028A (ja) 2009-04-30 2010-11-18 Nippon Steel Chem Co Ltd ブラックマトリックス用感光性樹脂組成物
JP5434337B2 (ja) * 2009-07-28 2014-03-05 カシオ計算機株式会社 画像処理装置及びプログラム
JP5409575B2 (ja) * 2010-09-29 2014-02-05 富士フイルム株式会社 金属膜材料の製造方法、及びそれを用いた金属膜材料
CN103153952B (zh) 2010-10-05 2016-07-13 巴斯夫欧洲公司 苯并咔唑化合物的肟酯衍生物及其在可光聚合组合物中作为光敏引发剂的用途
KR101531891B1 (ko) 2011-04-20 2015-06-29 주식회사 잉크테크 은 잉크 조성물
EP2745657A4 (en) * 2011-08-19 2015-04-29 Fujifilm Corp CONDUCTIVE STRUCTURE, METHOD OF MANUFACTURING THEREFOR, PCB AND MANUFACTURING METHOD THEREFOR
JP2013114249A (ja) 2011-12-01 2013-06-10 Toppan Printing Co Ltd 黒色感光性樹脂組成物およびカラーフィルタ
EP2788325B1 (en) 2011-12-07 2016-08-10 Basf Se Oxime ester photoinitiators
JP5772642B2 (ja) 2012-02-09 2015-09-02 Jsr株式会社 硬化性樹脂組成物、表示素子用硬化膜、表示素子用硬化膜の形成方法及び表示素子
JP6065596B2 (ja) 2013-01-16 2017-01-25 Jsr株式会社 感放射線性着色組成物、着色硬化膜及び表示素子
JP2014240464A (ja) * 2013-06-12 2014-12-25 富士フイルム株式会社 インクジェットインク組成物、及び、インクジェット記録方法
CN105531260B (zh) 2013-09-10 2019-05-31 巴斯夫欧洲公司 肟酯光引发剂
US10597547B2 (en) 2015-12-14 2020-03-24 King Abdullah University Of Science And Technology Silver-organo-complex ink with high conductivity and inkjet stability
JP6392941B2 (ja) * 2017-06-26 2018-09-19 マクセルホールディングス株式会社 エネルギー線硬化型プライマーインク
WO2019188081A1 (ja) * 2018-03-30 2019-10-03 富士フイルム株式会社 転写フィルム、積層体の製造方法、積層体、静電容量型入力装置、及び、画像表示装置

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004241514A (ja) 2003-02-05 2004-08-26 Mitsui Chemicals Inc 多層回路基板およびその製造方法
JP2010182776A (ja) 2009-02-04 2010-08-19 Konica Minolta Holdings Inc 導電膜パターンおよび導電膜パターンの形成方法
JP2012060084A (ja) 2010-09-13 2012-03-22 Toshiba Tec Corp 導電パターンの形成方法および印刷物
JP2012193229A (ja) 2011-03-15 2012-10-11 Seiko Epson Corp 放射線硬化型インクジェットインク用インク組成物、記録物、及びインクジェット記録方法
JP2014189680A (ja) 2013-03-27 2014-10-06 Toppan Forms Co Ltd 銀インク組成物及び導電体
JP2015183180A (ja) 2014-03-26 2015-10-22 株式会社タムラ製作所 感光性組成物
JP2017516887A (ja) 2014-04-17 2017-06-22 エレクトロニンクス インコーポレイテッド 導電性インク組成物
JP2016069416A (ja) 2014-09-26 2016-05-09 富士フイルム株式会社 重合性組成物、インクジェット記録用インク組成物、インクジェット記録方法、及び記録物
US20180112089A1 (en) 2015-05-01 2018-04-26 Sun Chemical Corporation Electrically-insulating energy-curable inkjet fluids
JP2016041820A (ja) 2015-10-27 2016-03-31 セイコーエプソン株式会社 放射線硬化型インクジェット用インク組成物、インクジェット記録方法
JP2019096442A (ja) 2017-11-21 2019-06-20 ナガセケムテックス株式会社 金属パターンを備える基材の製造方法および金属インク
JP2019102499A (ja) 2017-11-28 2019-06-24 東洋インキＳｃホールディングス株式会社 積層体の製造方法、および積層体

Also Published As

Publication number Publication date
EP4223846A1 (en) 2023-08-09
CN116601246B (zh) 2024-09-17
JPWO2022070593A1 (https=) 2022-04-07
EP4223846A4 (en) 2024-04-03
CN116601246A (zh) 2023-08-15
US20230250307A1 (en) 2023-08-10
WO2022070593A1 (ja) 2022-04-07

Similar Documents

Publication Publication Date Title
JP5409575B2 (ja) 金属膜材料の製造方法、及びそれを用いた金属膜材料
JP5273412B2 (ja) 光硬化型インク組成物、インクジェット記録方法およびインクジェット記録装置
JP7558291B2 (ja) インクセット、積層体、及び、積層体の製造方法
JP2023070947A (ja) 電子デバイスの製造方法、電子デバイス用インク、及びインクセット
WO2017038566A1 (ja) 硬化膜の製造方法
US20250277073A1 (en) Curable composition, laminate, and method for producing laminate
US20240284601A1 (en) Manufacturing method of electronic device
CN118900729A (zh) 导电体的制造方法、电磁波屏蔽体的制造方法、导电体
CN116390858B (zh) 图像记录方法
US20240147630A1 (en) Electronic device and manufacturing method of electronic device
WO2023189328A1 (ja) 積層体の製造方法
WO2023286748A1 (ja) 電子デバイス及び電子デバイスの製造方法
TW202315509A (zh) 電子裝置及電子裝置之製造方法
TW202312419A (zh) 電子元件及其製造方法
WO2024070844A1 (ja) 導電膜の製造方法、電磁波シールド体の製造方法
TW202320596A (zh) 電子裝置及其製造方法
TW202310724A (zh) 電子裝置之製造方法
TW202308500A (zh) 電子裝置及其製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230320

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230320

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240326

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240520

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240827

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240917

R150 Certificate of patent or registration of utility model

Ref document number: 7558291

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150