JP7557352B2 - 基板処理装置および基板処理方法 - Google Patents

基板処理装置および基板処理方法 Download PDF

Info

Publication number
JP7557352B2
JP7557352B2 JP2020197880A JP2020197880A JP7557352B2 JP 7557352 B2 JP7557352 B2 JP 7557352B2 JP 2020197880 A JP2020197880 A JP 2020197880A JP 2020197880 A JP2020197880 A JP 2020197880A JP 7557352 B2 JP7557352 B2 JP 7557352B2
Authority
JP
Japan
Prior art keywords
substrate
processing
support tray
container body
lid portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020197880A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022086069A (ja
JP2022086069A5 (https=
Inventor
周武 墨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2020197880A priority Critical patent/JP7557352B2/ja
Priority to CN202180079981.1A priority patent/CN116529862A/zh
Priority to KR1020237017247A priority patent/KR102692696B1/ko
Priority to PCT/JP2021/043391 priority patent/WO2022114127A1/ja
Priority to TW110144510A priority patent/TWI804076B/zh
Publication of JP2022086069A publication Critical patent/JP2022086069A/ja
Publication of JP2022086069A5 publication Critical patent/JP2022086069A5/ja
Application granted granted Critical
Publication of JP7557352B2 publication Critical patent/JP7557352B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/12—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP2020197880A 2020-11-30 2020-11-30 基板処理装置および基板処理方法 Active JP7557352B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2020197880A JP7557352B2 (ja) 2020-11-30 2020-11-30 基板処理装置および基板処理方法
CN202180079981.1A CN116529862A (zh) 2020-11-30 2021-11-26 基板处理装置及基板处理方法
KR1020237017247A KR102692696B1 (ko) 2020-11-30 2021-11-26 기판 처리 장치 및 기판 처리 방법
PCT/JP2021/043391 WO2022114127A1 (ja) 2020-11-30 2021-11-26 基板処理装置および基板処理方法
TW110144510A TWI804076B (zh) 2020-11-30 2021-11-30 基板處理裝置及基板處理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020197880A JP7557352B2 (ja) 2020-11-30 2020-11-30 基板処理装置および基板処理方法

Publications (3)

Publication Number Publication Date
JP2022086069A JP2022086069A (ja) 2022-06-09
JP2022086069A5 JP2022086069A5 (https=) 2023-05-30
JP7557352B2 true JP7557352B2 (ja) 2024-09-27

Family

ID=81755637

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020197880A Active JP7557352B2 (ja) 2020-11-30 2020-11-30 基板処理装置および基板処理方法

Country Status (5)

Country Link
JP (1) JP7557352B2 (https=)
KR (1) KR102692696B1 (https=)
CN (1) CN116529862A (https=)
TW (1) TWI804076B (https=)
WO (1) WO2022114127A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020127513A (ja) * 2019-02-07 2020-08-27 京楽産業．株式会社 遊技機
JP2020127512A (ja) * 2019-02-07 2020-08-27 京楽産業．株式会社 遊技機

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017157746A (ja) 2016-03-03 2017-09-07 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体
JP2018530919A (ja) 2015-10-04 2018-10-18 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 容積が縮小された処理チャンバ
JP2020170873A (ja) 2016-11-04 2020-10-15 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記録媒体

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6954585B2 (en) * 2002-12-03 2005-10-11 Tokyo Electron Limited Substrate processing method and apparatus
KR20110072353A (ko) * 2009-12-22 2011-06-29 주식회사 아토 기판처리장치의 기판처리방법
JP5471740B2 (ja) * 2010-04-08 2014-04-16 東京エレクトロン株式会社 基板処理装置
JP6015738B2 (ja) 2014-11-25 2016-10-26 東京エレクトロン株式会社 処理装置、処理方法及び記憶媒体
JP6755776B2 (ja) * 2016-11-04 2020-09-16 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記録媒体
JP2018082043A (ja) * 2016-11-16 2018-05-24 東京エレクトロン株式会社 基板処理装置
US10872789B2 (en) * 2017-09-28 2020-12-22 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer cooling system
JP6906416B2 (ja) * 2017-09-29 2021-07-21 東京エレクトロン株式会社 基板処理装置
JP7038524B2 (ja) * 2017-11-14 2022-03-18 東京エレクトロン株式会社 基板処理装置の洗浄装置および洗浄方法
JP7304738B2 (ja) * 2019-05-17 2023-07-07 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7308688B2 (ja) * 2019-08-05 2023-07-14 東京エレクトロン株式会社 基板処理装置および基板乾燥方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018530919A (ja) 2015-10-04 2018-10-18 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 容積が縮小された処理チャンバ
JP2017157746A (ja) 2016-03-03 2017-09-07 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体
JP2020170873A (ja) 2016-11-04 2020-10-15 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記録媒体

Also Published As

Publication number Publication date
CN116529862A (zh) 2023-08-01
JP2022086069A (ja) 2022-06-09
TWI804076B (zh) 2023-06-01
KR102692696B1 (ko) 2024-08-07
TW202236479A (zh) 2022-09-16
KR20230085211A (ko) 2023-06-13
WO2022114127A1 (ja) 2022-06-02

Similar Documents

Publication Publication Date Title
KR101856606B1 (ko) 기판 처리 장치 및 방법
TWI765553B (zh) 基板處理裝置及基板處理方法
JP7288017B2 (ja) 基板処理装置及び方法
KR102859634B1 (ko) 기판 처리 방법
KR101964655B1 (ko) 기판 처리 장치 및 방법
JP7674877B2 (ja) 基板処理方法および基板処理装置
JP7557352B2 (ja) 基板処理装置および基板処理方法
US20230162994A1 (en) Apparatus for treating substrate
JP7370884B2 (ja) 基板処理装置
KR102363730B1 (ko) 기판 처리 장치
US12429283B2 (en) Method and apparatus for treating a substrate
TWI796903B (zh) 基板處理裝置以及基板處理方法
JP7656457B2 (ja) 基板処理装置
KR20240102706A (ko) 기판 처리 장치
US20250006513A1 (en) Substrate processing apparatus and substrate processing method
US20220390172A1 (en) Apparatus for treating substrate
US20240203726A1 (en) Organic solvent supplying apparatus, substrate processing method, and substrate processing apparatus
US20250046597A1 (en) Substrate treating method, substrate manufacturing method, and substrate treating apparatus
US20250379046A1 (en) Substrate treating apparatus

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230522

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230620

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240827

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240913

R150 Certificate of patent or registration of utility model

Ref document number: 7557352

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150