CN116529862A - 基板处理装置及基板处理方法 - Google Patents

基板处理装置及基板处理方法 Download PDF

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Publication number
CN116529862A
CN116529862A CN202180079981.1A CN202180079981A CN116529862A CN 116529862 A CN116529862 A CN 116529862A CN 202180079981 A CN202180079981 A CN 202180079981A CN 116529862 A CN116529862 A CN 116529862A
Authority
CN
China
Prior art keywords
substrate
processing
container body
support tray
processing space
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180079981.1A
Other languages
English (en)
Chinese (zh)
Inventor
墨周武
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Publication of CN116529862A publication Critical patent/CN116529862A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/12—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
CN202180079981.1A 2020-11-30 2021-11-26 基板处理装置及基板处理方法 Pending CN116529862A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-197880 2020-11-30
JP2020197880A JP7557352B2 (ja) 2020-11-30 2020-11-30 基板処理装置および基板処理方法
PCT/JP2021/043391 WO2022114127A1 (ja) 2020-11-30 2021-11-26 基板処理装置および基板処理方法

Publications (1)

Publication Number Publication Date
CN116529862A true CN116529862A (zh) 2023-08-01

Family

ID=81755637

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180079981.1A Pending CN116529862A (zh) 2020-11-30 2021-11-26 基板处理装置及基板处理方法

Country Status (5)

Country Link
JP (1) JP7557352B2 (https=)
KR (1) KR102692696B1 (https=)
CN (1) CN116529862A (https=)
TW (1) TWI804076B (https=)
WO (1) WO2022114127A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020127513A (ja) * 2019-02-07 2020-08-27 京楽産業．株式会社 遊技機
JP2020127512A (ja) * 2019-02-07 2020-08-27 京楽産業．株式会社 遊技機

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040110106A1 (en) * 2002-12-03 2004-06-10 Shori Mokuo Substrate processing method and apparatus
KR20110072353A (ko) * 2009-12-22 2011-06-29 주식회사 아토 기판처리장치의 기판처리방법
US20170256398A1 (en) * 2016-03-03 2017-09-07 Tokyo Electron Limited Substrate processing apparatus, substrate processing method, and storage medium
CN108022861A (zh) * 2016-11-04 2018-05-11 东京毅力科创株式会社 基板处理装置、基板处理方法以及存储介质
CN111952229A (zh) * 2019-05-17 2020-11-17 株式会社斯库林集团 基板处理装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5471740B2 (ja) * 2010-04-08 2014-04-16 東京エレクトロン株式会社 基板処理装置
JP6015738B2 (ja) 2014-11-25 2016-10-26 東京エレクトロン株式会社 処理装置、処理方法及び記憶媒体
KR102055712B1 (ko) * 2015-10-04 2019-12-13 어플라이드 머티어리얼스, 인코포레이티드 감소된 용적의 처리 챔버
JP6922048B2 (ja) 2016-11-04 2021-08-18 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記録媒体
JP2018082043A (ja) * 2016-11-16 2018-05-24 東京エレクトロン株式会社 基板処理装置
US10872789B2 (en) * 2017-09-28 2020-12-22 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer cooling system
JP6906416B2 (ja) * 2017-09-29 2021-07-21 東京エレクトロン株式会社 基板処理装置
JP7038524B2 (ja) * 2017-11-14 2022-03-18 東京エレクトロン株式会社 基板処理装置の洗浄装置および洗浄方法
JP7308688B2 (ja) * 2019-08-05 2023-07-14 東京エレクトロン株式会社 基板処理装置および基板乾燥方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040110106A1 (en) * 2002-12-03 2004-06-10 Shori Mokuo Substrate processing method and apparatus
KR20110072353A (ko) * 2009-12-22 2011-06-29 주식회사 아토 기판처리장치의 기판처리방법
US20170256398A1 (en) * 2016-03-03 2017-09-07 Tokyo Electron Limited Substrate processing apparatus, substrate processing method, and storage medium
CN108022861A (zh) * 2016-11-04 2018-05-11 东京毅力科创株式会社 基板处理装置、基板处理方法以及存储介质
CN111952229A (zh) * 2019-05-17 2020-11-17 株式会社斯库林集团 基板处理装置

Also Published As

Publication number Publication date
JP2022086069A (ja) 2022-06-09
TWI804076B (zh) 2023-06-01
KR102692696B1 (ko) 2024-08-07
TW202236479A (zh) 2022-09-16
KR20230085211A (ko) 2023-06-13
WO2022114127A1 (ja) 2022-06-02
JP7557352B2 (ja) 2024-09-27

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